• Structural Engineering and Mechanics
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• 제63권3호
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• pp.269-280
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• 2017

One major concern that has occupied the mind of the designers is a structural failure as result of stress concentration in the geometrical discontinuities. Understanding the effective parameters contribute to stress concentration and proper selection of these parameters enables the designer get to a reliable design. In the analysis of perforated isotropic and orthotropic plates, the effective parameters on stress distribution around holes include load angle, curvature radius of the corner of the hole, hole orientation and fiber angle for orthotropic materials. This present paper tries to examine the possible effects of these parameters on stress analysis of infinite perforated plates with central quasi-square hole applying grey wolf optimizer (GWO) inspired by the particular leadership hierarchy and hunting behavior of grey wolves in nature, and also the present study tries to introduce general optimum parameters in order to achieve the minimum amount of stress concentration around this type of hole on isotropic and orthotropic plates. The advantages of grey wolf optimizer are stout, flexible, simple, and easy to be enforced. The used analytical solution is the expansion of Lekhnitskii's solution method. Lekhnitskii applied this method for the stress analysis of anisotropic plates containing circular and elliptical holes. Finite element numerical solution is employed to examine the results of present analytical solution. Results represent that by selecting the aforementioned parameters properly, fewer amounts of stress could be achieved around the hole leading to an increase in load-bearing capacity of the structure.

• Journal of Welding and Joining
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• 제6권3호
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• pp.43-55
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• 1988

An experimental study was carried out to identify the fatigue fractue behavior of weld zone in generally rolled steel for marine structure. The bending an shear loads were applied simultaneously on the specimens to simulate real load condition for marine structure. The effect of the stress intensity factor under mode I with II loading condition on the initiation and the propagation of a crack were investigated, with particular emphaiss on mode II. When the $K_{II}$ stress intensiy factor in mode II was applied under mode I load condition, the growth behavior of a crack seems to be affected mainly by the anisotropic characteristic of materials. Especially, when the crack was located in and near the weld zone and parallel to th weld line, the propagation behaviour was turned out to be quite different from that of the base metal along the direction transverse to the weld line. In general, the propagation veiocity of the cracks in and near the weld zone was found to be slower that the velocity in base metal.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1992년도 하계학술대회 논문집 B
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• pp.649-652
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• 1992

ECR(Electron Cyclotron Resonance) occure at ${\omega}_c$=${\omega}$, ${\omega}_c$:electron cycltron frequency, ${\omega}$:electromagnetic wave frequency. ECR system have several merit, 1) power transefer efficiency 2) low neutral gas pressure (below 1 mTorr) 3) high plasma density($10^{12}$ $cm^{-3}$). It is applicated variously in the field of semiconductor and new materials as the manufacturing equipment. Magnetic field in ECR system contruct resonance layer (${\omega}$=2.45GHz, $B_z$=875 Gauss) and control plasma. Plasma is almost generated at resonance layer. If the distance between substrate and resonance layer is short, uniformity of plasma is related with profile of resonance layer. Plasma have the property "Cold in Field", so directonality of magnetic field is one of the control factors of anisotropic etching. In this study, we calculate B field and flux line distribution, optimize geometry and submagnet current and improve of magnetic field directionality (99.9%) near substrate. For the purpose of calculation, vector potential A(r,z) and magnetic field B(r,z), green function and numerical integration is used. Object function for submagnet optimization is magnetic field directionality on the substrate and Powell method is used as optimization skim.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권1호
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• pp.13-18
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• 2000

We have fabricated LB ultra-thin films of maleate system by LB technique and evaluated the deposited status of LB ultra-thin films by I-V characteristics such as capacitance. It was found that the thickness of LB ultra-thin per layer is $27~30[{\AA}]$ by XRD. And, we have known that the conductivity along the horizontal direction of LB ultra-thin films was about $10^{-8}[S/cm]$, it corresponds to the semiconducting materials. Also, the I-V characteristics along the vertical direction of LB ultra-thin films was dominated by Schottky type current, the activation energy obtained by current-temperature characteristics was about 0.84[eV] and the conductivity was about $10^{-14}[S/cm]$, it corresponds to the insulator. And, the anisotropic conduction mechanism of the LB ultra-thin films in vertical direction and horizontal direction is determined by the hydrophilic group and the hydrophobic group in LB ultra-thin films. The above results are applicable to the semiconductor devices such as switching device, which function at the molecular level.

