• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.1
• /
• pp.31-39
• /
• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.3
• /
• pp.45-54
• /
• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Korean Journal of Materials Research
• /
• v.9 no.10
• /
• pp.1018-1024
• /
• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.14 no.2
• /
• pp.42-47
• /
• 2005

Micro duplex stainless steel is used to denote a fine scale two-phase micro structure consisting austenite and firrite. The development of this structure was done by proper thermo-mechanical processing. The objective of present investigation is to study creep characteristics of this alloy. Since we have little design data about the W behaviors of the alloy. An apparatus has been designed and built fir conducting creep tests under constant load conditions. A series of creep tests on them have been performed to get the basic design data and life prediction of micro duplex stainless steel products and we have gotten the 1311owing results. First the stress exponents decrease as the test temperatures increase. Secondly, the creep activation energy Gradually decreases as the stresses become higher. Thirdly, the constant of Larson-Miller Parameters on this alloy is estimated as about 5. Last, the fiactographs at the creep rupture show both the ductile and brittle fracture modes according to the creep conditions.

• Transactions of Materials Processing
• /
• v.15 no.8 s.89
• /
• pp.586-590
• /
• 2006

42Ni-Fe Invar alloy strips were fabricated using conventional ingot casting and melt drag casting followed by rolling. Mechanical properties such as tensile strength, elongation and blanking deformability of the strips were evaluated. The properties were strongly depended on fabrication methods. Tensile strength and elongation of all strips were in the range of $40-60kg/mm^{2}$ and 26-35%, respectively, which are enough values for the manufacture of the final products. In some of the strips, however, burrs occurred at deformed surface. The properties of strips were explained in terms of microstructure such as grain size and texture formation during rolling. Additionally, strips by melt drag casting method were compared to those by conventional ingot casting.

• Journal of Welding and Joining
• /
• v.18 no.6
• /
• pp.42-47
• /
• 2000

The object of this study is to estimate Sn-Ag-Bi-Ga solder alloy as a substitute for Sn-37Pb alloy. For Sn-Ag-Bi-Ga alloys, Ag, Bi and Ga contents are varied. (Ag : 1~5%, Ga : 3%, Bi : 3~6%) Comparing to Sn-37Pb alloy Sn-Ag-Bi-Ga alloys have wider melting temperature range up to max. $18.7^{\circ}C$. With increasing Ag, Bi contents, the wettability of the alloys increased up to max. 6.6 mN. The vickers hardness of the alloys was max. 46.4 Hv. The ultimate tensile stress of the alloys was max. 60.3 MPa and the elongation was max. 1.2%. The joint strength between circuit board and solder was max. 55.5 N and the joint strength between connector and solder was max. 176.1 N. There were no cracks in this alloys after thermal shock test.

• Proceedings of the Optical Society of Korea Conference
• /
• 2008.07a
• /
• pp.247-248
• /
• 2008

We investigated the influence of uniparabolic graded distributed Bragg reflector (DBR) using digital alloy on vertical series resistance and reflectivity of DBRs. Measured specific DBR series resistance was reduced to about 8.787${\times}$$10^{-6}$${\ohm}$ $cm^2$/period for digital alloy uniparabolic graded DBR. This was better than various graded DBRs, especially biparabolic graded DBR. Reflectivity of 42 pair uniparabolic graded DBR was found to be comparable to that of biparabolic graded DBRs.

• Journal of the Korean institute of surface engineering
• /
• v.53 no.1
• /
• pp.36-42
• /
• 2020

In this study, two novel methods to measure the surface hardness of anodic oxide films on aluminum alloys are reported. The first method is to impregnate oil-based ink into pores in the anodic oxide film and then to clean the ink on the surface using ethanol, resulting in an impregnation of inks only inside of the pores in anodic oxide film. The second method is to coat the anodic oxide film surface with thin Au layer less than 0.1 ?. Both the ink-impregnating method and Au-coating method provided clear indentation marks on the anodic oxide film surface when it was indented using a pyramidal-diamond penetrator. Thus, Vickers hardness of anodic oxide films on aluminium alloy could be measured successfully and precisely from the anodic film surface. In addition, advantages and disadvantages of the ink-impregnating method and Au-coating method for the measurement of surface hardness of anodic oxide films are discussed.

• Journal of the Korean Society for Heat Treatment
• /
• v.17 no.2
• /
• pp.94-100
• /
• 2004

In order to improve the wear resistance of Ti-6Al-4V alloy, plasma carburization treatment was newly carried out without consumption of its good specific strength and fatigue life over the temperature. Effect of the plasma carburization was analyzed and compared with the non-treated alloy by microstructural observation, structure characterization and mechanical test. The plasma treated alloy formed a carburized layer of about $150{\mu}m$ in depth from the surface, where a fine and hard particles of TiC and $V_4C_3$ were homogeneously dispersed through the layer. The steady-static creep behaviors of Ti-6Al-4V alloy, using the constant stress creep tester, were investigated over the temperature range of $510{\sim}550^{\circ}C$(0.42~0.44Tm) and the stress range of 200~275 MPa. Stress exponent(n) was decreased from 9.32 of non-treatment specimen to 8.95 of carburized, however, the activation energy(Q) increased from 238 to 250 kJ/mol with the same condition as indicated above. From the above results, it can be concluded that the static creep deformation for Ti-6Al-4V alloy was controlled by the dislocation climb over the ranges of the experimental conditions.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2007.11a
• /
• pp.42-42
• /
• 2007

무독성 원소로 조성된 Ti-30Ta-xZr(x=3, 7, 10, 15) 합금을 제조하여, HA박막과 금속사이의 계면이 생기는 문제점을 개선하기 위해 합금 표면에 HA/TiN 및 HA/ZrN 이중층을 형성시킨 후 전기화학적 방법으로 코팅의 영향을 조사하였다.