• Advances in materials Research
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• v.6 no.3
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• pp.245-255
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• 2017

High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

• The korean journal of orthodontics
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• v.48 no.4
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• pp.245-252
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• 2018

Objective: We aimed to perform in-vitro evaluation to compare 1) shear bond strength (SBS), adhesive remnant index (ARI), and color change between self-etched and acid-etched primers; 2) the SBS, ARI and color change between direct and indirect bonding; and 3) the enamel roughness (ER) between 12-blade bur and aluminum oxide polisher debonding methods. Methods: Seventy bovine incisors were distributed in seven groups: control (no bonding), direct (DTBX), and 5 indirect bonding (ITBX, IZ350, ISONDHI, ISEP, and ITBXp). Transbond XT Primer was used in the DTBX, ITBX, and ITBXp groups, flow resin Z350 in the IZ350 group, Sondhi in the ISONDHI group, and SEP primer in the ISEP group. SBS, ARI, and ER were evaluated. The adhesive remnant was removed using a low-speed tungsten bur in all groups except the ITBXp, in which an aluminum oxide polisher was used. After coffee staining, color evaluations were performed using a spectrophotometer immediately after staining and prior to bonding. Results: ISONDHI and ISEP showed significantly lower SBS (p < 0.01). DTBX had a greater number of teeth with all the adhesive on the enamel (70%), compared with the indirect bonding groups (0-30%). The ER in the ITBX and ITBXp groups was found to be greater because of both clean-up techniques used. Conclusions: Direct and indirect bonding have similar results and all the primers used show satisfactory adhesion strength. Use of burs and polishers increases the ER, but polishers ensure greater integrity of the initial roughness. Resin tags do not change the color of the teeth.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.349-352
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• 1988

In this study, a structured supervisory control for automatic assembly system is developed. And also diagnosis and fault-recovery capability of this supervisory control are discussed. This structured supervisory control is actually applied to Die Bonding Machine and is proved to be useful and to work well.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.181-184
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• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• The Journal of Korean Academy of Prosthodontics
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• v.25 no.1
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• pp.317-325
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• 1987

A study on the shear bonding strength between dental alloy and porcelain according to various kidns of sputtered metallic thin films was established by Ingtron universal testing machine, and the change of the elemental weight % at the surface of dental alloy was studied by E.D.S. The kind of metallic thin films were Al, Ni, In, Cr. Ti and Sn with $0.3{\mu}m$ thickness. The dental alloys were Verabond made by Aalba Dent. Co. and Degudent H manufactured by Degussa Co. The control groups were Verabond and Degudent H. The obtained results were as follows; 1. The shear bonding strength of Al plated sample was the strongest of all. 2. The shear bonding strength of Ni plated sample was stronger than that of Degudent H, Sn plated samples. 3. The shear bonding strength of Verabond was weaker than that of Al, Ni, In, Cr, plated samples. 4. After degassing, it is more weight % of Ni at the alloy surface of the Ni sputtered specimen than the Sn sputtered sample.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.124-134
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• 1994

The shade of restorative materials is very important for successful restoration esthetically harmonized with the natural tooth. The purpose of this study was to evaluate the color stability and the opacity change of conventional chemical setting and visible light curing glass-ionomer cements for restorative esthetic filling. Specimens of each brand (GC Fuji II and Fuji II LC) were uniformly prepared and divided into three groups: In group l(control group), the specimens received no surface treatment; in group 2, the specimens were coated with varnish and the excess gently blown off; and in group 3. the specimens were coated with light-cured bonding resin and irradiated by a visible light curing unit for 20 seconds on both sides. All specimens were stored in distilled water at $37^{\circ}C$ and checked after for 24 hours. 2 months. 4 months, 6 months. and 8 months. The color characteristics($L^*,\;a^*,\;b^*$) and the opacity(Y%) of all the samples were measured by a spectrocolorimeter and the total color differences(${\Delta}E^*$) and opacity changes(${\Delta}Y%$) were computed. The following results were obtained : 1. The total tolor differences in all groups increased with time. 2. The total color differences of the LC groups after immersion for 8 months in distilled water at $37^{\circ}C$ were lower than those of GC groups(p<0.01), and the total color differences of the varnish or the light-cured bonding resin coated groups were lower than those of the control group with glass-ionomer cements which had no surface treatment(p<0.01). 3. In all groups the translucency decreased with time. 4. In the control group and the varnish coating group. the opacity changes of the GC groups were lower than those of the LC groups(p<0.01) and in the light-cured bonding resin coated group, there was no significant difference between the GC group and the LC group. 5. The opacity changes of the varnish or the light-cured bonding resin coated groups were lower than those of the control group(p<0.01). These results suggest that color change and opacity of conventional chemical setting and light cured glass-ionomer cement were increased with time, and the color changes and the opacity changes of a control group after immersion for 8 months in distilled water at $37^{\circ}C$ were greater than those of the varnish or the light-cured bonding resin coated groups.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.261-274
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• 1995

