• Structural Engineering and Mechanics
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• 제20권5호
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• pp.589-608
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• 2005

There is a growing need for the development and implementation of new methods for the rapid and cost-effective rehabilitation of deteriorating steel structural components to offset the drawbacks related to welding and/or bolting in the field. Carbon fiber reinforced polymer (CFRP) composites provide a potential alternative as externally bonded patches for strengthening and repair of metallic structural members for building and bridge systems. This paper describes results of an investigation of tensile and fatigue response of steel/CFRP joints simulating scenarios of strengthening and crack-patching. It is shown that appropriately designed schemes, even when fabricated with levels of inaccuracy as could be expected in the field, can provide significant strain relief and load transfer capability. A simplified elasto-plastic closed form solution for stress analysis is presented, and validated experimentally. It is shown that the bond development length remains constant in the linear range, whereas it increases as the adhesive is deformed plastically. Fatigue resistance is shown to be at least comparable with the requirements for welded cover plates without attendant decreases in stiffness and strength.

• Journal of the Korean Wood Science and Technology
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• 제39권6호
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• pp.498-504
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• 2011

The purpose of this study was to investigate and develop an eco-frendly wood adhesive based on vegetable oil (especially soybean oil), the renewable and sustainable natural resources, using ozonification technology for the chemical structure modification. The waste soybean oil (WSBO) was reacted with $O_3$ at the rate of $450m{\ell}$(acetone) : $50m{\ell}$ (WSBO) for different times, 1, 2, 3 hrs. The investigation of the modified chemical strecture of the ozonied WSBOs were conducted using FT-IR. As ozonification time increased, the peak of the unsaturated double bonds was disappeared especially ozonized-3hrs and aldehyde or carboxyl peak appeared because ozonification broke the oil into small molecules. The plywood were made at $150^{\circ}C$ with 4 minutes hot-press time using the different ozonized 3 hrs WSBO/pMDI adhesives and were tested for the dry, wet, cyclic boil test according to the Korea Industrial Standard F3101 Ordinary plywood. The bond strengths gradually increased until 1 : 0.5~1 : 3, but it decreased 1 : 4, as the contents of pMDI increased. The results of the dry, wet and cyclic bond strengths the equivalent ratio was formed approximately between 1 : 2~1 : 3. And the 1 : 1~1 : 4 strengths met constantly the standard requirement of 7.0kgf/$cm^2$ (KS F3101). From the comprehensive view on the results of above experiment, it could be confirmed that ozonized WSBO/pMDI has characteristics of effective reactivity and wet stability showed as an excellent candidate of wood adhesive applications.

• 접착 및 계면
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• 제22권4호
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• pp.128-135
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• 2021

본 연구에서는 acid group을 포함하는 acid 폴리올을 합성하였고, acid 폴리올을 함량별로 도입하여 신규 폴리우레탄 접착제를 개발하였다. Acid 폴리올 도입하였을 때 acid content가 0.1~0.3 wt%일 때 기계적 물성이 최댓값을 나타냈으며, 0.5 wt% 이상의 함량에서는 기계적 물성 및 접착 강도가 감소하는 것을 확인하였다. Acid group으로는 carboxylic acid와 sulfuric acid를 도입하여 특성을 비교하였으며, carboxylic acid가 sulfuric acid보다 강한 수소 결합력을 보이며 기계적 물성을 향상시켰다. 또한, ZnO와 CaCO₃를 도입하여 입자의 크기와 물성의 상관관계를 확인하였다. ZnO와 CaCO₃를 도입한 경우 acid group과 이온결합이 형성되어 기계적 물성이 증가하는 것을 확인하였다.

• Restorative Dentistry and Endodontics
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• 제44권2호
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• pp.13.1-13.9
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• 2019

