• Applied Chemistry for Engineering
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• v.2 no.3
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• pp.193-198
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• 1991

Thick film copper conductors are of considerable interest in thick film industries because of both the potential cost saving compared to the noble metal conductors and the favorable properties in electrical conductivity, solderability, solder leach resistance and wire bondability, However, formation of the excellent copper thick film is a lot complicated due to easily oxidizing property of copper at high temperature. In order to get favorable thick film copper conductor, hybrid microcircuit industry utilizes majorly three kinds of firing atmosphere, such as nitrogen atmosphere, reactive atmosphere and air atmosphere. The processes and the three atmospheres for firing thick film copper conductor were extensively reviewed in this article.

• Journal of Welding and Joining
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• v.16 no.5
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• pp.100-107
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• 1998

This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

• Journal of Welding and Joining
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• v.14 no.3
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• pp.86-92
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• 1996

This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.72-77
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• 2007

This study deals with characterizations of microstructure and wear performance of a cladding layer, product on 1.9 mm-thick mild steel plate by the electric resistance welding, of composite metal powder of Coarse WC-6.5%Co and high carbon alloy (SHA). The cladding layer was examined and tested for microstructural features, chemical composition, hardness, and bondability. The cladding layer have two different matrix were observed by an optical microscope and EPMA. The one was the coarse WC-6.5Co structure. The other was the melted SHA with surrounding the WC-6.5Co structure. The hardness of WC-6.5Co was 1210HV. The hardness of SHA was 640HV.

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• Transactions on Electrical and Electronic Materials
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• v.2 no.4
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• pp.7-10
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• 2001

A new possibility of our atmospheric cold plasma torch has been examined on the surface treatment of an air-exposed vulcanized rubber compound. The plasma treatment effect was evaluated by the bondability with another rubber compound using a polyurethane adhesive. The adhesion property was improved by the treatment with plasma containing oxygen radicals. The oxygen radical generation from the plasma was verified and its efficiency was found to be dependent on the cathode material.

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.574-574
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• 2003

I. Objectives Newly all-in-one adhesives were developed for reducing the techique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage. The object of this study was to measure micro leakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively. II. Materials and Methods After making Class V cavities, they were bulk filled with Heliomolar(＃A1) after surface treatment with three adhesives：Adper Prompt (Group 1), One up bond F (Group 2), Xeno III(Group 3).(omitted)

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• Proceedings of the KAIS Fall Conference
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• 2006.11a
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• pp.162-166
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• 2006

기존의 Ni PPF를 대신하여 새롭게 Cu-Sn 합금을 barrier층으로 적용한 PPF를 제조하여, 그 제반 특성들을 조사하였다. Cu-Sn 합금도금층은 기존의 Ni PPF와 마찬가지로 반도체 substrate로서 지녀야 할 열적 안정성을 충분히 확보할 수 있음을 알 수 있었다. 또한 기지층 및 보호층과의 계면간 밀착성이 Ni PPF보다 더 우수했으며, 미세한 결정립들이 균일하게 분포한 도금층 구조를 나타내어, 이들이 Ni PPF보다 구조적으로 더욱 안정할 것임을 예상할 수 있었다. 한편 강자성 거동을 보이는 Ni PPF와는 달리 Cu-Sn PPF는 완벽한 상자성 특성을 보여, 점차 고집적, 고밀도화 되어가는 반도체 패키지의 동작중 발생할 발열 및 신호간섭의 위험이 원천적으로 제거될 수 있음을 보였으며, solderability, bondability 등의 field 특성 또한 Ni PPF와 거의 비슷함을 알 수 있었다.

• Restorative Dentistry and Endodontics
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• v.29 no.1
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• pp.66-72
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• 2004

All-in-one adhesives were recently developed for reducing the technique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage. The object of this study was to evaluate microleakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively. After making Class V cavities, they were bulk filled with Heliomolar(#A1 after surface treatment with three adhesives: Adper Prompt (Group A), One up bond F (Group O), Xeno III (Group X) Electrical conductivity (microamphere, ${\mu}A$) was checked two times: before and after cavity filling. Percentage of leaky margin was estimated from SEM image (${\times}1,000$). The data were statistically analysed: ANOVA and Paired T test for electrical conductivity, Kruskal-Wallis and Mann-Whitney test for marginal quality, Spearman s rho test for checking of relationships between 2 methods. The result were as follows: 1. There was no difference in microleakage between adhesive systems and every specimen showed some of microleakage after filling. 2. Microleakage was reduced about 70% with composite resin filling. 3. Marginal quality was the best in group A. decreasing among groups in the following order: group O, followed by group X. There were significant differences between group A and group X (p=0.015), and between group 0 and group X (p=0.019). 4. There was no relationship between the microleakage measured by electrochemical method and marginal quality measured by SEM analysis. Within the results of this study, there was no difference in microleakage among groups by electrical conductivity. However, significant difference in marginal quality was seen among groups. It was believed that these dissimilar results might be induced because of their own characteristics. Analysis of microleakage needs various methods for accuracy.