• 한국전기전자재료학회논문지
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• 제18권1호
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• pp.24-29
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• 2005

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. Copper has been the candidate metallization material for ultra-large scale integrated circuits (ULSIs), owing to its excellent electro-migration resistance and low electrical resistance. However, it still has various problems in copper CMP process. Thus, it is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure are very important parameters that must be carefully formulated in order to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the variables and the interaction between the various parameters during CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimum parameters which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.

• International Journal of Clinical Preventive Dentistry
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• 제14권4호
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• pp.228-234
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• 2018

Objective: The authors have experimented for the artificial plaque removal effect of several kinds of 360 degree rotating head typed tooth-brushes with sonic vibratory actioned by using of automatic machine for horizontal scrub method in order to find the better toothbrush type for plaque removal. Methods: The experiment was conducted on three medium to 360 degree rotating head toothbrushes, a medium sized toothbrush and a medium sized toothbrush, and a flat toothbrush consisting of 30 ordinary toothbrushes. A brushing machine with horizontal scrubbing was manufactured and had variations of the end of the bristle attached to or near the surface of the teeth, a vibrating wave action force of 16,000 or 18,000 cycles per minute, and a working time of 2 or 3 minutes. The tooth removal effect was confirmed by scanning and analyzing images with a computer program after automatic brushing with the machine. The elimination rate results for each group were analyzed using the independent t-test and one-way ANOVA test. Results: It revealed the most in removal effect for the artificial plaque in such conditions as action at near the tooth surface with 18,000 cycle for 3 minutes in case of using A, B, and C tooth-brush. And it has more removal effect rate than for using the plane tooth-brush (p<0.05). Conclusion: It was recommended to develop the 360 degree rotating head and vibratory toothbrush focusing to use near the tooth surface with 18,000 cycles of vibration for 3 minutes at one site of the teeth area.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.231-234
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• 2004

Chemical mechanical polishing(CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with the slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various coefficient of friction was attained and analyzed with the kind of pad, abrasive and the abrasive concentration. The lubrication regime is also classified with ${\eta}v/p(\eta,\;v\;and\;p;$ the viscosity, relative velocity and pressure). Especially, the co-relation not only between the friction force and the removal per unit distance but also between the coefficient of friction and within-wafer-nonuniformity was estimated.

• 한국정밀공학회지
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• 제22권1호
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• pp.199-206
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• 2005

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1308-1311
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• 2004

It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.228-232
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• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing(CMP) process in 0.18 ${\mu}m$ semiconductor device. However it does have various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining removal rate and non-uniformity. In this paper, We studied the DOE(design of experiment) method for the optimized CMP process. Various process variations, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal process parameters.

• 한국의류학회지
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• 제20권4호
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• pp.690-696
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• 1996

In order to study the affect of surfactants on the soil removal, the dispersion and polar force components of surface tension for surfactant solutions (such as LAS, AS, AOS, AES, AE) were calculated using extended Fowkes equation. The contact angles on paraffin and surface tension of surfactant solutions were measured. Cmcs of LAS, AS, AES and AE were below the concentration of 0.05%, but the cmc of AOS was between 0.05% and 0.1%. The surface tension of AE was lowest but the dispersion force component was greastest. Total surface tension of every mixed anionic surfactant was lower than that of single surfactants, and the dispersion force components were almost decreased. The addition of sodium carbonate to the sufactant solutions decreased the surface tension, and the surface tensions of surfactant solutions were lowered after washing.

• Membrane and Water Treatment
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• 제11권2호
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• pp.131-139
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• 2020

The current study focused on the preparation of low-cost PVC-based adsorbing membrane. Metakaolin, as available adsorbent, was embedded into the PVC matrix via solution blending method. The as-prepared PVC/metakaolin mixed matrix membranes were characterized using scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), attenuated total reflectance-Fourier transform infrared (ATR-FTIR) spectroscopy, atomic force microscopy (AFM), pure water permeability and contact angle measurements. The results confirmed the improvement of PWP and hydrophilicity due to the presence of metakaolin in the PVC matrix. Additionally the structure of PVC membrane was changed due to the incorporation of metakaolin in the polymer matrix. The static adsorption capacity of all samples was determined through dye removal. The effect of metakaolin dosage (0-7%) and pH (4, 8, 12) on dye adsorption capacity was investigated. The results depicted that the highest adsorption capacity was achieved at pH of 4 for all samples. Additionally, adsorption data were fitted on Langmuir, Freundlich, and Temkin models to determine the appropriate governing isotherm model. Finally, the dynamic adsorption capacity of the optimum PVC/metakaolin membrane was studied using dead-end filtration cell. The dye removal efficiency was determined for pure PVC and PVC/metakaolin membrane. The results demonstrated that PVC/metakaolin mixed matrix membrane had a high adsorption capacity for dye removal from aqueous solution.

• Tribology and Lubricants
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• 제25권6호
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• pp.404-408
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• 2009

본 연구에서는 마이크로/나노입자를 이용한 연마가공 공정에서의 입자-표면간 접촉상황에서 접촉계면의 기계적 성질과 재료제거율간의 관계를 실험적으로 고찰하였다. 연마가공 공정에서의 입자-평면간 접촉을 모사하기 위하여 팁 대신 실리카 입자를 부착한 콜로이드 프로브를 이용한 원자현미경 실험을 통하여 마찰력과 강성을 실험적으로 측정하였다. 실험결과와 이론적 접촉해석으로부터, 마찰계수는 횡방향 접촉강성에 따라 대체적으로 증가하고 재료제거율은 실리카 입자와 Cu, PolySi, Ni과 같은 다양한 재료표면간 접촉에서의 마찰계수들과 지수함수적인 비례관계를 가지고 있음을 규명하였다.

• 한국주조공학회지
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• 제22권3호
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• pp.130-136
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• 2002

The growing use of aluminum for castings over the past decade has brought with it the increased scrutiny of component properties. One area that has received much attention is the effect of in inclusions - or impurities particles held in the metal - on casting properties. A new method of electromagnetic separation for removal of inclusions in aluminum alloy melts is proposed. The principle is that as the electromagnetic force induced in metal acts on inclusions due to low electric conductivity, they are moved to the direction opposite to electromagnetic force and can be separated and removed from the melt. Experiments were carried out on A356 melt mixed alumina particles and commercial Al alloys of ADC 10 and 12. In the experiment using A356, it was proved that $Al_2O_3$ particles was separated and removed continuously from matrix melt by electromagnetic force. Based on these results, the continuous separation experiment that used ADC 10, 12 was carried and the cleanliness of melt was assessed by the amount of porosity, hydrogen contents, PoDFA and mechanical properties through tensile test. As the results of analyses, the amount of porosity and hydrogen contents decreased without variation of chemical composition in the specimen that passed the electromagnetic continuous separator. In addition, tensile strength and elongation of this specimen increased by $20{\sim}30%$ because of reduction of inclusions.