• Title/Summary/Keyword: air-filled substrate-integrated waveguide

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40 GHz Vertical Transition with a Dual-Mode Cavity for a Low-Temperature Co-fired Ceramic Transceiver Module

  • Byun, Woo-Jin;Kim, Bong-Su;Kim, Kwang-Seon;Eun, Ki-Chan;Song, Myung-Sun;Kulke, Reinhard;Kersten, Olaf;Mollenbeck, Gregor;Rittweger, Matthias
    • ETRI Journal
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    • v.32 no.2
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    • pp.195-203
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    • 2010
  • A new vertical transition between a substrate integrated waveguide in a low-temperature co-fired ceramic substrate and an air-filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air-filled waveguide. Physical characteristics of an air-filled WR-22 to WR-22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a -1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back-to-back module. A 40 GHz low-temperature co-fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm ${\times}$ 28 mm ${\times}$ 3.3 mm.

High-performance filtering power divider based on air-filled substrate integrated waveguide technology

  • Ali-Reza Moznebi;Kambiz Afrooz;Mostafa Danaeian
    • ETRI Journal
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    • v.45 no.2
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    • pp.338-345
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    • 2023
  • A filtering power divider based on air-filled substrate-integrated waveguide (AFSIW) technology is proposed in this study. The AFSIW structure is used in the proposed filtering power divider for substantially reducing the transmission losses. This structure occupies a large area because of the use of air as a dielectric instead of typical dielectric materials. A filtering power divider provides power division and frequency selectivity simultaneously in a single device. The proposed filtering power divider comprises three AFSIW cavities. The filtering function is achieved using symmetrical inductive posts. The input and output ports of the proposed circuit are realized by directly connecting coaxial lines to the AFSIW cavities. This transition from the coaxial line to the AFSIW cavity eliminates the additional transitions, such as AFSIW-SIW and SIW-conductor-backed coplanar waveguide, applied in existing AFSIW circuits. The proposed power divider with a second-order bandpass filtering response is fabricated and measured at 5.5 GHz. The measurement results show that this circuit has a minimum insertion loss of 1 dB, 3-dB fractional bandwidth of 11.2%, and return loss exceeding 11 dB.

A Filtering Antenna for Wireless In-Flight Entertainment Communication System at Millimeter-Wave Band (기내 엔터테인먼트 통신 시스템을 위한 밀리미터파 대역의 여파기 결합 안테나)

  • Seo, Tae-Yoon;Lee, Jae-Wook;Cho, Choon-Sik
    • Journal of Advanced Navigation Technology
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    • v.14 no.1
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    • pp.11-19
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    • 2010
  • In this paper, H-plane filtering-horn antenna operating at millimeter frequency band is proposed with embedded filter and three-layered dielectric lens for frequency selection and maintenance of main beam direction, respectively. The waveguide-typed filter and H-plane sectoral horn antenna are replaced with considerably size-reduced PCB substrate-typed filtering antenna using via fences and several posts. The waveguide-typed filter and H-plane sectoral horn antenna were designed in air-filled waveguide and then combined into size-reduced PCB substrate. For the control of the thickness of dielectric lens, single and multi dielectric lens have been employed. As a result of antenna gain, 8 and 13.5 dBi have been obtained at 41.5 GHz, respectively, from the simulations of single and multi-lens antennas.

Ku-Band Transitions between Microstrip and Substrate Integrated Waveguide and Microstrip and Hollow Substrate Integrated Waveguide (Ku-대역 마이크로스트립-SIW 및 마이크로스트립-HSIW 천이 구조)

  • Hong, Sung-June;Kim, Seil;Lee, Min-Pyo;Lim, Jun-Su;Kim, Dong-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.2
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    • pp.95-103
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    • 2019
  • In this paper, we present a microstrip-to-substrate integrated waveguide(SIW) transition and microstrip-to-hollow SIW(HSIW) transition for Ku-band satellite communication systems. For the complete utilization of the HSIW, a structure filled with air instead of a dielectric material, a microstrip-to-HSIW transition is designed, fabricated, and compared with a microstrip-to-SIW transition. A back-to-back microstrip-to-SIW transition is measured in the range 12~18 GHz; it exhibits a return loss ${\geq}20dB$ and an insertion loss of $1.5{\pm}0.2dB$. In contrast, a back-to-back microstrip-to-HSIW transition exhibits a return loss of at least 15 dB and an insertion loss of $0.55{\pm}0.2dB$ in the same frequency range.

Measured Return Loss and Predicted Interference Level of PCB Integrated Filtering Antenna at Millimeter-Wave

  • Lee Jae-Wook;Kim Bong-Soo;Song Myung-Sun
    • Journal of electromagnetic engineering and science
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    • v.5 no.3
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    • pp.140-145
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    • 2005
  • In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.