• Title/Summary/Keyword: barrel plating

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Study on Surface Treatment and Test over the Barrel of Small Arms (개인화기 총열 표면처리 및 시험에 관한 연구)

  • Chae, Je-Wook;Kim, In-Woo;Lee, Young-Shin
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.722-727
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    • 2004
  • This paper includes the comparative study between Cr plating and nitriding process with an aim at improving corrosion, wear and maintainability for KNR(Korean Next Generation Rifle) 5.56mm barrel. The endurance test was conducted to compare the performance of standard barrel, Cr plating barrel and nitriding barrel. Main activities are described as follows; optimal Cr plating and nitriding process set-up for KNR 5.56mm barrel; durability test of each barrel(20,000 rounds); salt water immersion test; dispersion, initial velocity, inner diameter data acquisition. According to the results of this firing test, Cr plating barrel is superior to standard barrel and nitriding barrel in view of corrosion, wear and maintainability

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Study on Surface Treatment over the Barrel of Small Arms (소구경 총열 표면처리에 관한 연구)

  • 채제욱;김인우;이영신
    • Journal of the Korea Institute of Military Science and Technology
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    • v.7 no.1
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    • pp.5-12
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    • 2004
  • This paper includes the comparative study between Cr plating and nitriding process with an aim at improving corrosion, wear and maintainability for KNR(Korean Next Generation Rifle) 5.5mm barrel. The endurance test was conducted to compare the performance of standard barrel, Cr plating barrel and nitriding barrel. Main activities are described as follows; optimal Cr plating and nitriding process set-up for KNR 5.56mm barrel; durability test of each barrel(20,000 rounds); salt water immersion test; dispersion, initial velocity, inner diameter data acquisition. According to the results of this firing test, Cr plating barrel is superior to standard barrel and nitriding barrel in view of corrosion, wear and maintainability.

A CASE STUDY ON THE EFFECT OF NITRIDING FOR CHROME-PLATING LOSS OF SMALL ARMS BARREL (소구경화기 총열의 크롬도금 손실방지를 위한 질화 영향 사례연구)

  • Shin, JW;Shin, TS;Choi, SY;Chung, SH;Kim, BK;Kwon, HR
    • Journal of Korean Society for Quality Management
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    • v.45 no.3
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    • pp.327-333
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    • 2017
  • Purpose: The purpose of this study is to research to protect to loss of chrome-plating of small arms barrel on high temperature in order to extend its life expectency. Methods: The reason why chrome-plating dropped out is main material is weak from heat. Therfore, to make barrel of small arms have higher heat-resistant property, nitriding for barrel before chrome-plating is needed and test of that barrel was handled to improve it. Results: Nitriding before chrome-plating is useful to protect to chrome-plating loss on high temperature. Conclusion: To protect loss of chome-plating of small arms barrel during on firing, pre-nitriding on barrel is effective finally it leads to extend to barrel's life expectency.

The Effect of Barrel Vibration Intensity to the Plating Thickness Distribution

  • Lee, Jun-Ho;Roselle D. Llido
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 1999.10a
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    • pp.15-15
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    • 1999
  • In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

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Electroplating process for the chip component external electrode

  • Lee, Jun-Ho
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2000.11a
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    • pp.1-2
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    • 2000
  • In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

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Influence of Process Variables on Barrel Electroplating (바렐도금에 미치는 공정변수의 영향)

  • 최태규;유황룡;장시성;황운석
    • Journal of the Korean institute of surface engineering
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    • v.35 no.5
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    • pp.295-304
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    • 2002
  • In this study, the effect of the diameter and the number of barrel hole on the total area of barrel hole were calculated and analyzed. And the effects of applied current density, rotational speed of the barrel, size and number of barrel hole, and the volume of plating materials on the distribution of plating thickness were experimented and discussed by the barrel electroplating of the tube type brass specimens in a sulfamate nickel barrel solution. The effect of barrel hole size and barrel hole area on the throwing power was also discussed.

Metal Deposit Distribution in Barrel Plating of Partially Conductive Load

  • 이완구
    • Journal of the Korean Professional Engineers Association
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    • v.16 no.3
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    • pp.68-73
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    • 1983
  • The metal deposition behavior in the barrel tin plating has been studied for the electronic DIP products, and tried to find out some modified factors in order to explain partial ,current flow behavior of this load. The deposition distribution characteristics for DTP products should be classified with the normal barrel plating as partially conductive load. Deposit distribution curves obtained from one-dimensional model have shown strong dependence n the applied current density, rotating speed of barrel and metal ion concentration of the solution. Theoretical formula J=$\delta$'/${\beta}$-{-c$^3$/${\gamma}$-exp-(1-${\alpha}$)n${\Phi}$} derived from one-dimensional porous model has been proposed for the barrel plating behavior where higher overpotential and concentration changes take place during barrel plating.

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Study on the Recovery of Tin Oxide and Metallurgical Tin from the Waste Steel Ball for Barrel Plating (바렐도금용 폐Steel Ball로부터 산화주석 및 금속주석 회수에 관한 연구)

  • Kim, Dae Weon;Jang, Seong Tae
    • Journal of the Korean Ceramic Society
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    • v.49 no.6
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    • pp.505-510
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    • 2012
  • A study of the recovery of tin and nickel from steel ball scraps for barrel plating was carried out through a physical treatment, a leaching treatment, hydrogen reduction and an electrolysis experiment. The recovery of the iron component was over 95% by the physical treatment. We obtained tin oxide in the form of metastannic acid ($SnO_2{\cdot}xH_2O$) with impurities of less than 5% from the leaching treatment. We also recovered the high-purity metallurgical tin at a rate that exceeded 99.9% by the electrolysis of crude tin obtained from the hydrogen reduction of metastannic acid.

A Study on the Recovery of Sn and Ni from the Steel Ball Scraps for Barrel Plating (바렐도금용(鍍金用) Steel Ball 스크랩에서 주석(Sn) 및 니켈(Ni) 회수(回收)에 관한 연구(硏究))

  • Kim, Dae-Weon;Jang, Seong-Tae;Choi, Soon-Ryung
    • Resources Recycling
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    • v.20 no.4
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    • pp.46-51
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    • 2011
  • A study on the recovery of tin from the steel ball scraps for barrel plating has been carried out the physical treatment and leaching experiment. The recovery of iron component was over 95% by the physical treatment, and the recovery of tin component was also over 95% by the hydro process.

Rotary Cathode Tin Plating on Strip Type Semiconductors (Strip 형 반도체 부품상에 회전음극 방법에 의한 주석도금에 관한 고찰)

  • 이완구
    • Journal of the Korean institute of surface engineering
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    • v.8 no.2
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    • pp.1-6
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    • 1975
  • A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.

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