• Title/Summary/Keyword: alloy plating

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Effects of CrN and TiN Coating by Hydrogen Embrittlement of Aluminum Alloys for Hydrogen Valves of Hydrogen Fuel Cell Vehicles on Mechanical Properties (수소연료전지 자동차의 수소밸브용 알루미늄 합금의 수소취화에 의한 기계적 특성에 미치는 CrN과 TiN 코팅의 영향)

  • Ho-Seong Heo;Dong-Ho Shin;Seong-Jong Kim
    • Corrosion Science and Technology
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    • v.22 no.4
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    • pp.232-241
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    • 2023
  • The mechanical properties of the hydrogen valve responsible for supplying and blocking hydrogen gas in a hydrogen fuel cell electric vehicle (FCEV) were researched. Mechanical properties by hydrogen embrittlement were investigated by coating chromium nitride (CrN) and titanium nitride (TiN) on aluminum alloy by arc ion plating method. The coating layer was deposited to a thickness of about 2 ㎛, and a slow strain rate test (SSRT) was conducted after hydrogen embrittlement to determine the hydrogen embrittlement resistance of the CrN and TiN coating layers. The CrN-coated specimen presented little decrease in mechanical properties until 12 hours of hydrogen charging due to its excellent resistance to hydrogen permeation. However, both the CrN and TiN-coated specimens exhibited deterioration in mechanical properties due to the peeling of the coating layer after 24 hours of hydrogen charging. The specimens coated at 350 ℃ presented a significant decrease in ultimate tensile strength due to abnormal grain growth.

An Effect of surface treatment on a Protection Ballistic Limits in armor material (표면처리가 장갑재료의 방호한계에 미치는 영향)

  • 손세원;김희재;이두성;홍성희;유명재
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.12
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    • pp.126-134
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    • 2003
  • In order to investigate the effect of surface treatment in Aluminium alloy and Titanium alloy which are used to armor material during ballistic impact, a ballistic testing was conducted. Anodizing was used to achieve higher surface hardness of Aluminium alloy and Iron plating in PVD(Physical Vapor Deposition) method was used to achieve higher surface hardness of Titanium alloy. Surface hardness test were conducted using a Micro victor's hardness tester. Ballistic resistance of these materials was measured by protection ballistic limit(V-50), a statical velocity with 50% probability penetration. Fracture behaviors and ballistic tolerance, described by penetration modes, are respectfully observed from the results of V-50 test and Projectile Through Plates (PTP) test at velocities greater than V-50. PTP tests were conducted with 0$^{\circ}$obliquity at room temperature using 5.56mm ball projectile. V-50 tests were conducted with 0$^{\circ}$obliquity at room temperature with projectiles that were able to achieve near or complete penetration during PTP tests. Surface hardness, resistance to penetration. and penetration modes of surface treated alloy laminates are compared to those of surface non-treated alloy laminates. A high speed photography was used to analyze the dynamic perforation phenomena of the test materials.

Investigation of Plated Contact for Crystalline Silicon Solar Cells (결정질 실리콘 태양전지에 적용될 도금전극 특성 연구)

  • Kim, Bum-Ho;Choi, Jun-Young;Lee, Eun-Joo;Lee, Soo-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.192-193
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    • 2007
  • An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

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A Study on Intermediate Layer for Palladium-Based Alloy Composite Membrane Fabrication (팔라듐 합금 복합막 제조를 위한 Intermediate Layer 연구)

  • Hwang, Yong-Mook;Kim, Kwang-Je;So, Won-Wook;Moon, Sang-Jin;Lee, Kwan-Young
    • Applied Chemistry for Engineering
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    • v.17 no.5
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    • pp.458-464
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    • 2006
  • The Pd-Ni-Ag alloy composite membrane using modified porous stainless steel (PSS) as a substrate was prepared by a electroless plating technique. In this work, we have introduced the intermediate layer between Pd-based alloy and a metal substrate. As an intermediate layer, the mixtures of nickel powder and inorganic sol such as $SiO_{2}$ sol, $Al_{2}O_{3}$ sol, and $TiO_{2}$ sol were used. The intermediate layers were coated onto a PSS substrate according to various membrane preparation conditions and then $N_{2}$ fluxes through the membranes with different intermediate layers were measured. The surface morphology of the intermediate layer in the mixture of nickel powder and inorganic sol was analyzed using scanning electron microscope (SEM). Finally, the Pd-Ni-Ag alloy composite membrane using the support coated with the mixture of nickel powder and silica as an intermediate layer was fabricated and then the gas permeances for $H_{2}$ and $N_{2}$ through the Pd-based membrane were investigated. The selectivity of $H_2/N_2$ was infinite and the $H_{2}$ flux was $1.39{\times}10^{-2}mol/m^2{\cdot}s$ at the temperature of $500^{\circ}C$ and trans-membrane pressure difference of 1 bar.

