• Journal of Surface Science and Engineering
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• v.47 no.1
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• Membrane Journal
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• v.18 no.4
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• pp.317-324
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• 2008

Polysulfone membranes were prepared via the phase inversion process. With propionic acid as a nonsolvent additive, polysulfone casting solutions were solidified in an isopropanol bath. Propionic acid (PA) worked as a thermodynamic enhancer for phase separation and as a rheological suppressor for kinetic hindrance. Morphology of the prepared membranes significantly varied with propionic acid content in the casting solution. The dense skin layer, which was identified in the membrane prepared without PA, almost disappeared in the membrane prepared trom PA 10wt%. With 30wt% PA, the membrane revealed the morphological gradient from a nodular skin structure to a sponge-like substructure, including the finger-like cavity. Water permeability increased with PA content, and polyethylene glycol rejection decreased with the nonsolvent content.

• Journal of Surface Science and Engineering
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• v.51 no.1
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• pp.62-70
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• 2018

Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of $5{\sim}30mA/cm^2$ current density. Maximum compressive stress was observed at the current density of $10mA/cm^2$. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of $5{\sim}30mA/cm^2$ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.12
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• pp.1071-1077
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• 2002

Ice adhesion on cooling wall is very important in continuous ice formation. The purpose of the present study is to investigate the possibilities of a three-component aqueous solution as a thermal storage material for the continuous ice formation. By freezing under stirring the solution of 300 mL in a stainless steel vessel which was immersed and cooled in a temperature controlled bath, an ice slurry was formed experimentally with measuring the temperature and stirring load variation. From the experiment, the ice adhesion was suppressed when the supercooling degree decreased and the concentration of aqueous solution increased.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.12
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• pp.1063-1070
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• 2002

To resist ice adhesion on cooling wall is concerned to continuous ice formation in thermal storage system. In this study, ice slurries were formed with two ecological aqueous solution, one is ethanol+silanol and the other is propylene glycol+silanol. By freezing under stirring the solution of $300m\ell$ in a stainless steel vessel which was immersed and cooled in a temperature controlled bath, the shape of ice slurry and the strength of ice adhesion on wall was observed with measuring the temperature and stirring load variation. As the concentration is smaller and the supercooling degree is larger, the ice adhesion is easy to occur. When the stirring load is larger than$ 2.1\times10^{-5}W$, the ice adhesion occurred.

• Journal of Surface Science and Engineering
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• v.39 no.3
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• pp.115-120
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• 2006

The codeposition behavior of WC particles from an additive-free nickel sulfate and sulfamate solution has been investigated. Electroplating of Ni/WC composites was carried out at different current density with variation of WC particle size. The Guglielmi adsorption mechanism is applied to the electroplating of the fine WC in Ni matrix. The contents of WC in Ni composite coating were increased both by increasing current density and WC concentration in the bath. The hardness of Ni/WC composite coating at low current density is higher than that at high current density since finer WC particles dispersed through the coating. The codeposition behaviors of Co coated WC particles were also investigated. Conducting layer of particles promoted the codeposition behavior of Ni/WC-Co composite coatings.

• Journal of Surface Science and Engineering
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• v.30 no.5
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• pp.320-332
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• 1997

The development of colored surface on zinc coating by the oxidation of a melten alloy of zinc with a minor amount of oxygen-avid additive such as tianium has been studied. Using a galvanizing Zinc alloy containing 0.1 to 0.3wt%Ti, gold, purple or blue color was developed clearly and stably, depending upon the extent of oxidation, by air cooling after hot dipping in a bath at temperature of $550^{\circ}C$ to $600^{\circ}C$. The source of the color is light interference with surface oxide layer. THe final color depends on the thickness of the color depends on the thickness of $TiO_2$, played So compositing, temperature and time at elevated temperature after are all controlling variables. Since oxidation film such as $TiO_2$ played role of passivation film, the corrosion resistance in a colored galvanized steel sheet. It is also thought that surface oxide layer of $TiO_2$ inhibited dissolution of the coating layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.625-628
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• 1999

Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

• Journal of Surface Science and Engineering
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• v.37 no.1
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• pp.28-39
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• 2004

The effect of trace metallic additives on microstructure, surface appearance and hardness of zinc electrodeposits was investigated by using sulfate bath and flow cell system. The preferred orientation of Zn deposit with Fe additive was (103)(104)+(002) mixed texture and that of Zn deposits with both Fe-Ni and Fe-Co additives was (10 1), while Zn deposits with Fe-Cr additives had (002) preferred orientation. The surface morphology of the zinc deposits was closely related to the preferred orientation of the deposits. The glossiness of Zn deposit with Fe-Ni additives was higher than that of pure Zn deposit, while the glossiness of Zn deposits with both Fe-Co and Fe-Cr additives was lower than that of pure Zn deposit. The hardness of Zn deposits with both Fe-Ni and Fe-Co additives was noticeably higher than that of Zn-Fe deposit, while that of Zn deposit with Fe-Cr additives was similar to that of Zn-Fe deposit.

• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.7-16
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• 2015

Effects of chemical composition ($Cu^{2+}$, $K_4P_2O_7$ and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing $Cu^{2+}$ concentrations from 0.02 to 0.3M. Decrease of current efficiency was observed in the range of 1.5~1.8M $K_4P_2O_7$ concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3M and 2.1~2.4M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M $Cu^{2+}$ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120MPa was observed at 0.25M $Cu^{2+}$ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as $K_4P_2O_7$ concentration varied from 0.9 to 2.4M and but The change of additive concentration did not affected on residual stress. $Cu^{2+}$ and $K_4P_2O_7$ concentrations significantly affect on surface morphology of electrodeposited Cu thin films, but additive concentration slightly affected. From XRD analysis, the microstructures of electrodeposited Cu thin film was affected from the changes of $Cu^{2+}$ and $K_4P_2O_7$ concentrations, but not from that of additive concentration. Strong preferred orientation of (111) peak was observed with increasing $Cu^{2+}$ and $K_4P_2O_7$ concentrations.