• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.112.1-112.1
• /
• 2011

The back contact solar cell (BCSC) has several advantages compared to the conventional solar cell since it can reduce grid shadowing loss and contact resistance between the electrode and the silicon substrate. This paper presents the effect of the surface texturing of the silicon BCSC by varying the texturing depth or the texturing gap in the commercially available simulation software, ATHENA and ATLAS of the company SILVACO. The texturing depth was varied from $5{\mu}m$ to $150{\mu}m$ and the texturing gap was varied from $1{\mu}m$ to $100{\mu}m$ in the simulation. The resulting efficiency of the silicon BCSC was evaluated depending on the texturing condition. The quantum efficiency and the I-V curve of the designed silicon BCSC was also obtained for the analysis since they are closely related with the solar cell efficiency. Other parameters of the simulated silicon BCSC are as follows. The substrate was an n-type silicon, which was doped with phosphorous at $6{\times}10^{15}cm^{-3}$, and its thickness was $180{\mu}m$, a typical thickness of commercial solar cell substrate thickness. The back surface field (BSF) was $1{\times}10^{20}\;cm^{-3}$ and the doping concentration of a boron doped emitter was $8.5{\times}10^{19}\;cm^{-3}$. The pitch of the silicon BCSC was $1250{\mu}m$ and the anti-reflection coating (ARC) SiN thickness was $0.079{\mu}m$. It was assumed that the texturing was anisotropic etching of crystalline silicon, resulting in texturing angle of 54.7 degrees. The best efficiency was 25.6264% when texturing depth was $50{\mu}m$ with zero texturing gap in case of low texturing depth (< $100{\mu}m$).

• Earthquakes and Structures
• /
• v.12 no.1
• /
• pp.67-77
• /
• 2017

In this paper, it is aimed to present a comparative study about the structural behavior of tall buildings consisting of different type of materials such as concrete, steel or timber using finite element analyses and experimental measurements on shaking table. For this purpose, two 1/60 scaled 28 and 30-stories wooden building models with $40{\times}40cm$ and $35{\times}35cm$ ground/floor area and 1.45 m-1.55 m total height are built in laboratory condition. Considering the frequency range, mode shapes, maximum displacements and relative story drifts for structural models as well as acceleration, displacement and weight limits for shaking table, to obtain the typical building response as soon as possible, balsa is selected as a material property, and additional masses are bonded to some floors. Finite element models of the building models are constituted in SAP2000 program. According to the main purposes of earthquake resistant design, three different earthquake records are used to simulate the weak, medium and strong ground motions. The displacement and acceleration time-histories are obtained for all earthquake records at the top of building models. To validate the numerical results, shaking table tests are performed. The selected earthquake records are applied to first mode (lateral) direction, and the responses are recorded by sensitive accelerometers. Comparisons between the numerical and experimental results show that shaking table tests are enough to identify the structural response of wooden buildings. Considering 20%, 10% and 5% damping rations, differences are obtained within the range 4.03-26.16%, 3.91-65.51% and 6.31-66.49% for acceleration, velocity and displacements in Model-1, respectively. Also, these differences are obtained as 0.49-31.15%, 6.03-6.66% and 16.97-66.41% for Model-2, respectively. It is thought that these differences are caused by anisotropic structural characteristic of the material due to changes in directions parallel and perpendicular to fibers, and should be minimized using the model updating procedure.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.457-460
• /
• 2000

Injection molding is the most widely used process for the industrial forming of plastic articles. During an injection molding process of composites, the fiber-matrix separation and fiber orientation are caused by the flow of molten polymer/fiber mixture. As a result, the product tends to be nonhomogeneous and anisotropic. Hence, it is very important to clarify the relations between separation·orientation and infection molding conditions. So far, there is no research on the measurement of fiber orientation using image processing. In this study, the effects of fiber content ratio and molding condition on the fiber orientation-angle distributions are studied experimentally. Using the image processing method, the fiber orientation distribution of welding parts in injection-molded products is assessed. And the effects of fiber content and injection mold shapes on the fiber orientation in case of fiber reinforced polymeric composites are studied. experimentally.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.9-15
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.1
• /
• pp.41-49
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.25 no.9
• /
• pp.1183-1192
• /
• 2001

