• Korea-Australia Rheology Journal
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• 제18권1호
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• pp.1-8
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• 2006

Blend of bisphenol-A polycarbonate (PC) and (acrylonitrile-styrene-acrylic rubber) terpolymer (ASA) having excellent balance in the interfacial properties and mechanical strength was developed for the automobile applications. Since interfacial adhesion between PC and styrne-acrylonitrile copolymer (SAN) matrix of ASA is not strong enough, two different types of compatibilizers, i.e, diblock copolymer composed of tetramethyl polycarbonate (TMPC) and SAN (TMPC-b-SAN) and poly(methyl methacrylate) (PMMA) were examined to improve interfacial adhesion between PC and SAN. TMPC-b-SAN was more effective than PMMA in increasing interfacial adhesion between PC and SAN matrix of ASA (or weld-line strength of PC/ASA blend). When blend composition was fixed, PC/ASA blends exhibited similar mechanical properties except impact strength and weld-line strength. Impact strength of PCI ASA blend at low temperature was influenced by rubber particle size and its morphology. PC/ASA blends containing commercially available PMMA as compatibilizer also exhibited excellent balance in mechanical properties and interfacial adhesion.

• 대한생식의학회:학술대회논문집
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• 대한불임학회 2005년도 제48차 춘계 학술대회
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• pp.131-132
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• 2005

• Journal of Advanced Marine Engineering and Technology
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• 제8권2호
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• pp.81-87
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• 1984

The effect of heat treatment and mechanical stress on the dielectic strength of epoxy resin film is studied. The film with 30-210 .mu.m thickness are casted at room temperature for 8 hours and post cured at the range of temperature 60-180 .deg. C, and the heat setting time are two kind, ie, 2 and 10 hours. The samples are made with Stycast 1266 that the primary compound is diglycidyl ether of bisphenol A, and the hardner is denaturated polyamines. Under no mechanical stresses, the maximum dielectric strength of the sample is obtained for the sample heat treated for 2 hours at 150 .deg. C. However, the best dielectric strength characteristics under compressive stress is obtained for the sample heat treated at 90 .deg. C and 120 .deg. C. The dielectric strength of the sample are also affected significantly by the cooling velocity of the sample after post heat setting at given temperature.

• 한국지하수토양환경학회:학술대회논문집
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• 한국지하수토양환경학회 2005년도 총회 및 춘계학술발표회
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• pp.117-121
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• 2005

In order to monitor the levels and seasonal variations of EDCs, samples of the discharged effluent from sewage & wastewater treatment plants and river waters were collected. The target EDCs including bisphenol A and alkylphenols were determined by Laser-induced fluorescence(LIF) as in-situ monitoring technique. The category of EDCs showed similar fluorescence spectra and nearly equal decay time. This point makes it hard to distinguish each EBCs from the EDCs mixture by LIF and LIF results were expressed only by the total EDCs. However, LIF monitoring results and GC-MS results was comparable. The correlation coefficient between EDCs concentration acquired from GC-MS and fluorescence intensity from LIF was significant. This study supports the feasibility of the application of LIF into EDCs monitoring In aquatic system.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 정기총회 및 창립40주년기념 학술대회 학회본부
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• pp.499-503
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• 1987

The electrical characteristics of Epoxy Robin vary with temperature. In this study, the variation of the electric characteristics of Epoxy Resin with various hardening temperature was studied. Epoxy Resin used as samples are Epotohto YD-128 of Diglycidyl Ether of Bisphenol A (DGEBA) series and hardener, Goodmide G-240. It's mixing rate is 3 to 1. Hardening temperature was varied from 25[$^{\circ}C$] to 50[$^{\circ}C$] by 5[$^{\circ}C$]. During the hardening progress, illumination, resistivity and the internal temperature of material which were dependet on the variety of hardening temperature were measured. The electrical properties of hardened samples were examined by means of X-ray diffraction, tan $\delta$ test, TG-DTA analysis and treeing test. On this basis, optimal hardening temperature in insulation characteristics was examined.

• 한국재료학회지
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• 제5권5호
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• pp.606-610
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• 1995

Diglycidyll ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA)계에 반응성 첨가제 malononitrile(MN)을 첨가하면 내충격성은 크게 향상되나 반응속도는 감소하게 된다. 에폭시 수지의 경화반응은 에폭시기가 개환되어 생성되는 히드록시기가 촉매로 작용하는 자촉매 반응이며, 외부에서도입된 히드록시기도 같은 효과를 나타낸다. 따라서 본 연구에서는 DGEBA/MDA/MN 계의경화 반응속도를 증가시키기 위해 히드록시기를 가진 촉매로서 hydroquinone(HQ)을 도입하였고 이들 계의경화특성 및 열적성질을 고찰하였다. HQ가 첨가됨으로 인해 활성화 에너지는 감속하고 속도상수는 증가하였으며, 발열곡선에서 반응 시작온도가 낮아졌다. 이 결과로부터 HQ가 반응 가속제로 작용하고 있음을 알 수 있다.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.23-26
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• 2012

The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.

• 한국재료학회지
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• 제6권6호
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• pp.644-650
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• 1996

Diglycidy1 ether of bisphenol A (DGEBA)/4,4'-methylene dianiline(MDA)계의 경화반응 속도에 미치는 pheny1 glycidy1 ether (PGE)-acetamide(AcAm)의 영향을 연구하였다. 반응성 첨가제로 사용된 PGE-AcAm는 PGE와 acetamide를 2:1의 몰 비로 혼합한 후 18$0^{\circ}C$에서 1시간 반응시켜서 합성하였으며, PGE의 에폭사이드기와 AcAm의 아민기가 반응함으로써 수산기를 형성함에 의해 진행되었다. 이 때 생성된 수산기는 DGEBA와 MDA의 반응에서 촉매로 작용하여 반응속도를 크게 활성화 에너지는 11.11 Kcal/mol이었고, 30 phr의 PGE-AcAm이 첨가된 계의 활성화 에너지는 7.91Kcal/mol이었다.

• 한국발생생물학회:학술대회논문집
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• 한국발생생물학회 2002년도 전기 제14차 학술대회 논문집
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• pp.49-49
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• 2002

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.311-312
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• 2007

In this study, composite $BaSrTiO_3$ has been studied for high frequency device applications. Composite $Ba_{0.5}Sr_{0.5}TiO_3$ has high dielectric permittivity and low loss tangent at the relative frequency range from MHz to GHz. 10,30 and 50 wt% of epoxy doped $Ba_{0.5}Sr_{0.5}TiO_3$ powders were prepared with bisphenol A and F polymer employing ball milling process. Epoxy/($BaSrTiO_3$) composites thick films were screen printed on the Cu plated PCB substrates through screen printing methods. The specimens were designed for the embedded capacitor applications. Temperature dependent dielectric permittivity of Epoxy doped $BaSrTiO_3$ ceramics was measured.