• 한국진공학회지
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• 제5권4호
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• pp.348-353
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• 1996

CdS/ITO/glass 기판위에 다결정 CdTe 박막을 진공증착법으로 제조한 후 급속열처리하여 열처리 온도와 가스분위기가 CdTe의 박막의 물성과 전지특성에 미치는 효과를 연구하였다. $450^{\circ}C$에서 $550^{\circ}C$까지 공기중 급속열처리한 경우 박막은 EDX 조성분석결과 화학양론비를 유지하였고 표면성분비는 Cd-rich 상태였으나 전처리후 저저항 contact 제조에 유리한 Te-rich 상태로 변화되었다. TEM과 micro-EDX 결과 급속열처리 전후 모두 CdTe는 주상정구조가 관찰되었고 열처리동안 CdTe내로 확산된 S의 양이 로열처리와 비교하여 매우 적음을 알 수 있었다. 급속열처리 온도가 가스분위기 조건 중 공기 중에서 $550^{\circ}C$ 열처리하였을 때 가장 우수한 태양전지효율을 나타내었다.

• 한국정보통신학회논문지
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• 제20권10호
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• pp.1980-1986
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• 2016

본 논문에서는 KrF 레이저를 이용한 격자 공정 후 고온 어닐링 온도조건에 따른 감마방사선 영향을 분석하였다. 제작된 광섬유 브래그 격자는 게르마늄(Ge)이 첨가된 동일한 광섬유에 어닐링 온도를 달리하여 제작하였으며, $Co^{60}$ 감마선원을 이용하여 약 115 Gy/min의 선량률로 총선량 약 31 kGy 감마선을 조사하였다. 격자의 안정화를 위한 고온 어닐링 공정은 광섬유 브래그 격자의 방사선 민감도 변화에 영향을 주는 것으로 나타났다. 실험결과를 통하여, 각각 다른 온도(100, 150, $200^{\circ}C$)로 안정화시킨 광섬유 브래그 격자들은 고온에 노출될수록 방사선 민감도가 증가했으며, 어닐링 온도조건에 따라서 방사선에 의한 브래그 파장 변화는 2배 이상의 차이를 보였다.

• 전기전자학회논문지
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• 제25권3호
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• pp.467-472
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• 2021

고온에서도 반도체 소자의 안정적인 동작이 필요하다. 반도체 소자의 구조중에서 고온에서 불안정한 전기적 응답을 야기할 수 있는 영역은 금속과 반도체가 접합하는 콘택층이다. 본 연구에서는 p형 SiC 층위에 니켈-실리사이드(NiSix)의 콘택층을 형성하는 공정과정에 포함되는 어닐링 공정 조건이 콘택 저항의 비저항과 전체 저항에 미치는 효과를 고찰하였다. 이를 위해, 4인치 p형 SiC층 위에 전송길이 이론(transfer length method: TLM) 측정을 위한 알련의 전극 패턴들을 형성하였고, 어닐링 온도(1700와 1800℃)와 어닐링 시간(30와 60분)을 달리하여 4종의 시료를 제조하였으며, TLM을 이용한 저항을 측정하였다. 그 결과, 어닐링 조건이 콘택층의 저항과 소자의 전기적 안정성에 영향을 미치는 사실을 확인하였다.

• 한국재료학회지
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• 제33권10호
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• pp.400-405
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• 2023

Tb³⁺-doped CaNb₂O₆ (CaNb₂O₆:Tb³⁺) thin films were deposited on quartz substrates at a growth temperature of 300 ℃ using radio-frequency magnetron sputtering. The deposited thin films were annealed at several annealing temperatures for 20 min and characterized for their structural, morphological, and luminescent properties. The experimental results showed that the annealing temperature had a significant effect on the properties of the CaNb₂O₆:Tb³⁺ thin films. The crystalline structure of the as-grown CaNb₂O₆:Tb³⁺ thin films transformed from amorphous to crystalline after annealing at temperatures greater than or equal to 700 ℃. The emission spectra of the thin films under excitation at 251 nm exhibited a dominant emission band at 546 nm arising from the ⁵D₄→⁷F₅ magnetic dipole transition of Tb³⁺ and three weak emission bands at 489, 586, and 620 nm, respectively. The intensity of the ⁵D₄→⁷F₅ (546 nm) magnetic dipole transition was greater than that of the ⁵D₄→⁷F₆ (489 nm) electrical dipole transition, indicating that the Tb³⁺ ions in the host crystal were located at sites with inversion symmetry. The average transmittance at wavelengths of 370~1,100 nm decreased from 86.8 % at 700 ℃ to 80.5 % at an annealing temperature of 1,000 ℃, and a red shift was observed in the bandgap energy with increasing annealing temperature. These results suggest that the annealing temperature plays a crucial role in developing green light-emitting CaNb₂O₆:Tb³⁺ thin films for application in electroluminescent displays.