The numerical simulation has been conducted for the investigation of flow and heat transfer characteristics of an oblique impingement jet injected to a flat plate. The finite volume method was used to discretize the governing equations based on the non-orthogonal coordinate with non-staggered variable arrangement. The $textsc{k}$-$\varepsilon$-ν(sup)'2 turbulence model was employed to consider the consider the anisotropic flow characteristics generated by the impingement jet flow. The predicted results were compared with the experimental data and those of the standard $textsc{k}$-$\varepsilon$ turbulence model. The results of the $textsc{k}$-$\varepsilon$-ν(sup)'2 model showed better agreement with the experimental data than those of the standard $textsc{k}$-$\varepsilon$ model. In order to get the optimum condition, the flow and temperature fields were calculated with a variation of inclined angle($\alpha$=30$^{\circ}$~90$^{\circ}$) and the distance between the jet exit and impingement plate-to-diameter (L/D=4~10) at a fixed Reynolds number(Re=20,000). For a small L/D, the near-peak Nusselt numbers were not significantly effected by the inclined angle. The near-peak Nusselt numbers were not significantly affected by the L/D in the case of a large $\alpha$. The overall shape of the local Nusselt numbers was influenced by both the jet orifice-to-plate spacing and the jet angle.

• Tunnel and Underground Space
• /
• v.19 no.2
• /
• pp.158-166
• /
• 2009

As a basic study for investigating the development of the stress-induced crack in Hoek-Brown rock, a homogenization technique of elastic cracks is proposed. The onset of crack is monitored by Hoek-Brown empirical criterion, while the orientation of the crack is determined by the critical plane approach. The concept of volume averaging in stress and strain component was invoked to homogenize the representative rock volume which consists of intact rock and cracks. The formulation results in the constitutive relations for the homogenized equivalent anisotropic material. The homogenization model was implemented in the standard FEM code COSMOSM. The numerical uniaxial tests were performed under plane strain condition to check the validity of the propose numerical model. The effect of friction between the loading plate and the rock sample on the mode of deformation and fracturing was examined by assuming two different contact conditions. The numerical simulation revealed that the homogenized model is able to capture the salient features of deformation and fracturing which are observed commonly in the uniaxial compression test.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.04a
• /
• pp.35-43
• /
• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Proceedings of the KIEE Conference
• /
• 1998.07g
• /
• pp.2518-2520
• /
• 1998

Silicon can be reactive ion etched (RIE) either isotropically or anisotropically. In this paper, a new micromachining technology combining these two etching characteristics is proposed. In the proposed method, the fabrication steps are as follows. First. a polysilicon layer, which is used as the bottom electrode, is deposited on the silicon wafer and patterned. Then the silicon substrate is etched anisotropically to a few micrometer depth that forms a cavity. Then an PECVD oxide layer is deposited to passivate the cavity side walls. The oxide layers at the top and bottom faces are removed while the passivation layers of the side walls are left. Then the substrate is etched again but in an isotropic etch condition to form a round trench with a larger radius than the anisotropic cavity. Then a sacrificial PECVD oxide layer is deposited and patterned. Then a polysilicon structural layer is deposited and patterned. This polysilicon layer forms a pivot structure of a rocker-arm. Finally, oxide sacrificial layers are etched away. This new micromachining technology is quite simpler than conventional method to fabricate joint structures, and the devices that are fabricated using this technology do not require a flexing structure for motion.

• Tunnel and Underground Space
• /
• v.16 no.3 s.62
• /
• pp.218-231
• /
• 2006

Anisotropic/heterogeneous rock mass shows various deformation behavior types due to tunnelling because deformation behavior is largely controlled by the spacial characteristics of geological factors such as faults, joints and fractured zone in rock mass. In this paper 2-dimensional numerical analysis on the several influencing factors is performed considering fractured zone located near tunnel. This numerical analysis shows that deformation behavior of tunnel are very different according to the width and the location of fractured zone and supper method. However, 3-dimensional analysis is necessary to consider 3-dimensional geometrical characteristics sufficiently since discontinuity and fractured zone have 3-dimensional geometry. Also flexible design/construction guidelines for tunnelling are required to cope with uncertain ground condition and circumstance for technically safe and economic tunnel construction.