• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Korean Journal of Materials Research
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• v.27 no.8
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• pp.422-430
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• 2017

Al/expanded graphite was successfully synthesized through a facile method including ultrasonic and heat treatment. In the well-designed three dimensional structure, expanded graphite(EG) works as a conductive matrix to support coated Al particles. The effects of the fabrication parameters on the microstructures and thermal conductivities of these composites were investigated. As a result, it was found that composites with graphite volume fraction of 17.4-69.4 % sintered at $600^{\circ}C$/45MPa exhibit in-plane thermal conductivities of 380-940 W/mK, over 90 % of the predictions by rule of mixture. According to the non-destructive analysis results, the synergistic enhancement was caused by the formation of efficient thermally conductive pathways due to the hybrid of the differently sized EG. The structure integrates the advantages of expanded graphite as a conductive support, preserving the electrode activity and integrity and improving the electrochemical performance.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2728-2735
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• 2022

The research on the flow and heat transfer characteristics of lead bismuth(LBE) is significant for the thermal-hydraulic calculation, safety analysis and practical application of lead-based fast reactors(LFR). In this paper, a new CFD model is proposed to solve the thermal-hydraulic analysis of LBE. The model includes two parts: turbulent model and turbulent Prandtl, which are the important factors for LBE. In order to find the best model, the experiment data and design of 19-pin hexagonal rod bundle with spacer grid, undertaken at the Karlsruhe Liquid Metal Laboratory (KALLA) are used for CFD calculation. Furthermore, the turbulent model includes SST k - 𝜔 and k - 𝜀; the turbulent Prandtl includes Cheng-Tak and constant (Pr_t =1.5,2.0,2.5,3.0). Among them, the combination between SST k - 𝜔 and Cheng-Tak is more suitable for the experiment. But in the low Pe region, the deviation between the experiment data and CFD result is too much. The reason may be the inlet-effect and when Pe is in a low level, the number of molecular thermal diffusion occupies an absolute advantage, and the buoyancy will enhance. In order to test and verify versatility of the model, the NCCL performed by the Nuclear Thermal-hydraulic Laboratory (Nuthel) of Xi'an Jiao tong University is used for CFD to calculate. This paper provides two verification examples for the new universal model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.8
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• pp.1253-1260
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• 2001

Transient thermal analysis of a three-dimensional axisymmetric automotive disk brake is presented in this paper. Temperature fields are obtained using a hybrid FFT-FEM scheme that combines Fourier transform techniques and finite element method. The use of a fast Fourier transform algorithm can avoid singularity problems and lead to inexpensive computing time. The transformed problem is solved with finite element scheme for each frequency domain. Inverse transforms are then performed for time domain solution. Numerical examples are presented for validation tests. Comparisons with analytical results show very good agreement. Also, a 3-D simulation, based upon an automotive brake disk model is performed.

• Journal of the Korea Concrete Institute
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• v.26 no.1
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• pp.57-62
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• 2014

In this study, the vertical pipe cooling method was developed to propose the pipe cooling method suited for the vertically long mass concrete structures. FEM (finite element method) analysis was carried out to investigate the validity of the vertical pipe cooling method, and the temperature, the behavior of tensile stress of concrete and the crack index were investigated. In result, it was confirmed that the vertical pipe cooling method was effective in the thermal cracking control of mass concrete member.

• Journal of the Semiconductor & Display Technology
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• v.4 no.1 s.10
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• pp.1-8
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• 2005

Linear motor can be directly applied to the system needed linear motions without rotary motions. To control high-speed and high-resolution, the development of the linear motors is recently required in the high-integrated and speed process industry This paper presents thermal and vibration analyses as well as measurement standards of the newly developed linear motors through analyzing the thermal behaviors and vibration characteristics of the advanced products. The thermal measurements are conducted for comparing the developed linear motor with the advanced linear motor and the Finite Volume Method(FVM) is used to identify the measurement results. And then the vibration measurement are carried out in the developed and advanced linear motors with respect to the speed. To identify the measurement results, the Finite Element Method is utilized in the developed and advanced linear motors, respectively. The FVM, FEM, and experiments make it possible to understand these characteristics. The improvement is suggested through their results conducted experiment and analyses.

• Applied Microscopy
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• v.50
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• pp.4.1-4.10
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• 2020

Metallic matrix composites reinforced with carbon nanomaterials continue to attract interest because of their excellent mechanical, thermal, and electrical properties. However, two critical issues have limited their commercialization. Uniform distribution of carbon nanomaterials in metallic matrices is difficult, and the interfaces between the nanomaterials and matrices are weak. Microscope-based analysis was recently used to quantitatively examine these microstructural features and investigate their contributions to the composites' mechanical, thermal, and electrical properties. The impacts of the microstructure on these properties are discussed in the first section of this review. In the second section, the various microscopic techniques used to study the distribution of carbon nanomaterials in metallic matrices and their interfaces are described.

• Proceedings of the Korean Nuclear Society Conference
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• 2002.05a
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• pp.113.2-113
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• 2002

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.35-36
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• 2005

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.39-45
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• 2006

This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.