• Carbon letters
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• 제13권2호
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• pp.130-132
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• 2012

In this study, cobalt oxide ($Co_3O_4$)/graphene composites were synthesized through a simple chemical method at various calcination temperatures. We controlled the crystallinity, particle size and morphology of cobalt oxide on graphene materials by changing the annealing temperatures (200, 300, $400^{\circ}C$). The nanostructured $Co_3O_4$/graphene hybrid materials were studied to measure the electrochemical performance through cyclic voltammetry. The $Co_3O_4$/graphene sample obtained at $200^{\circ}C$ showed the highest capacitance of 396 $Fg^{-1}$ at 5 $mVs^{-1}$. The morphological structures of composites were also examined by scanning electron microscopy and transmission electron microscopy (TEM). Annealing $Co_3O_4$/graphene samples in air at different temperatures significantly changed the morphology of the composites. The flower-like cobalt oxides with higher crystallinity and larger particle size were generated on graphene according to the increase of calcination temperature. A TEM analysis of the composites at $200^{\circ}C$ revealed that nanoscale $Co_3O_4$ (~7 nm) particles were deposited on the surface of the graphene. The improved electrochemical performance was attributed to a combination effect of graphene and pseudocapacitive effect of $Co_3O_4$.

• 한국재료학회지
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• 제13권5호
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• pp.303-308
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• 2003

Amorphous carbon nitride films deposited on Si(001) substrates by a plasma enhanced chemical vapor deposition (PECVD) technique using CH$_4$and $N_2$as reaction gases were thermally annealed at various temperatures under$ N_2$atmosphere, then their physical properties were investigated particularly as a function of annealing temperature. Above $600^{\circ}C$ a small amount of crystalline $\beta$-$C_3$$N_4$ phase evolves, while the film surface becomes very rough due to agglomeration of fine grains on the surface. As the annealing temperature increases, both the hardness and the $sp^3$ bonding nature are enhanced. In contrast to our expectation, higher annealing temperature results in a relatively higher friction mainly due to big increase in roughness at that temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.357-357
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• 2010

The electrical characteristics of ZnO thin film transistor (TFT) were investigated. ZnO thin layer was deposited by DC sputtering method and TFTs with ZnO channel layer were fabricated. On/off current ratio and saturated drain current of fabricated devices were improved by annealing in nitrogen ambient at various temperatures. As a result, the electrical characteristics of ZnO TFT were improved by post annealing in nitrogen ambient and it is important to optimize the annealing conditions for ZnO TFT fabrication.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.61-62
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• 2005

The present article deals with in situ post annealing of ZnO in sputtering system. The ZnO thin films were grown at low temperature of $100^{\circ}C$ and at working pressure of 15 mTorr with RF magnetron sputtering. Having been gown, ZnO thin films were annealed in situ at different temperatures, at annealing ambient pressure of 15 mTorr and in ambients of oxygen and argon respectively. Through analyses of XRDs, it is can be concluded that the crystallinity of annealed ZnO thin films becomes much better than that of as-grown ZnO thin film.

• 열처리공학회지
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• 제7권3호
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• pp.175-183
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• 1994

The effect of batch annealing conditions and austenitizing temperatures on the hardness and microstructural factors were examined by using 420J2 martensitic stainless steel. In spite of the similler hardness after batch annealing, the difference in hardness at the same austenitizing temperature was caused by changes in dissolved carbon during batch annealing. The highest hardness of the specimen was obtained at the batch annealing temperature of $820^{\circ}C$ and austenitizing temperature of $1050^{\circ}C$. The main factor affecting the final hardness of the cold annealed 420J2 specimen was proved to the austenitizing temperature rather than batch annealing temperature.

• 한국표면공학회지
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• 제24권4호
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• pp.196-205
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• 1991

Multi-level thin films are very important in ULSI applications because of their high electromigration resistance. This study presents the effects of titanium, titanium nitride and titanium tungsten underlayers of the stability of multi-aluminum thin films during isothermal annealing. High purity Al(99.999%) films have been electron-beam evaporated on Ti, TiN, TiW films formed on SiO2/Si (P-type(100))-wafer substrates by RF-sputtering in Ar gas ambient. The hillock growth was increased with annealing temperatures. Growth of hillocks was observed during isothermal annealing of the thin films by scanning electron microscopy. The hillock growth was believed to appear due to the recrystallization process driven by stress relaxation during isothermal annealing. Thermomigration damage was also presented in thin films by grain boundary grooving processes. It is shown that underlayers of Al/TiN/SiO2, Al/TiW/SiO2 thin films are preferrable to Al/SiO2 thin film metallization.