• 제목/요약/키워드: adhesive layer

Search Result 542, Processing Time 0.035 seconds

Recombinant S-Layer Proteins of Lactobacillus brevis Mediating Antibody Adhesion to Calf Intestine Alleviated Neonatal Diarrhea Syndrome

  • Khang, Yong-Ho;Park, Hee-Young;Jeong, Yoo-Seok;Kim, Jung-Ae;Kim, Young-Hwan
    • Journal of Microbiology and Biotechnology
    • /
    • v.19 no.5
    • /
    • pp.511-519
    • /
    • 2009
  • A chimeric gene encoding enhanced green fluorescent protein (EGFP) and a S-layer protein from Lactobacillus brevis KCTC3102, and/or two copies of the Fe-binding Z-domain, a synthetic analog of the B-domain of protein A, was constructed and expressed in Escherichia coli BL21(DE3). The S-layer fusion proteins produced in a 500-1 fermentor were likely to be stable in the range of pH 5 to 8 and $0^{\circ}C$ to $40^{\circ}C$. Their adhesive property enabled an easy and rapid immobilization of enzymes or antibodies on solid materials such as plastics, glass, sol-gel films, and intestinal epithelial cells. Owing to their affinity towards intestinal cells and immunoglobulin G, the S-layer fusion proteins enabled the adhesion of antibodies to human epithelial cells. In addition, feeding a mixture of the S-layer fusion proteins and antibodies against neonatal calf diarrhea (coronavirus, rotavirus, Escherichia coli, and Salmonella typhimurium) to Hanwoo calves resulted in 100% prevention of neonatal calf diarrhea syndrome (p<0.01), whereas feeding antibodies only resulted in 56% prevention.

A Study on the Soldering Characteristic of 4 Bus Bar Crystalline Silicon Solar Cell on Infrared Lamp and Hot Plate Temperature Control (적외선 램프 및 핫 플레이트 온도 제어를 통한 4 Bus Bar 결정질 실리콘 태양전지 솔더링 특성에 관한 연구)

  • Lee, Jung Jin;Son, Hyoung Jin;Kim, Seong Hyun
    • Current Photovoltaic Research
    • /
    • v.5 no.3
    • /
    • pp.83-88
    • /
    • 2017
  • The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

A Study on the Mechanical Properties and Residual Stresses of the Thermally Sprayed Alumina Ceramic Coating Layer (알루미나 세라믹(Alumina Ceramic) 코팅층의 기술적인 특성과 잔류응력의 해소에 관한 연구)

  • 김영식
    • Journal of Ocean Engineering and Technology
    • /
    • v.10 no.2
    • /
    • pp.88-97
    • /
    • 1996
  • The pupose of this study is to improve the mechanical properies and to evaluate the residual stresses of flame-sprayed Alumina ceramic coating layer. The first work in this study is to investigate the effects of strengthening heat treatments on the mechanical properties of coating layer. Strengthening heat treatments for sprayed specimens were carried out in vaccum furnace. The mechanical properties such as microhardness, thermal shock resistance, adhesive strength and erosion resistance were tested for the sprayed specimens after strengthening heat treatments. And it was clear that the mechanical properties of coating layer were much improved by strengthening heat treatments. The second work in this study is to evalute the residual stresses in coating lsyer by numerical analysis. FDM and FEM were used to analyze temperature distribution and residul stresses in coating layer. It was proved that are tensile stresses in coating layer and that residual stresses can be controlled by the appropriate selection of the spraying parameters such as preheat temperature, coating thickness and bond coat thickness.

