• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.25-29
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• 2008

Reliability and performance in metal gate/high-k device with multiple gate dielectrics were investigated. MOSFETs with a thin $HfSiO_x$ layer on a thermal Si02 dielectric as gate dielectrics exhibit excellent mobility and low interface trap density. However, the distribution of threshold voltages of $HfSiO_x/SiO_2$ stack devices were wider than those of $SiO_2$ and $HfSiO_x$ single layer devices due to the penetration of Hf and/or intermixing of $HfSiO_x$ with underlying $SiO_2$. The results of TZDB and SILC characteristics suggested that a certain portion of $HfSiO_x$ layer reacted with the underlying thick $SiO_2$ layer, which in turn affected the reliability characteristics.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.119-122
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• 2018

Various ZnO/Ag/ZnO multilayers were fabricated and their optical properties were investigated. Top and bottom ZnO layers were formed by sol-gel method and mid-metal layers were deposited by spin coating. To find suitable deposition condition of Ag, we measure thickness and sheet resistance of Ag monolayer. After the optimization of Ag monolayer, we fabricate ZnO/Ag/ZnO multilayers. Transmittance of ZnO/Ag/ZnO multilayers increased to 63%. In near IR region, transmittance of ZnO/Ag/ZnO multilayers decreased to 35% when the concentration of Ag solution was 2.5wt%.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.1-12
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• 2022

With the rapid development of artificial intelligence technology that gives existing sensors functions similar to human intelligence is drawing attention. Previously, researches were mainly focused on an improvement of fundamental performance indicators as sensors. However, recently, attempts to combine artificial intelligence such as classification and prediction with sensors have been explored. Based on this, intelligent sensor research has been actively reported in almost all kinds of sensing fields such as disease detection, motion detection, and gas sensor. In this paper, we introduce the basic concepts, types, and driving mechanisms of artificial intelligence and review some examples of its use.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.21-25
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• 2007

In this study, the properties of Sn-0.7wt%Cu-Xwt%Re(X=$0.01{\sim}1.0$) older were investigated by using DSC(differential scanning calorimetry), wetting balance, victors hardness and tensile testers. The melting temperature of solder was increased with increasing the contents of rare earth element, and the melting temperature range of Sn-0.7Cu-($0.01{\sim}1.0$)Re solder was $233.9{\sim}234.7^{\circ}C$. The wettability with Sn-0.7Cu-0.1Re solder was higher than that of Sn-0.7Cu-0.01Re and Sn-0.7Cu-1.0Re solders, and the wettability of Sn-0.7Cu-0.1Re solder was higher than that of Sn-0.7wt%Cu-0.01w%P solder. Also, the hardness and tensile strength of solder were increased with increasing the contents of rare earth element.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.47-53
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• 2012

Recently, by the increasing of data transmission rates, PCB is required high-speed data transmission rates and thin packaging. So optical PCB which is the combination of electrical layer and optical layer can be one of the solution to overcome the limitations of conventional electrical PCB. The most important factor in the implementation of optical PCB is optical interconnection. So the research on high-efficiency and passive alignment has been active. In this paper, we suggest built-in lens pluggable waveguide and we simulate its coupling efficiency and structural stability. Optical simulation results show that the proposed structure has higher efficiency than no lens structure about 1.86 times in transmitter and about 1.42 times in receiver. In structure simulation, inner lens has no damage in desorption process. Therefore, we shown that the proposed structure has a high coupling efficiency and structural stability.

• Journal of Ceramic Processing Research
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• v.19 no.6
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• pp.504-508
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• 2018

Diopside is a ceramic material with excellent physical and chemical properties. However, when it is applied as an LED packaging material, heat dissipation of the LED element is not sufficient due to its relatively lower thermal conductivity, which may cause degradation of the LED function. In this study, glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system, in which diopside is the main crystal phase, were prepared by heat-treating the glass, which was composed of zircon ($ZrO_2-SiO_2$) powders and diopside ($CaO-MgO-2SiO_2$) powders. The possibility of using the glass-ceramics as a packaging material for LEDs was then investigated by analyzing the density, shrinkage, thermal conductivity, and phases generated according to the amount of zircon powder added. The density and shrinkage of specimens decreased slightly and then increased again with the amount of $ZrO_2-SiO_2$ added within a range of 0~0.38 mol. Even though the crystal phase of zircon does not appear in the $ZrO_2-CaO-MgO-SiO_2$ system, the glass containing 0.38 mol zircon powder showed the highest thermal conductivity, 1.85 W/mK, among the specimens fabricated in this study: this value was about 23% higher than that of pure diopside. It was found that the thermal conductivity of the glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system was closely related to the density, but not to the phase type. Zirconia ($ZrO_2$), a component oxide of zircon, plays an important role in increasing the density of the specimen. Furthermore the thermal conductivity of glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system showed a nearly linear relationship with thermal diffusivity.

• Journal of Powder Materials
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• v.30 no.4
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• pp.346-355
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• 2023

Epoxy-based composites find extensive application in electronic packaging due to their excellent processability and insulation properties. However, conventional epoxy-based polymers exhibit limitations in terms of thermal properties and insulation performance. In this study, we develop epoxy-based siloxane/silica composites that enhance the thermal, mechanical, and insulating properties of epoxy resins. This is achieved by employing a sol-gel-synthesized siloxane hybrid and spherical fused silica particles. Herein, we fabricate two types of epoxy-based siloxane/silica composites with different siloxane molecular structures (branched and linear siloxane networks) and investigate the changes in their properties for different compositions (with or without silica particles) and siloxane structures. The presence of a branched siloxane structure results in hardness and low insulating properties, while a linear siloxane structure yields softness and highly insulating properties. Both types of epoxy-based siloxane/silica composites exhibit high thermal stability and low thermal expansion. These properties are considerably improved by incorporating silica particles. We expect that our developed epoxy-based composites to hold significant potential as advanced electronic packaging materials, offering high-performance and robustness.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.33-42
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• 2023

Throughout all industries, eco-friendliness is being promoted worldwide with focus on suppressing the environmental impact. With recent international environment policies and regulations supported by government, the electric vehicles demand is expected to increase rapidly. Battery system itself perform an essential role in EVs technology that is arranged in cells, modules, and packs, and each of them are connected mechanically and electrically. A multifaceted approach is necessary for battery pack bonding technologies. In this paper, pros and cons of applicable bonding technologies, such as resistance welding, laser and ultrasonic bonding used in constructing electric vehicle battery packs were compared. Each bonding technique has different advantages and limitations. Therefore, several criteria must be considered when determining which bonding technology is suitable for a battery cell. In particular, the shape and production scale of battery cells are seen as important factors in selecting a bonding method. While dealing with the types and components of battery cells, package bonding technologies and general issues, we will review suitable bonding technologies and suggest future directions.