• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.79-80
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• 1994

A systematic study on isoelectronic impurities in thin-film eletroluminescent devices (TFELD) has been made on the basis of the experimental analysis aimed at a survey for the blue-emitting materials. Codoping effects of isoelectronic impurities, such as oxygen(O), tellurium(Te), and lithium(Li), on the emissive characteristics of ZnS:Ce$^{3+}$ and ZnS:Tm$^{3+}$TFELD have been investigated by means of the X-ray diffraction studies, the Auger electron spectroscopy, the cathodoluminescent spectra, and the electroluminescent spectra. Experiment results reveal that oxygen codoping gives rise to an increase of the luminance, due to a suppression of the nonradiative energy transfer via sulfur vacancies Te codoping in ZnS:Ce$^{3+}$ TFELD result in a large change in the crystal field around Ce$^{3+}$ ions. Li codoping in ZnS:Tm$^{3+}$ TFELD causes the luminance to increase slightly, due to a lowering in the symmetry of Tm$^{3+}$ions. Likewise, the experimental results suggest strongly that an Auger-type enegy loss via lattece defects such an sulfur vacancies acts as a non-emissive in TFELD.ve in TFELD.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.175.1-175.1
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• 2015

CuSn thin films were deposited by rf magnetron co-sputtering method with pure Cu and Sn metal targets with a variety of rf powers. CuSn thin films were studied with a surface profiler (alpha step), X-ray photoelectron spectroscopy (XPS), X-ray induced Auger electron spectroscopy (XAES), X-ray diffraction (XRD), and contact angle measurement. The thickness of CuSn thin films was fixed at $200{\pm}10nm$ and deposition rate was calculated by the measured with a surface profiler. From the survey XPS spectra, the characteristic peaks of Cu and Sn were observed. Therefore, CuSn thin films were successfully synthesized on the Si (100) substrate. The oxidation state and chemical environment of Cu and Sn were investigated with the binding energy regions of Cu 2p XPS spectra, Sn 3d XPS spectra, and Cu LMM Auger spectra. Change of the crystallinity of the films was observed with XRD spectra. Using contact angle measurement, surface free energy (SFE) and wettability of the CuSn thin films were studied with distilled water (DW) and ethylene glycol (EG).

• Journal of the Korean Magnetics Society
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• v.20 no.6
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• pp.212-215
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• 2010

Spin polarized tunneling studies were carried out with Al-Ga bilayer as a spin detector, by Meservey-Tedrow technique. The superconductor (SC)/Insulator (I)/Ferromagnet (FM) tunnel junctions were provided by ultra high vacuum molecular beam epitaxy (UHV-MBE) technique. The analysis of interfacial properties in the Al-Ga bilayer was also carried out by Auger electron spectroscopy. It was observed that the superconducting transition temperature and energy gap were raised in comparison with that of bulk Ga and pure ultrathin Al films. Current studies clearly show how one can modify the material properties at the interface just with a few monolayers.

• Journal of the Korean Magnetics Society
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• v.11 no.4
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• pp.163-167
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• 2001

The rotation of uniaxial anisotropy field of 700 ${\AA}$ thick sputtered NiFe thin film due to magnetic annealing was investigated. NiFe film was annealed in a magnetic field which is perpendicular to the initial induced uniaxial anisotropy field. The NiFe film becomes nearly isotropic after 1 hour annealing at 160 $^{\circ}C$. With increase of annealing temperature over 160 $^{\circ}C$, the film gets uniaxial anisotropy field again. An abrupt increase of H$\sub$c/ was observed with annealing temperature over 400 $^{\circ}C$. The X-ray diffraction analysis and Auger electron spectroscopy with Ar ion etching showed extensive grain growth in NiFe film with (111) texturing and interdiffusion with adjacent Au electrode layer by 400 $^{\circ}C$ magnetic annealing.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.83-86
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• 1989