• 소성∙가공
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• 제27권5호
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• pp.301-313
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• 2018

In this paper, tensile test was performed on pure titanium sheet (CP Ti sheet) with HCP structure in each direction to evaluate mechanical and surface properties and analyze microstructural changes during plastic deformation. We also evaluated forming limits of Ti direction in dome-type punch stretching test using a non-contact three-dimensional optical measurement system. As a result, it was revealed the pure titanium sheet has strong anisotropic property in yield stress, stress-strain curve and anisotropy coefficient according to direction. It was revealed that twinning occurred when the pure titanium sheet was plastic deformed, and tendency depends differently on direction and deformation mode. Moreover, this seems to affect the physical properties and deformation of the material. In addition, it was revealed the pure titanium sheet had different surface roughness changes in 0 degree direction and 90 degree direction due to large difference of anisotropy, and this affects the forming limit. It was revealed the forming limit of each direction obtained through the punch stretching test gave higher value in 90 degree direction compared with forming limit in 0 degree direction.

• 한국진공학회지
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• 제21권5호
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• pp.279-285
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• 2012

주기적인 나노트랜치 패턴이 있는 기판 위에 놓인 CVD 그래핀의 전도특성을 측정하였다. 나노트랜치에 대해 평행한 방향과 수직한 방향 사이에 전도특성의 큰 비등방성을 발견하였다. 전기 전도의 방향이 나노트랜치에 수직한 경우, 약한 한곳모임의 특성에 있어서도 큰 차이점이 발견되었는데, 이는 퍼텐셜 변조에 의해 생겨나는 전하밀도의 비균일성에 의해 생겨나는 것으로 해석된다.

• 한국자기학회지
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• 제13권2호
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• pp.76-81
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• 2003

매설된 송유관이나 가스관의 외부면과 내부면에 생성된 원형 결함(double circular pit) 부근에서 누설되는 자속 신호에 미치는 결함깊이와 인장응력(tensile stress)의 영향을 3차원 유한요소법을 이용하여 계산하였다. 배관의 축 및 방사상 방향의 누설자속 (Magnetic Flux Leakage: MFL) 신호는 배관 외$.$내부 면의 이중 결함깊이와 인장응력에 의해 영향을 받으며, 결함의 깊이가 깊어질수록 인장응력이 커질수록 MFL 신호는 증가하였다. 그러나 원주 방향의 MFL 신호는 결함깊이와 인장응력에 거의 영향을 받지 않았다.

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• 전자공학회논문지A
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• 제31A권5호
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• pp.113-120
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• 1994

Silicon flow sensor that can detect the velocity and direction of air flow was designed and fabricated by integrated circuit process and bulk micromachining technique. The flow sensor consists of three-layered dielectric diaphragm, a heater at the center of the diaphragm, and four thermopiles surrounding the heater at each side of diaphragm as sensing elements. This diaphragm structure contributes to improve the sensitivity of the sensor due to excellent thermal isolation property of dielectric materials and their tiny thickness. The flow sensor has good axial symmetry to sense 2-D air flow with the optimized sensing position in the proposed structure. The sensor is fabricated using CMOS compatible process followed by the anisotropic etching of silicon in KOH and EDP solutions to form I$\mu$ m thick dielectric diaphragm as the last step. TCR(Temperature Coefficient of Resistance) of the heater of the fabricated sensors was measured to calculate the operating temperature of the heater and the output voltage of the sensor with respect to flow velocity was also measured. The TCR of the polysilicon heater resistor is 697ppm/K, and the operating temperature of the heater is 331$^{\circ}C$ when the applied voltage is 5V. Measured sensitivity of the sensor is 18.7mV/(m/s)$^{1/2}$ for the flow velocity of smaller than 10m/s.

• 한국게임학회 논문지
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• 제10권4호
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• pp.81-90
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• 2010

본 논문에서는 측정된 양방향 반사 분포 함수(BRDF)와 같은 데이터 없이 사실적인 직물 표면 렌더링이 가능한 효율적인 방법을 제안한다. 제안된 기법은 광선 추적 기반의 오프라인 렌더러와 게임과 같은 실시간 응용에 모두 적용할 수 있다. 제안된 기법은 교호적(alternating) 이방성 반사와 변형된 미세면 분포 함수를 이용하여 직조 표면을 표현한다. 실에 대한 절차적 모델링은 직물의 표면을 효과적이며 효율적으로 표현할 수 있게 한다. 실험결과는 제안된 기법을 통해 상호작용적 응용에서도 다양한 직조물 표면을 사실적으로 렌더링할 수 있음을 보이고 있다.