This study aimed to evaluate the marginal microleakage of Class V cavities of All-bond 2 (Wet - bonding system), Gluma (Adhesion of resin to exposed collagen fibers), and Scotchbond Multi-purpose(Mild Etching System). Hundred extracted human teeth divided into a control and three experimental groups consisting of eight teeth. The experimental group was further subdivided into All- bond2, Gluma and Scotchbond MP groups, Vitrebond served as the control. The positive control group consisted of specimens filled with resin and with no etching, primer and bonding procesure. Polished specimens underwent temperature changed from $5^{\circ}C$ to $55^{\circ}C$ a thousand times. After thermocycling, speciemens were placed in 2 % methylene blue dye solution for 24 hours in an incubator set at $37^{\circ}C$. The teeth were sectioned buccolingually and the degree of dye penetration was observed with a stereomicroscoped(*20). The following results were obtained. 1. Both the control and the experimental group showed a lower degree of dye penetration on enamel than on dentin margins(p<0.05) 2. Gluma exhibited a statistically significant lower degree of dye penetration than All-bond 2 on enamel margins(p<0.05) Scotchbond MP also exhibited a lower degree of dye penetration than All-bone 2 but was no statistically significant. Gluma and Scotchbond MP exhibited a similar degree of dye penetration. 3. The degree of dye penetration of All-bond 2, Gluma and Scotch bond MP showed no statistically singnificance on enamel margins but was significantly lower than in the control using Vitrebond. 4. All-bond 2 exhibited a statistically significant lower degree of dye penetration than Gluma on dentin margins. All- bond 2 and Scotchbond MP showed a similar degree of dye penetration. 5. The degree of dye penetration of All-bond 2, Gluma and Scotchbond MP showed no statistically significance on dentin margins. There was neither a statistical significance with the control.

• Restorative Dentistry and Endodontics
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• v.10 no.1
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• pp.153-160
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• 1984

The purpose of this study was to observe the tensile and bonding strength of the joined amalgam restoration. Amalgam alloys of fine-cut (F-type), spherical (S-type), and dispersed type (D-type) were selected in this study, and all specimens were divided into three groups according to the condensation methods as follows. Group I : the control group which condense the same kinds of mixed amalgam into the whole part of the mold respectively. Group II : the group which condense a mix of amalgam into one half of the mold, and then condense a new mix of amalgam into the rest half of the mold 15 minutes later. Group III : the group which condense a mixed amalgam into one half of the mold, and then condense a new mix of amalgam into the rest half of the mold 7 days later. All specimens were stored in incubator at $37{\pm}1^{\circ}C$ for seven days with immersing in saline solution before testing. The tensile and bonding strength of them were measured with Instron Universal Testing machine. The results were as follows: 1. In Group I, the order of tensile strength was F-type, S-type, and D-type. 2. In case of bonding of S-type + S-type, the difference of the bonding strength between Group II and III was not significant. (P> 0.05) 3. The bonding strength of F-type + S-type of Group II was marked the highest in value, and the lowest bonding strength was showed in bonded D-type + D-type of Group III. 4. In case of bonding with the different kinds of amalgam alloy in Group II, the specimen bonded to F-type was marked the highest bonding strength, and the specimen bonded with F-type was marked the lowest one. In Group II, the bonding strength of the specimens bonded with the same kinds of amalgam alloy was presented as the same order as that of Group I. 5. In Group III, the specimen connected with D-type marked the lowest bonding strength of all specimens. In Group III, the bonding strength of the specimens connected with the same kinds of amalgam alloy was the order of S-type + S-type, F-type + F-type, and D-type + D-type.