• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.292-295
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• 2002

In this work, transient characteristics of NPT(Non Punch Through)-IGBT(Insulated Gate Bipolar Transistor) have been studied with different temperatures analytically. Power losses are caused by heat generated in MIT-IGBT for steady state and transient state conditions. We therefore have focused on the analysis of excess carrier concentration and excess charge injected into N-drift layer with different temperatures and have obtained anode voltage drop during turn-off with lifetime of 2.4[${\mu}$s].

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.26-29
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• 2008

In the fields of electronics and displays where inkjet printing has demonstrated its capability to fabricate colorant subpixels of thin film transistor liquid crystal(TFT LCD) color filters and organic light emitting diode (OLED) displays, conducting tracks and TFTs, the production of satellite droplets is one of primary things to eliminate because they generally deteriorate the pattern quality. To understand the production mechanism of satellite droplets in this paper, driving waveforms such as monopolar and bipolar were employed and the influence of the pulse duration time were investigated in both experimental and numerical aspects.

• Electrical & Electronic Materials
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• v.12 no.9
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• pp.57-63
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• 1999

SOI 구조의 MOSFET은 제조공정이 상대적으로 간단하며 CMOS 래치 업 현상이 일어나지 않고, soft error에 의한 회로의 오동작 가능성이 매우 낮은 이외에도 낮은 기생 정전용량 및 누설전류 특성을 가지므로 0.1 미크론 이하의 소자를 제작하는데 적합하여 저전압, 초고속 VLSI 설계에 적합한 소자로 각광받고 있다. 본고에서는 새로운 구조의 SOI MOSFET 구조들의 특성과 장, 단점을 검토하고 나아가 BJT(Bipolar Junction Transistor) 및 기타 소자들을 SOI 구조로 제작한 결과에 대해 간단히 검토함으로써 1999년 현재 SOI 기술의 현황을 소개하고자 한다.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.57-58
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• 2006

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys and thermal distributions form experiments.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.12
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• pp.2001-2009
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• 1989

This study suggests the use of fuzzy model in the semiconductor devices modeling as a black box approach. When membership functions of fuzzy sets used in a fuzzy model are simple piecewise-linear functions, the fuzzy model can be reresented in a simple equation. To show that the fuzzy model can be very realistic and simple when used in semiconductor devices modeling, we construct fuzzy models for bipolar transistor, MOSFET and GaAs FET, and compare those with canonical piecewise-linear models.

• The Magazine of the IEIE
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• v.19 no.5
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• pp.1-15
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• 1992

기억소자의 발달은 진공관식 기억소자로부터 cathode ray tube식 기억소자, magnetic core 기억소자를 거쳐 monolitic 반도체 기억소자로 이어진다. 반도체 기억소자는 planar bipolar transistor를 이용한 기억소자가 처음 소개 되었으나, 고집적 기억소자의 기초를 마련한 것은 MOS DRAM의 효시인 Intel의 1Kb DRAM(1971년)인 것이다. 약 20년 후인 1990년에는 4M DRAM의 양산과 16M DRAM의 개발 완료가 이룩되었으며, 이는 약 10만배의 집적도의 증가를 의미한다. 여기서 우리는 DRAM의 발전과정을 공정, 설계, 제품의 기술적 측면과 전략적 측면에서 고찰하고 앞으로의 전망을 예측해 보고자 한다.

• Electrical & Electronic Materials
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• v.6 no.3
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• pp.261-268
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• 1993

LIGBT의 전압-전류 특성을 디자인 파라미터와 공정 파라미터를 포함한 SPICE Simulation으로 확인하였다. 중요한 파라미터는 p-body와 n$^{-}$층 그리고 p$^{+}$ 애노드로 구성된 pnp bipolar transistor의 수평전류이득이었다. 이 전류 이득은 Ebers-Moll등식으로 얻었다. LIGBT의 On 저항은 채절 저항(R$_{E}$ )과 인가된 게이트 전압에 종속되는 유효 벌크 저항(R2)으로 구성되며 On 저항의 해석과 모델링은 디바이스의 디자인 조건을 최적화하기 위해서 기하학적 구조와 도핑 프로파일에 따른 물리적 특성으로부터 전개하여 특성해석을 위한 모델링을 실시하여 제시하였다.

• Journal of the Korean Vacuum Society
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• v.14 no.1
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• pp.29-34
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• 2005

The degradation of the SiGe hetero-junction bipolar transistor(HBT) properties in SiGe BiCMOS process was investigated in this paper. The SiGe HBT prepaired by SiGe BiCMOS process, unlike the conventional one, showed the degraded DC characteristics such as the decreased Early voltage, the decreased collector-emitter breakdown voltage, and the highly increased base leakage current. Also, the cutoff frequency(f/sub T/) and the maximum oscillation frequency(f/sub max/) representing the AC characteristics are reduced to below 50%. These deteriorations are originated from the change of the locations of emitter-base and collector-base junctions, which is induced by the variation of the doping profile of boron in the SiGe base due to the high-temperature source-drain annealing. In the result, the junctions pushed out of SiGe region caused the parastic barrier formation and the current gain decrease on the SiGe HBT device.

• Journal of IKEEE
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• v.12 no.2
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• pp.110-117
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• 2008

This paper presents a new Insulated Gate Bipolar Transistor(IGBT) based on Non Punch Through(NPT) IGBT structure for power switching device. The proposed structure has adding N+ beside the P-base region of the conventional IGBT structure. The added n+ diffusion of the proposed device ensure device has faster turn-off time and lower forward conduction loss than the conventional IGBT structure. But, added n+ region can reduce th breakdown voltage and latching current density of the proposed device due to its high doping concentration. This problems can be overcome by using diverter on the right side of the device. In the simulation results, turn-off time of the proposed device is 0.3us and the on-state voltage drop is 3V. The results show that the proposed device has superior characteristic than conventional structure.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.194-200
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• 2012

In this paper, we proposed a SPICE model of high-voltage insulated gate bipolar transistor(IGBT). The proposed model consists of two sub-devices, a MOSFET and a BJT. Basic I-V characteristics and their temperature dependency were realized by adjusting various parameters of the MOSFET and the BJT. To model nonlinear parasitic capacitances such as a reverse-transfer capacitance, multiple junction diodes, ideal voltage and current amplifiers, a voltage-controlled resistor, and passive devices were added in the model. The accuracy of the proposed model was verified by comparing the simulation results with the experimental results of a 1200V trench gate IGBT.