• Journal of Biomedical Engineering Research
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• v.25 no.5
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• pp.391-401
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• 2004

3D imaging systems using 2D phased arrays have a large number of active channels, compelling to use a very expensive and bulky beamforming hardware, and suffer from low volume rate because, in principle, at least one ultrasound transmit-receive event is necessary to construct each scanline. A high speed 3D imaging method using a cross array proposed previously to solve the above limitations can implement fast scanning and dynamic focusing in the lateral direction but suffer from low resolution except at the fixed transmit focusing along the elevational direction. To overcome these limitations, we propose a new real-time volumetric imaging method using a cross array based on the synthetic aperture technique. In the proposed method, ultrasound wave is transmitted successively using each elements of an 1D transmit array transducer, one at a time, which is placed along the elevational direction and for each firing, the returning pulse echoes are received using all elements of an 1D receive array transducer placed along the lateral direction. On receive, by employing the conventional dynamic focusing and synthetic aperture method along lateral and elevational directions, respectively, ultrasound waves can be focused effectively at all imaging points. In addition, in the proposed method, a volume of interest consisting of any required number of slice images, can be constructed with the same number of transmit-receive steps as the total number of transmit array elements. Computer simulation results show that the proposed method can provide the same and greatly improved resolutions in the lateral and elevational directions, respectively, compared with the 3D imaging method using a cross array based on the conventional fixed focusing. In the accompanying paper, we will also propose a new real-time 3D imaging method using a cross array for improving transmit power and elevational spatial resolution, which uses linear wave fronts on transmit.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.7
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• pp.667-678
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• 2002

In this paper, a new radiating structure with a multi-layered two-dimensional metallic disk array was proposed for shaping the flat-topped element pattern. It is an infinite periodic planar array structure with metallic disks finitely stacked above the radiating circular waveguide apertures. The theoretical analysis was in detail performed using rigid full-wave analysis, and was based on modal representations for the fields in the partial regions of the array structure and for the currents on the metallic disks. The final system of linear algebraic equations was derived using the orthogonal property of vector wave functions, mode-matching method, boundary conditions and Galerkin's method, and also their unknown modal coefficients needed for calculation of the array characteristics were determined by Gauss elimination method. The application of the algorithm was demonstrated in an array design for shaping the flat-topped element patterns of $\pm$20$^{\circ}$ beam width in Ka-band. The optimal design parameters normalized by a wavelength for general applications are presented, which are obtained through optimization process on the basis of simulation and design experience. A Ka-band experimental breadboard with symmetric nineteen elements was fabricated to compare simulation results with experimental results. The metallic disks array structure stacked above the radiating circular waveguide apertures was realized using ion-beam deposition method on thin polymer films. It was shown that the calculated and measured element patterns of the breadboard were in very close agreement within the beam scanning range. The result analysis for side lobe and grating lobe was done, and also a blindness phenomenon was discussed, which may cause by multi-layered metallic disk structure at the broadside. Input VSWR of the breadboard was less than 1.14, and its gains measured at 29.0 GHz. 29.5 GHz and 30 GHz were 10.2 dB, 10.0 dB and 10.7 dB, respectively. The experimental and simulation results showed that the proposed multi-layered metallic disk array structure could shape the efficient flat-topped element pattern.

• 한국생물공학회:학술대회논문집
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• 2003.04a
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• pp.630-633
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• 2003

Transfer of an electron from one site to another in a molecular or between molecules and/or electrodes is one of the most fundamental and ubiquitous processes in chemistry, biology and physics. In this study fusion proteins composed by green fluorescent protein(GFP) and cytochrome b562 were used in fabricating molecular array as an electron sensitizer and electron acceptor, Protein formation onto the substrate was performed by the self-assembly technique. The fusion protein film were analyzed using scanning probe microscope(SPM), Surface Plasmon Resornance(SPR) and hybrid STM/I-V. The results suggest that the proposed molecular photodiode can be used as a basic unit of the memory device.

• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
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• 2001.06a
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• pp.1127-1127
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• 2001

The transfer of predictive models using various chemometric techniques has been reported for FTNIR and scanning-grating based NIR instruments with respect relatively dry samples (<10% water). Some of the currently used transfer techniques include slope and bias correction (SBC), direct standardization (DS), piecewise direct standardization (PDS), orthogonal signal correction (OSC), finite impulse transform (FIR) and wavelet transform (WT) and application of neural networks. In a previous study (Greensill et at., 2001) on calibration transfer for wet samples (intact melons) across silicon diode array instrumentation, we reported on the performance of various techniques (SBC, DS, PDS, double window PDS (DWPDS), OSC, FIR, WT, a simple photometric response correction and wavelength interpolative method and a model updating method) in terms of RMSEP and Fearns criterion for comparison of RMSEP. In the current study, we compare these melon transfer results to a similar study employing pairs of spectrometers for non-invasive prediction of soluble solid content of peaches.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.123-126
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• 2001

Multiwalled carbon nanotubes were massively produced by the catalytic reaction of C$_2$H$_2$ - Fe(CO)$\sub$5/ mixture at 750 - 950$^{\circ}C$ in a quartz tube reactor and over quartz substrates. Well-aligned MWNT array grows perpendicular to the quartz tube reactor and the quartz substrates at an average of 60 nm in diameter and up to several thousands of micrometers in length. This method does not require any pretreatment of substrates and CNTs are grown at atmospheric pressure. It could be suitable for mass production of multiwalled nanotubes. Scanning electron microscope and transmission electron microscope images of the nanotubes deposited on the substrates allowed us to monitor the quality of MWNTs grown under different operating conditions.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.1
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• pp.75-84
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• 2008

A new automatic small target detection and tracking algorithm for the real-time IR surveillance system is presented. The automatic target detection and tracking algorithm of the real-time systems, requires low complexity and robust tracking performance in the cluttered environment. Linear-array and parallel-scan IR systems usually suffer from severe scan noise caused by the detector non-uniformity. After the spatial filtering and thresholding, this scan noise still remains as high amplitude clutter which degrades the target detection rate and tracking performance. In this paper, we propose a new feature which consists of area and validity information of a measurement. By adopting this feature to the measurements selection and track confirmation, we can increase the target detection rate and reduce both the track loss rate and false track rate. From the experimental results, we can validate the feasibility of the proposed method in the noisy IR images.

• Korean Journal of Optics and Photonics
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• v.5 no.3
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• pp.364-371
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• 1994

Real-time MTF measuring system for testing microlens arrays with a linear CCD array is developed. The spread function of slit image that is relayed and magnified by a microscopic object lens can be measured at several times in a second. The signal uniformity and MTF of CCD is also calibrated. The experimental result of micro lens arrays developed for contact image sensor is presented.sented.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• Journal of the Korean Society of Safety
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• v.10 no.4
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• pp.9-12
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• 1995

Detection of small defects by medical ultrasonic testing when the thermal sprayed coating by $MoSi_2$ on the metal is done. The defects may occur at the bonded surface. So, the detecting method of the defects by non-destructive in spection is desired. Here, in order to examine the possibility of the detection of the small defects by the ultrasonic. The electronic scanning ultrasonic equipment using an array probe developed as the medical ultrasonic diagnostic equipment is applied for the detection of the metal material defects. It's validity is investigated.