• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.33-36
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• 2006

Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

• Elastomers and Composites
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• v.33 no.4
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• pp.267-273
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• 1998

Isocyante terminated urethane prepolymers were synthesized by the reaction of 4,4'-dimethyl phenyldiisocyanate(MDI) and ester type polyols such as ethylene glycol/ butanediol adipate(EBA), neopentylglycol/butanediol adipate (NBA) and hexanediol adipate (HA) . All of the NCO-terminated urethane prepolymers are solid at room temperature, but they become mobile enough to be disposed onto a substrate upon heating about $80^{\circ}C$. Subsequently, they are solidified and cured through the reaction with moisture. Tensile behavior of the ore-thane hotmelt exhibits characteristic features depending on the type of polyol. The adhesive strength determined by single lap shear joint is higher in order of HA, NBA and EBA based ore thane hotmelt, which can be correlated with the magnitude of breaking energy of the cured films. The failure mode are cohesive for all cases and the adhesive strength increases as the test is performed faster. This indicates that the strength of the adhesive joint is primarily dependent upon the bulk properties of the adhesives.

• Journal of Adhesion and Interface
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• v.23 no.4
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• pp.108-115
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• 2022

In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, ¹H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.6
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• pp.449-453
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• 2021

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

• Transactions of Materials Processing
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• v.31 no.1
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• pp.29-38
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• 2022

Recently, the composite material market is gradually growing. Various composite forming processes have been developed in order to reduce the production cost of the composite material. Unlike the conventional forming process, the microwave composite forming process has the advantage of reducing the processing time because the composite material is heated directly or indirectly at the same time. Due to this advantage, in this study, a double cantilever beam test was conducted with specimens manufactured by the microwave composite forming process. The purpose of this study was to compare mode-I energy release rate for specimens manufactured by prepreg compression forming and microwave composite forming processes. First, a microwave oven was proposed to conduct the microwave composite forming process. Double cantilever beam specimens were manufactured. After that, the double cantilever beam test was conducted to obtain the mode-I energy release rate. Mode-I energy release rates of specimens manufactured by the microwave composite forming and prepreg compression forming processes were then compared. As a result, mode-I energy release rates of specimens fabricated by the microwave composite forming process were similar to those fabricated with the prepreg compression forming process with a relatively reduced process time.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.81-87
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• 2011

In this study, UV curing and crosslinking process was introduced for synthesis of acrylic foam tape that can be applied to the the automotive assembly process. Polymerized adhesive are laminated to baseform and varying the thickness of specimens were prepared. To measure basic mechanical properties, stainless steel was used. And in the test peel, dynamic shear and t-block were used. The acrylform adhesive show better results compare with typical adhesive and the properties depand on external factors - thick, wetting time -. To analysis functions of acrylic foam adhesive used to automobile production, evaluate the adhesive properties on the various plastic substrate. In PP and PE are categorized low surface energy materials, their properties have not been expressed. But dynamic shear tests show that some properties could be expressed by the difference break mechanism.

• Composites Research
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• v.16 no.5
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• pp.45-53
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• 2003

The experimental and numerical investigations on the failure characteristics of the secondary bonded composite single-lap joints were performed. The initiations and growths of cracks were observed using CCD camera and acoustic emission sensor during the tension tests of the joint specimens. The structural behaviors of the specimens were predicted by the geometric nonlinear two-dimensional finite element analysis. The three types of observed initial cracks were included in each finite element models and the strain energy release rates of each specimen models were calculated by VCCT(Virtual Crack Closure Technique) technique. The tension tests showed that the initial cracks occurred in the 60∼90% of final failure loads and the major failure modes of the specimens were adhesive failure and the delamination between the 1st and 2nd ply of laminate. The specimens with the thicker bondline had earlier crack initiation loads but higher crack propagation resistance and eventually better loading capability. The delaminations were mostly observed in the thicker bondline specimens. The mode I values of calculated strain energy release rates were higher than the mode II values in the all specimen models considering the three types of initial cracks. The mode I and total strain energy release rates were calculated as higher values in the order of initial crack in the edge interface, comer interface and delamination between the plies of laminate.

• Resources Recycling
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• v.32 no.6
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• pp.3-9
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• 2023

Separation of LED packages from PCBs and analysis of the adhesive components was conducted to enhance the recycling potential of LED modules. LED package was separated from PCBs using heat treatment under optimal conditions: temperature of above 250 ℃ and time of 20 minutes. The separation equipment can be established using a hot air injector with controlling the rotational speed of the internal screw. The separation efficiency of each type of substrate (aluminum and glass fiber) was investigated with the thickness range of the adhesive materials (0.25-0.30 and 0.30-0.35 mm). Under the optimal conditions, the efficiency can reach to 97.5% for both types of substrates with adhesive materials of thickness 0.25~0.30mm. Characterization of the residual adhesive substances from the separated LED package and PCB using microwave digestion and ICP analysis showed that the residue contained of 95% of Sn, less than 5% of Cu and Ag.

• Journal of Pharmaceutical Investigation
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• v.15 no.2
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• pp.45-52
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• 1985

For the model tablets using mannitol and Avicel PH 101 as excipients, the patterns of disintegration and dissolution from the differences of physical properties were investigated. It was found that the patterns in the dissolution and binding forces in the interaction of materials by estimates of solid-solid or liquid surface free energy due to cohesive or adhesive properties of materials, and solid surface free energy in binding forces of tablet should be considered as an important factor in dissolution processes.

• Steel and Composite Structures
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• v.20 no.6
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• pp.1275-1303
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• 2016

Steel plates and carbon-fiber-reinforced polymer (CFRP) laminates or plates bonded to concrete substrates have been widely used for concrete strengthening. However, this technique cause plate debonding, which makes the strengthening system inefficient. The main objective of this study is to enhance the bond strength of externally bonded steel plates and CFRP laminates to the concrete surface by proposing new embedded adhesive and steel connectors. The effects of these new embedded connectors were investigated through the tests on 36 prism specimens. Parameters such as interfacial shear stress, fracture energy and the maximum strains in plates were also determined in this study and compared with the maximum value of debonding stresses using a relevant failure criterion by means of pullout test. The study indicates that the interfacial bond strength between the externally bonded plates and concrete can be increased remarkably by using these connectors. The investigation verifies that steel connectors increase the shear bond strength by 48% compared to 38% for the adhesive connectors. Thus, steel connectors are more effective than adhesive connectors in increasing shear bond strength. Results also show that the use of double connectors significantly increases interfacial shear stress and decrease debonding failure. Finally, a new proposed formula is modified to predict the maximum bond strength of steel plates and CFRP laminates adhesively glued to concrete in the presence of the embedded connectors.