Lead titanate thin films with a perovskite structure were successfully structure were successfully fabricated on titanium substrate by Chemical Vapour Deposition(CVD). Analyses of Auger Electron Spectroscopy(AES) and X-ray Photoelectron Spectroscopy (XPS) have been performed in order to find a chemical composition of lead titanate films. The analysis of chemical composition by AES and XPS was investigated for variations of deposition temperature and Ti(C$_2$H$_{5}$O)$_4$ fractions. The chemical composition of PbTiO$_3$by XPS analysis was almost constant regardless of deposition parameters and the comparison of chemical composition by AES and XPS was performed.d.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.02a
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• pp.161-161
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• 1996

Recently, the role of the surface analysis on the development of advanced materials has become larger and larger as the surface compositions of these materials is the key of their performances. Especially three techniques, Auger electron spectroscopy, X- ray photoelectron spectroscopy and secondary ion mass spectroscopy are widely used in technology fields. However, because of the relatively short history of these techniques(thirty years or so), there has been no accumulation of data commonly available, physical parameters for analysis have not been established and there has been no standard data. With these background, the VAMAS projects which aims to standardize the manner in the field of these techniques has started in 1982 at Versailles Summit. Along the projects, we have conducted the international collaborating study on the sharing of spectral data. In 1994, the Science and Technology Agency of Japan began the project on computer network, on which our fruits from the study on spectral data sharing is boarded.(omitted)mitted)

• Journal of Surface Science and Engineering
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• v.27 no.5
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• pp.253-260
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• 1994

Ta-N films were reactively sputter deposited by dc magnetron sputtering from a Ta target with a various Ar-N, gas ratio. Electrical resistivity of pure Ta film was 150$\mu$$\Omega$cm and decreased initially with nitrogen addition, and then increased to a value of 220$\mu$$\Omega$-cm~260$\mu$$\Omega$-cm at 9%~23% nitrogen partial flow. Rutherford backscattering spectrometry(RBS) and Auger electron spectroscopy (AES) analysis show that nitrogen content in the film is increased with the nitrogen partial flow. The film contains 58at.% nitrogen at 36% nitrogen partial flow. Both the phase and the microstructure of the as-deposisted films were investigated by x-ray diffractometry(XRD) adn transmission electron microscopy (TEM) at various nitrogen content. The phase of pure Ta film is identified as $\beta$-Ta with a 200$\AA$~300$\AA$ grain size. The phase of Ta film is changed to bcc-Ta as small amount of nitrogen is added. Crystalline Ta2N film was deposited at 24at.% nitrogen content. Amorphous phase is formed over a range of nitrogen content from about 33at.% to 35at.% while crystalline fcc-TaN is observed to form at 39at.%~48at.% nitrogen content.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.2
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• pp.14-19
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• 2011

We have fabricated GaN Schottky barrier diode (SBD) for high-voltage applications on Si substrate. The leakage current and the electrical characteristics of GaN SBD are investigated by annealing metal-semiconductor junctions. Ohmic junctions of Ti/Al/Mo/Au and Schottky junctions of Ni/Au are used in the fabrication. A test structure is proposed to measured buffer leakage current through a mesa structure. When annealing temperature is increased from $700^{\circ}C$ to $800^{\circ}C$, measured buffer leakage current is also increased from 87 nA to 780 nA at the width of 100 ${\mu}m$. The diffusion of Au, Ti, Mo, O into GaN buffer layer increases the leakage current and that is verified by Auger electron spectroscopy. Experimental results show that the low leakage current and the high breakdown voltage of GaN SBD are achieved by annealing metal-semiconductor junctions.

• Journal of the Korean Ceramic Society
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• v.26 no.5
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• pp.670-676
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• 1989

The PbTiO3 is well known materials having remarkable ferroelectric, piezoelectric, and pyroelectric properties. PbTiO3 thin films with a perovskite structure were successfully fabricated on titanium substrate by chemical vapor deposition. These films were characterized according to composition, crystal structure, and electrical properties. Semi-quantitative compositional analysis of the deposited films was made by Auger Electron Spectroscopy(AES). The PbTiO3 film deposited on titanium substrate at the deposition temperature 75$0^{\circ}C$, the Ti(C2H5O)4 fraction 0.15, and O2 partial pressure 0.06atm, has a columnar structure and grows with(001) preferred orientation, and has stoichiometric composition. A clear dielectric transition and offset in the dc conductivity near the transition temperature(48$0^{\circ}C$) were observed in the deposited lead titanate film.