• Journal of the Korean Society of Safety
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• v.25 no.1
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• pp.1-8
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• 2010

The tensile and fatigue experiments were conducted with tensile-shear specimens for investigating the strength of adhesive bonded and mechanical press joints of SPCC steel sheet used in the field of the automobile industry. The optimal punch press force was evaluated 50kN for combining epoxy adhesive bonding and mechanical press joining with a diameter of 8.3mm using SPCC sheet with a thickness of 0.8mm. The combining epoxy adhesive bonding and mechanical press joining exhibits the maximum tensile force of 750N. The fatigue strengths of the combination of adhesive bond and mechanical press joint and pure adhesive joint were evaluated 370N and 320N at 106cycles, respectively. These values correspond to 22% and 20% of their maximum tensile forces, respectively. However, the fatigue strength of the combination of adhesive bond and mechanical press joining was much lower than that of pure mechanical press joining.

• Proceedings of the KWS Conference
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• 1996.10a
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• pp.70-74
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• 1996

• The Journal of the Korea Contents Association
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• v.19 no.5
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• pp.624-631
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• 2019

The purpose of this study was to observe the influence of adhesive force of lifter on powdered fingermark. First, an experiment was conducted to measure the adhesive force of five kinds of lifters. Second, each fingermark deposited on slide glass was developed using four kinds of powders. Then, these were transferred to lifter, and the quality of the transferred fingermark was observed. As a result of measuring the adhesive force of the lifter using the ASTM D3121-17 rolling ball tack method, the difference in adhesion between the lifters except the gelatin lifter was small. Also, it was confirmed that the quality of the transferred fingermark was not significantly related to the adhesive force of the lifter. However, if the quality of the transferred fingermark is not good when transferring to a gelatin lifter which is a lifter having a weak adhesive force, additional transfer is possible.

• Design & Manufacturing
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• v.10 no.1
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• pp.36-40
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• 2016

Connectors transmit electric signals to different parts in compact mobile display products. As products that apply this have become lightweight and smaller in size, there are growing demands for smaller and more integrated connectors, which are internal parts of the products. As a measure to address these demands, there is the planar array connector that minimizes the part by arranging the single-direction BTB connectors to two directions. As connectors become smaller in size and more highly integrated, maintaining intensity to prevent defects during impact and maintaining adhesive force to smoothly transmit electric signals are growing in importance. Thus, in order to identify the impact of concave shaping on improving adhesive power in connector terminal pins as a method to increase the connecting power of planar array connector terminal pins, this study predicted and examined the concave shaping method, number of concave shapes, and the adhesive power according to the size of the concave shape through CAE. For concave shaping, the model that added concave shaping towards the lower part of the connector terminal pin and added spokes for the area pressed down by the concave shaping was 0.74 N, showing increased adhesive force compared to existing models. Furthermore, when applying two concave shaping, rather than just one, there was a tendency for adhesive force to increase. In the case of adhesive power trends according to the size of the concave shaping, adhesive power increased and the width of the concave shape decreased, and the biggest adhesive force trends were shown when the concave shaping depth was 0.01mm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.635-638
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• 2000

It is necessary to work on a vertical plane of workpiece in order to produce a large structure like a ship. These works can be automated by using the robot with permanent magnet wheels. We developed the permanent magnet wheel which can be used by a mobile robot and easily detached. We enhanced an adhesive power by restricting the occurrence direction of magnetic flow. And we also developed a method which weakens adhesive magnetic force by changing magnetic flow with metal pins. We used the load cell and the gaussmeter to measure the characteristics of the adhesive force and magnetic force. We obtained the result that the adhesive power is reduced to 1/3 of normal state by using 4 inducing pins.

• Elastomers and Composites
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• v.44 no.2
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• pp.112-115
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• 2009

In nature, some creatures have the ability to walk vertically or upside down on various natural surfaces. One of them, Tokay Gecko has billions of nano-hair at the epidermis of its digital. These nano hairs makes atomistic attractive force to the surface, therefore, it could walk and run on the vertical or upside surfaces. Recently, many researchers tried to fabricate the dry adhesive structure mimicking the nano-hair structure. in this study, I tried to survey these studies to discuss the direction of future fabrication works of dry adhesive structures.

• Journal of the Semiconductor & Display Technology
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• v.14 no.4
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• pp.1-7
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• 2015

People are always pursuing the aesthetic feeling relentlessly. But some people have such problems with their hairs like alopecia, cancer chemotherapy, burns, and scalp injury. So the synthetic hair has played a very important role to make up for these deficiencies. But long term use can lead to adverse reactions or uncomfortable feeling. This is primarily caused by its properties differ with human hair. In particular, nanotribological characterizations (roughness, friction force and adhesive force) of synthetic hair surface are dissatisfy with the needs of normal hairs. This paper presents the experiments on nanotribological characterizations measurements of human hairs (coloring hair, permed hair and common hair) in shampooing condition or without shampooing condition. Using atomic force microscopy (AFM) to find out a range of synthetic hair nanotribological characterizations which can correspond with natural hair. The measurements of nanotribological characterizations focus on surface roughness, friction force and adhesive force, and a new design of AFM probe was used for measuring the nanotribological characterizations.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.3 s.192
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• pp.140-146
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• 2007

To understand adhesive phenomena, we need to get force curve between two surfaces. And it is said that high stiffness force analysis system is needed to get precise force curve and more information of the surfaces. Usually the stiffness of the force measurement system is under the order of 10N/m. The stiffer force measurement system, however, results in more information on the surface, because higher stiffness lead to the wider range of force curves, secondly because the force curve obtained through the stiffer one describes more precise relationship between relative tip-sample separation and interaction force. In this paper, considering for stiffness and resolution, the cantilever was designed and we made adhesion force measurement apparatus with high stiffness and high resolution, so we measured adhesive force between Ag-ball and wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.175-176
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• 2010