• The Research Journal of the Costume Culture
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• v.31 no.6
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• pp.738-755
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• 2023

The purpose of this study is to provide basic data for the production of jackets with high fit by comparing and analyzing the adhesive and non-adhesive production methods of men's jackets. An analysis of the manufacturing method showcased differences between the adhesive and non-adhesive manufacturing methods in the cutting and wick attachment method, the shape and attachment method of the chest reinforcing wick, the sleeve attachment method, and the shoulder pad and sleeve reinforcing cloth attachment method. In evaluating the outfit, the overall fit of the shoulder, the fit of the chest, and the fit of the armpit were found to be high in the non-adhesive production method. In evaluating appearance evaluation, the front shoulder, chest, and sleeve overall appearance showed a high non-adhesive production method. Therefore, in order to increase the wearability of the shoulder pad and the the attachment method of the upper sleeve reinforcing cloth, the non-adhesive production method should be used, and in order to increase the overall wearability and armpit wear of the chest, the difference in the attachment method, and the reinforcement method of the armhole should be used. In addition, to increase the appearance of the jacket, non-adhesive production methods such as differences in wick attachment methods, shoulder pads, sleeve reinforcing cloth, and sleeve attachment methods should be used.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.421-425
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• 2007

In the fabrication of dry adhesive structure, increasing contact-points or contact-area is the primary goal because the adhesive force grows in proportion to the contact-area. The simplest way to extend the contact surface is the fabrication by using soft materials. However, the column-array structure could confront the matting phenomenon which columns are stuck together. Therefore, we need a novel design to reduce the effective stiffness with adequate stiff materials like a gecko's setae. In this study, we propose a novel design for the dry adhesive structure. Moreover, we analyzed whether the adhesive structure conforms the rough surface sufficiently through finite element method adopted the non-bonding interaction as the body force. Also, we fabricated the novel structures via UV lithography and some techniques. In addition, we examined the adhesive force of the novel structures.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.832-837
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• 2006

Antennas were fabricated by physical(adhesive) and chemical(deposition+plating) method on organic-inorganic composite material. And antennas were measured dielectric constant and gain. Dielectric constant of antennas were fabricated by physical method was decreased with increase of adhesive tape thickness and number of conduction material composition. But antennas were fabricated by chemical method was reached to 90 % of dielectric material. Gain of antennas were fabricated by physical method was decreased with increase of adhesive tape thickness. But they were unrelated with conduction material composition. The other side antennas were fabricated by chemical method excelled more 0.8 dBic than antennas were fabricated by physical method in gain of antenna. Finally, chemical method can expect excellent product process because it can produce smaller size, higher gain and elimination of many handworks.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.21-24
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• 2002

In this paper, for the study on the fabrication of YBCO superconductor wire, a double layered YBCO superconductor wire was fabricated by electrophoretic method on metal Ag wire(${\Psi}$0.8 mm). On the basis of previous researches for the fabrication of superconductor wire, the acetone suspension solution with 8 vol.% of 1% PEG(1000) was used and high molecular adhesive was experimentally performed for an improvement of the critical current density of superconductor wire. It was found that the Ag inter-layer deposited on the superconductor wire affect to the state of second YBCO film and its critical current density.

• Journal of Power System Engineering
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• v.2 no.3
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• pp.41-48
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• 1998

This study was aimed at development of fabrication process of functionally graded materials(FGM), consisting of metal and ceramic by thermal spraying method. NiCrAIY/$Al_2O_3$ FGM were made by using plasma spraying onto the SS400 carbon steel substrate. And mechanical properties such as microhardness, thermal shock resistance and adhesive strength of the coating layer were investigated. Adhesive strength was evaluated by acoustic emission method. It was resulted that NiCrAIY/$Al_2O_3$ FGM made by thermal spraying method showed excellent thermal shock resistance and adhesive strength compared to the other lamellar structures of sprayed coatings and that AE is useful tool to evaluate the defect of thermal sprayed coating layer.

• Composites Research
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• v.13 no.4
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• pp.42-53
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• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.73-76
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• 2020

Silver nanowires (AgNWs) intrinsically possess high conductivity, ductility, and network structure percolated in a low density, which have led to many advanced applications of transparent and flexible electronics. Most of these applications require patterning of AgNWs, for which photolithographic and printing-based techniques have been widely used. However, several drawbacks such as high cost and complexity of the process disturb its practical application with patterning AgNWs. Herein, we propose a novel method for the patterning of AgNWs by employing UV-curable adhesive tape with a structure of liner/adhesive layer/polyolefin (PO) film and UV irradiation to simplify the process. First, the UV-curable adhesive tape was attached to AgNWs/polyurethane (PU), and then selectively exposed to UV irradiation by using a photomask. Subsequently, the UV-curable adhesive tape was peeled off and consequently AgNWs were patterned on PU substrate. This facile method is expected to be applicable to the fabrication of a variety of low-cost, shape-deformable transparent and wearable devices.

• KSBB Journal
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• v.24 no.6
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• pp.515-520
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• 2009

This study presented facile method of cell patterning using fabricated PDMS patterns on polyelectrolyte coated surface. This basic principle is the fabrication of functional surface presenting two orthogonal surfaces such as cell adhesive and repellent properties. Cell adhesive surface was firstly fabricated with simple coating of polyelectrolyte multilayer. And then, the desired patterns of PDMS for the prevention of nonspecific binding of cells were transferred onto the previously formed thin film of polyelectrolyte multilayer. Thus, we could prepare novel functional surface simultaneously containing PDMS and polyelectrolyte region. As expected, the PDMS regions showed effective prevention of nonspecific binding of cell and the other region, exposed polyelectrolyte area, provided cell adhesive environment. The height of formed PDMS structure was about 100 nm. Based on this method, cell patterning can be successfully obtained with various pattern shapes and sizes. Therefore, we expect that this simple method will be useful platform technology for the development of cell chip, cell based assay system, and biochip.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.563-563
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• 2012

We report a one-step fabrication of single-crystal organic nanowire arrays on substrates using a new direct printing method (liquid-bridge-mediated nanotransfer moulding, LB-nTM), which can simultaneously enable the synthesis, alignment and patterning of the nanowires using molecular ink solutions. Two- or three-dimensional complex structures of various single-crystal organic nanowires were directly fabricated over a large area with a successive process. The position of the nanowires can be aligned easily on complex structures because the mold is movable on substrates before drying the polar liquid layer, which acts as an adhesive lubricant. This efficient manufacturing method can produce a wide range of optoelectronic devices and integrated circuits with single-crystal organic nanowires.

• Structural Engineering and Mechanics
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• v.84 no.6
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• pp.799-811
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• 2022

Adhesive bonding has seen rapid development in recent years, with emphasis to composite patch repairing processes of geometric defects in aeronautical structures. However, its use is still limited given its low resistance to climatic conditions and requirement of specialized labor to avoid fabrication induced defects, such as air bubbles, cracks, and cavities. This work aims to numerically analyze, by the finite element method, the failure behavior of a damaged plate, in the form of a bonding defect, and repaired by an adhesively bonded composite patch. The position and size of the defect were studied. The results of the numerical analysis clearly showed that the position of the defect in the adhesive layer has a large effect on the value of J-Integral. The reduction in the value of J-Integral is also related to the composite stacking sequence which, according to the mechanical properties of the ply, provides better load transfer from the plate to the repair piece through the adhesive. In addition, the increase in the applied load significantly affects the value of the J-Integral at the crack tip in the presence of a bonding defect, even for small dimensions, by reducing the load transfer.