• 제목/요약/키워드: barrel plating

검색결과 12건 처리시간 0.03초

개인화기 총열 표면처리 및 시험에 관한 연구 (Study on Surface Treatment and Test over the Barrel of Small Arms)

  • 채제욱;김인우;이영신
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 춘계학술대회
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    • pp.722-727
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    • 2004
  • This paper includes the comparative study between Cr plating and nitriding process with an aim at improving corrosion, wear and maintainability for KNR(Korean Next Generation Rifle) 5.56mm barrel. The endurance test was conducted to compare the performance of standard barrel, Cr plating barrel and nitriding barrel. Main activities are described as follows; optimal Cr plating and nitriding process set-up for KNR 5.56mm barrel; durability test of each barrel(20,000 rounds); salt water immersion test; dispersion, initial velocity, inner diameter data acquisition. According to the results of this firing test, Cr plating barrel is superior to standard barrel and nitriding barrel in view of corrosion, wear and maintainability

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소구경 총열 표면처리에 관한 연구 (Study on Surface Treatment over the Barrel of Small Arms)

  • 채제욱;김인우;이영신
    • 한국군사과학기술학회지
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    • 제7권1호
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    • pp.5-12
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    • 2004
  • This paper includes the comparative study between Cr plating and nitriding process with an aim at improving corrosion, wear and maintainability for KNR(Korean Next Generation Rifle) 5.5mm barrel. The endurance test was conducted to compare the performance of standard barrel, Cr plating barrel and nitriding barrel. Main activities are described as follows; optimal Cr plating and nitriding process set-up for KNR 5.56mm barrel; durability test of each barrel(20,000 rounds); salt water immersion test; dispersion, initial velocity, inner diameter data acquisition. According to the results of this firing test, Cr plating barrel is superior to standard barrel and nitriding barrel in view of corrosion, wear and maintainability.

소구경화기 총열의 크롬도금 손실방지를 위한 질화 영향 사례연구 (A CASE STUDY ON THE EFFECT OF NITRIDING FOR CHROME-PLATING LOSS OF SMALL ARMS BARREL)

  • 신재원;신태성;최시영;정상후;김병규;권혁린
    • 품질경영학회지
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    • 제45권3호
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    • pp.327-333
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    • 2017
  • Purpose: The purpose of this study is to research to protect to loss of chrome-plating of small arms barrel on high temperature in order to extend its life expectency. Methods: The reason why chrome-plating dropped out is main material is weak from heat. Therfore, to make barrel of small arms have higher heat-resistant property, nitriding for barrel before chrome-plating is needed and test of that barrel was handled to improve it. Results: Nitriding before chrome-plating is useful to protect to chrome-plating loss on high temperature. Conclusion: To protect loss of chome-plating of small arms barrel during on firing, pre-nitriding on barrel is effective finally it leads to extend to barrel's life expectency.

The Effect of Barrel Vibration Intensity to the Plating Thickness Distribution

  • Lee, Jun-Ho;Roselle D. Llido
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 1999년도 추계학술발표회 초록집
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    • pp.15-15
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    • 1999
  • In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

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Electroplating process for the chip component external electrode

  • Lee, Jun-Ho
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2000년도 추계학술발표회 초록집
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    • pp.1-2
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    • 2000
  • In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

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바렐도금에 미치는 공정변수의 영향 (Influence of Process Variables on Barrel Electroplating)

  • 최태규;유황룡;장시성;황운석
    • 한국표면공학회지
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    • 제35권5호
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    • pp.295-304
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    • 2002
  • In this study, the effect of the diameter and the number of barrel hole on the total area of barrel hole were calculated and analyzed. And the effects of applied current density, rotational speed of the barrel, size and number of barrel hole, and the volume of plating materials on the distribution of plating thickness were experimented and discussed by the barrel electroplating of the tube type brass specimens in a sulfamate nickel barrel solution. The effect of barrel hole size and barrel hole area on the throwing power was also discussed.

Metal Deposit Distribution in Barrel Plating of Partially Conductive Load

  • 이완구
    • 기술사
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    • 제16권3호
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    • pp.68-73
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    • 1983
  • IC전자부품 중 DIP계 종류를 바렐을 사용하여 주석도금 할 때에 그 전착현상을 조사하여 부분전류의 동태를 설명할 수 있는 변화인자를 알아보려 하였다. DIP와 같은 모양인 IC부품은 부분전도체로 구분되어지며 그 전착상태를 one-dimensional model로 분석하였을때, 가입전류밀도, 바렐의 회전속도, 용액중 금속이온 농도와 깊은 관계가 있음을 보인다. 다공질과 같은 것으로 간주한 one-dimensional model로서 의 이론식은 J=$\delta$'/$\beta$-{-c$^3$/${\gamma}$-exp-(1-$\alpha$)n$\Phi$}로 표현된다.

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바렐도금용 폐Steel Ball로부터 산화주석 및 금속주석 회수에 관한 연구 (Study on the Recovery of Tin Oxide and Metallurgical Tin from the Waste Steel Ball for Barrel Plating)

  • 김대원;장성태
    • 한국세라믹학회지
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    • 제49권6호
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    • pp.505-510
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    • 2012
  • A study of the recovery of tin and nickel from steel ball scraps for barrel plating was carried out through a physical treatment, a leaching treatment, hydrogen reduction and an electrolysis experiment. The recovery of the iron component was over 95% by the physical treatment. We obtained tin oxide in the form of metastannic acid ($SnO_2{\cdot}xH_2O$) with impurities of less than 5% from the leaching treatment. We also recovered the high-purity metallurgical tin at a rate that exceeded 99.9% by the electrolysis of crude tin obtained from the hydrogen reduction of metastannic acid.

바렐도금용(鍍金用) Steel Ball 스크랩에서 주석(Sn) 및 니켈(Ni) 회수(回收)에 관한 연구(硏究) (A Study on the Recovery of Sn and Ni from the Steel Ball Scraps for Barrel Plating)

  • 김대원;장성태;최순영
    • 자원리싸이클링
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    • 제20권4호
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    • pp.46-51
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    • 2011
  • 바렐도금에 사용되는 더미볼 스크랩에 함유되어 있는 주석 (Sn)을 회수하기 위하여 물리적 전처리, 침출 및 회수실험을 행하였다. 물리적 전처리를 통하여 철 성분의 회수율은 95% 이상 달성하였으며 또한, 후속 습식 공정에서 주석/니켈 분말에서 질산침출 조건에서 주석 성분의 회수율은 95% 이상의 결과를 얻었다.

Strip 형 반도체 부품상에 회전음극 방법에 의한 주석도금에 관한 고찰 (Rotary Cathode Tin Plating on Strip Type Semiconductors)

  • 이완구
    • 한국표면공학회지
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    • 제8권2호
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    • pp.1-6
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    • 1975
  • A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.

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