  • PDF

Ultrastructure of the Fertilized Egg Envelope from Pale Chub, Cyprinidae, Teleost (경골어류 잉어과 피라미의 수정란 난막 미세구조)

  • Deung, Young-Kun;Kim, Dong-Heui;Reu, Dong-Suck
    • Applied Microscopy
    • /
    • v.30 no.4
    • /
    • pp.321-326
    • /
    • 2000
  • The ultrastructure of the fertilized egg envelope from pale chub , Zacco platypus belong to Cyprinidae was studied using scanning and transmission electron microscopes. The fertilized egg was an adhesive type, have a single micropyle resembling the pathway of sperm in the area of the animal pole. The micropyle was surrounded by 5 peaks of hill. An outer surface of the fertilized egg envelope was arranged by pore canals irregularly. In section of fertilized egg, the egg envelope consistes of three layers, an outer adhesive layer, a middle electron dense layer and an inner lamellae layer consisting of 9 layers. These ultrastructural characters of fertilized egg envelope from pale chub can be utilized in taxonomy of teleost.

  • PDF

Analytical and Experimental Study on the Damping of Vibrating Layered Plates Including the Effects of Shear and Thickness Deformation of the Adhesive Layer (접착제층의 전단과 법선변형 효과를 고려한 적층판의 진동감쇠특성 연구)

  • 김재호;박태학
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.16 no.7
    • /
    • pp.1244-1254
    • /
    • 1992
  • This paper investigates the vibrational damping characteristics of laminated plates composed of elastic, viscoelastic and elastic layers by theoretical and experimental methods. Laminated plates are in cylindrical bending and visco-elastic adhesive layer is assumed as the visco-elastic spring which takes damping effect through both shear and normal deformations. Governing equations oof laminated plates are derived in the form of simultaneous first order differential equations, which account for the longitudinal displacements, rotary inertia and shear deformations of elastic base plate and elastic constraining plate. The numerical calculations of the equations are illustrated by the applications to the cantilever beam in transverse vibration. The results of the solutions agree well with the experimental measurements in general. The damping effects due to the shear and thickness deformations in the adhesives are analyzed and it is shown that for thicker adhesives, the damping effect due to thickness deformation becomes significant and for thinner adhesives, due to shear deformation.

Effects of Hardeners and Catalysts on the Reliability of Copper to Copper Adhesive Joint (Cu-Cu 접착부의 고온고습 내구성에 미치는 경화제 및 촉매제의 영향)

  • Min, Kyung-Eun;Kim, Hae-Yeon;Bang, Jung-Hwan;Kim, Jong-Hoon;Kim, Jun-Ki
    • Korean Journal of Materials Research
    • /
    • v.21 no.5
    • /
    • pp.283-287
    • /
    • 2011
  • As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

Effect of Rice Straw Steaming Time and Mixing Ratio between Acacia mangium Willd Wood and Steamed Rice Straw on the Properties of the Mixed Particleboard

  • Tran, Van Chu;Le, Xuan Phuong
    • Journal of Forest and Environmental Science
    • /
    • v.31 no.2
    • /
    • pp.119-125
    • /
    • 2015
  • This study examined the effects of rice straw steaming time and mixing ratio between rice straw and wood particle on the properties of mixed particle board from Acacia mangium Willd wood and rice straw. Rice straw and Acacia mangium Willd wood were collected in Hanoi, Vietnam. The particle board was three-layer particle board with the structural ratio of 1:3:1. The thickness, density and board size of the particle board were 18 mm, $0.7g/cm^3$, and $800{\times}800{\times}18$ (mm, including trimming), respectively. A resin mixture between commercial Urea-formaldehyde (U-F) adhesive and methylene diphenyl isocyanate (MDI) adhesive was used with a dosage of 12% for the core layer and 14% for the surface layer. In this experimental design, the steaming time for rice straw was 15, 30, 45, 60, and 75 minutes at $100^{\circ}C$. The rice straw-wood mixing ratio was 10, 20, 30, 40, and 50%. The results showed that both mixing ratio and steaming time affect the properties of the particleboard, but the mixing ratio has a stronger impact. A higher mixing ratio and a longer steaming time resulted in a better quality of particleboard. The optimal steaming time for rice straw was 46.12 minutes with the straw-wood mixing ratio of 29.85% with the following characteristics of the particle board: the modulus of rupture (MOR) of 14.64 MPa, internal bond strength (IB) of 0.382 MPa, thickness swelling (TS) of 8.83%, and board density of $0.7-0.7g/cm^3$.