Development of Sleeve Parts for Continuous Hot Zinc Plating Roll Applied to Wear-Resistant Alloy Cast Steel

  • Park, Dong-Hwan;Hong, Jin-Tae;Kwon, Hyuk-Hong
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.26 no.4
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    • pp.357-364
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    • 2017
  • Metal casting is a process in which molten metal or liquid metal is poured into a mold made of sand, metal, or ceramic. The mold contains a cavity of the desired shape to form geometrically complex parts. The casting process is used to create complex shapes that are difficult to make using conventional manufacturing practices. For the optimal casting process design of sleeve parts, various analyses were performed in this study using commercial finite element analysis software. The simulation was focused on the behaviors of molten metal during the mold filling and solidification stages for the precision and sand casting products. This study developed high-life sleeve parts for the sink roll of continuous hot-dip galvanizing equipment by applying a wear-resistant alloy casting process.

EFFECT OF ALUMINIDE-YTTRIUM COMPOSITE COATING ON THE OXIDATION RESISTANCE OF TiAl ALLOY

  • Jung, Hwan-Gyo;Kim, Jong-Phil;Kim, Kyoo-Young
    • Journal of Surface Science and Engineering
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    • v.29 no.6
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    • pp.607-614
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    • 1996
  • Yttrium(Y) coating was incorporated by ion-plating method either directly on the TiAl substrate or after pack aluminizing on TiAl to improve the oxidation resistance of TiAl alloy. After Y-coating, heat treatment at low oxygen partial pressure was carried out. Performance of various coating was evaluated by isothermal and cyclic oxidation tests. A simple Y-coating without pack aluminizing can give a detrimental effect on the. oxidation resistance of TiAl alloy, because it enhances formation of $TiO_2$. On the other hand, a composite coating of aluminide-yttrium has shown excellent oxidation resistance. A continuous protective $Al_2O_3$ scale is formed on the aluminized TiAl, and Y-coating improves $Al_2O_3$ scale adherence and substantially prevents depletion of Al in the aluminide-coating layer.

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A Study of Electro-Deposition for Pb-Sn-Cu Alloy System (연-주석-동계 합금속도에 관한 연구)

  • Kang, T.;Cho, C. S.;Yum, H. T.
    • Journal of Surface Science and Engineering
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    • v.4 no.1
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    • pp.16-23
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    • 1971
  • In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

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Plastic deformation behavior of BMG/crystalline composites in the supercooled liquid region during compression (BMG/결정질 복합재의 과냉각 액상구역에서 압축 변형 거동)

  • Park, E.S.;Lee, J.H.;Kim, S.H.;Huh, M.Y.;Kim, H.J.;Bae, J.C.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.118-121
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    • 2007
  • Bulk metallic glass (BMG)/crystalline composites comprising a copper based BMG alloy and crystalline nickel were produced by means of eloctroless plating of nickel on $Cu_{54}Zr_{22}Ti_{18}Ni_6$ BMG powder and subsequent consolidation using spark plasma sintering. The plastic deformation behavior of BMG/crystalline composites was examined by uniaxial compression test at various temperatures in the supercooled liquid region (SLR) of the BMG alloy. The evolution of strain states during uniaxial compression was tackled by microstructure observations. Deformation temperature played an important role in the deformation behavior of BMG/crystalline composites, which was attributed to a strong temperature dependence of the flow stress of the BMG alloy in the SLR. BMG/crystalline composites deformed homogenously in the temperature range where the flow stress of the BMG alloy was close to that of crystalline nickel. In contrast, inhomogeneous deformation was observed in the temperature range where the flow stress of the BMG alloy largely differs from that of crystalline nickel.

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Effect of Electroplating Parameters on Conductivity and Hardness of Ni-P Alloy (Ni-P 합금의 전기전도도와 경도에 대한 도금 조건의 영향)

  • Kim, Nam-Gil;Sun, Yong-Bin
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.3
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    • pp.77-81
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    • 2017
  • Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

Evaluation of Texture and Mechanical Property on Annealing Condition of Ni-Plated Hybrid Cu Sheet (어닐링처리에 따른 니켈 도금한 하이브리드 동판의 집합조직 및 기계적 특성평가)

  • Lee, Jung-Il;Lee, Joo-Ho;Cho, Kyung-Won;Kim, Kun-Nam;Kim, Gang-Beom;Jang, Tae-Soon;Park, No-Jin
    • Journal of the Korean Society for Heat Treatment
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    • v.21 no.3
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    • pp.144-149
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    • 2008
  • It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.