REWETTING EFFECT OF WATER-BASED PRIMER ON THE AIR-DRIED DENTIN (공기건조된 상아질에 대한 수분함유 primer의 재습윤효과)

  • Kim, Ki-Young;Park, Jeong-Kil;Hur, Bock
    • Restorative Dentistry and Endodontics
    • /
    • v.28 no.6
    • /
    • pp.498-503
    • /
    • 2003
  • The purpose of this study was to evaluate the rewetting effect of water-based primer on the air-dried dentin. In this in vitro study, freshly extracted non-caries human molars and three-step adhesive system(SBMP) were used. Freshly extracted non-caries human molars and three-step adhesive system(SBMP) were used. Flat occlusal dentin surface were prepared using low-speed diamond saw, Prepared teeth were randomly divided into three groups. Group 1.(W): etched(35% phosphoric acid for 15s) and blot-dried, Group 2.(5D): 5s air-dried, Group 3.(30D): 30s ail-dried, To obtain color contrast in CLSM observation, primer was mixed with rhodamine B and bonding resin was mixed with fluorescein. Microscopic sample of each group were obtained after longitudinal section. Morphological investigation of resin-dentin interface and thickness of hybrid layer measurement using CLSM were done. Microtensile bond strength for each specimen was measured. Specimen were observed under microscope to examine the failure patterns of interface between resin and dentin. The results of this study were as follows: 1. The results(mean) of Thickness of hybrid layer were W:19.67, 5D:20.9, 30D:10$\mu\textrm{m}$. Only 30D had statistically significant differences to Wand 5D(P<0.05). 2. The results(mean) of Microtensile bond strength were W:16.02, 5D:14.69, 30D:11.14MPa. Only 30D had statistically significant differences to Wand 5D(P<0.05). 3. There were positive correlation between Thickness of hybrid layer and microtensile bond strength(P<0.05).

Preparation and Physical Properties of Aqueous Polyurethane Based on Mono Methyl Ether for Skin Layer Coating (Skin layer 코팅에 사용되는 Mono Methyl Ether 기반 수성 폴리우레탄의 제조 및 물리적 성질)

  • Lee, Joo-Youb
    • Journal of the Korean Applied Science and Technology
    • /
    • v.36 no.2
    • /
    • pp.524-530
    • /
    • 2019
  • In this study, polyether polyol polypropylene glycol and isophorone diisocyanate (IPDI) were synthesized based on polyrupopylene mono methyl eher (PM) for the synthesis of water - soluble polyurethane for coating on leather skin layer. After synthesis of prepolymer, PM was added at $40^{\circ}C$ to 1M, 2M, 3M, and 4M to inhibit the viscosity rise, and neutralization reaction and chain extension reaction were carried out to prepare polyurethane samples. According to the measurement results of the tensile strength, elongation and adhesive strength of the prepared sample, the tensile strength was 2.109 kgf / mm2 for PM 1M, 1.721kgf / mm2 for 4M, elongation was 496% for PM 1M, 522% for 4M, adhesion was 1.114 kgf / cm for PM 1M and 0.99 kgf / cm for 4M.

Measurement of Material Property of Thin Film and Prediction of Residual Stress using Laser Scanning Method (레이저 주사법을 이용한 박막 물성 측정 및 잔류응력 예측)

  • Lee, Sang-Soon
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.11 no.4 s.33
    • /
    • pp.49-53
    • /
    • 2004
  • Polymeric materials are widely used in the electronic industry as a common dielectric material or adhesive. The polymeric layer coated on Si substrate can be subjected to thermal stresses due to difference in thermal expansion coefficients. The mismatch in thermal properties between the polymeric layer and the substrate results in significant residual stresses. In this study, the thermal deformation is measured by a curvature measurement method using laser scanning, and the elastic modulus is calculated by an analytic model.

  • PDF