Objectives: This study evaluated the effect of dentin pretreatment with silver nanoparticles (SNPs) and chlorhexidine (CHX) on the microshear bond strength (${\mu}SBS$) durability of different adhesives to dentin. Materials and Methods: Occlusal surfaces of 120 human molars were ground to expose flat dentin surfaces. The specimens were randomly assigned to six groups (n = 20). Three groups (A, B, and C) were bonded with Adper Single Bond 2 (SB) and the other groups (D, E, and F) were bonded with Clearfil SE Bond (SEB). Dentin was pretreated with CHX in groups B and E, and with SNPs in groups C and F. The specimens were restored with Z250 composite. Half of the bonded surfaces in each group underwent ${\mu}SBS$ testing after 24 hours and the other half was tested after 6 months of water storage. Results: SNP application was associated with a higher ${\mu}SBS$ than was observed in the CHX and control groups for SEB after 24 hours (p < 0.05). A significantly lower ${\mu}SBS$ was observed when no dentin pretreatment was applied compared to dentin pretreatment with CHX and SNPs for SB after 24 hours (p < 0.05). The ${\mu}SBS$ values of the 6-month specimens were significantly lower than those obtained from the 24-hour specimens for all groups (p < 0.05). This decrease was much more pronounced when both adhesives were used without any dentin pretreatment (p < 0.05). Conclusions: SNPs and CHX reduced the degradation of resin-dentin bonds over a 6-month period for both adhesive systems.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2003년도 제120회 추계학술대회 제 5차 한ㆍ일 치과보존학회 공동학술대회
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• pp.601-601
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• 2003

AQ Bond Plus has the function of self-etching priming adhesive, which can be applied by single coating without second coating, being different from conventional AQ bonds. Moreover, because the absorption range of light became wider, the bond can comply with any visible light curing units. Thus, the bond can produce an unified form between the dentine layer with impregnated resin of good quality and the thin and hard film characteristically. In this study, we investigated the junctional conditions of AQ Bond Plus, using a scanning electron microscope (SEM).(omitted)

• Restorative Dentistry and Endodontics
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• 제19권1호
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• pp.114-123
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• 1994

The purpose of this study was to examine the shear bond strength of resin-enamel bond formed at specific time intervals after the termination ov vital bleaching. A total of 72 human extracted maxillary premolars were divided into nine groups : untreated control (group 1) ; enamel treated with 35% hydrogen peroxide(group 2, 3, 4, 5) ; and enamel reated with 15% carbamide peroxide gel (group 6, 7, 8, 9). After the treatment with 35% hydrogen peroxide for 2 hours and 15% carbamide peroxide for 24 hours, adhesion of a resin to bleached enamel was formed at 1 hour (group 2, 6) and 24 hours(group 3, 7) ; 3days(group 4, 8) and 7 days(group 5, 9) post-termination of bleaching treatment. A $3{\times}3mm$ mold was filled with Scotchbond Multi-Purpose and Z100. After 24 hours later, the specimens were shear-tested at crosshead speed 1mm/min and analyzed statistically. Fractured specimens from group 1,2, 6 were gold-coated with Eiko ion coater and observed under Scanning electron microscope at 25KV. The following results results were obtained : 1. Bonds formed at 1 hour post-termination of 35 % hydrogen peroxide(P<0.01) and 15 % carbamide peroxide bleaching treatment groups(P<0.05) showed significantly lower shear bond strength than untreated group. 2. Bonds formed at 24 hours, 3 days and 7 days post-termination of 35% hydrogen peroxide and 15 % carbamide peroxide bleaching treatment groups showed no significant differences in shear bond strength with untreated group(p>0.05). 3. SEM examinations of the untreated fracture specimen indicated cohesive fracture within enamel and exposed enamel prisms, but the bleached fracture specimens indicated adhesive fracture.

• 분석과학
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• 제31권2호
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• pp.78-87
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• 2018

옻은 우리나라를 포함하여 중국, 일본, 동남아시아 등에서 접착제와 도료로 사용되어 왔다. 옻의 경화 특성을 이해하기 위해서는 경화에 따른 화학구조 변화를 파악해야 하며 이를 위해 본 연구에서는 불용성 고분자 분석에 유용한 열분해/GC/MS 방법을 이용하였다. 우선, 건조시킨 옻 도막을 온도를 변화시키면서 열분해했을 때 $500^{\circ}C$ 이상에서 대부분 물질의 열분해가 일어났다. $500^{\circ}C$에서 열분해했을 때 반복성은 2.6~22.3 %로 양호하였으나, 시료량에 따른 열분해 산물 패턴에 차이가 있었다. 열분해 크로마토그램에서 1,2-benzenediol, 3-methyl-1,2-benzenediol 등 우루시올에서 기인하는 옻의 특징적인 성분을 확인하였다. 건조가 진행됨에 따라 열분해산물 중 탄소이중결합 3개를 갖는 우루시올이 포화 우루시올에 비해 크게 감소하여 고분자화가 이중결합과 관련됨을 알 수 있었다. 연구결과에 의해 설정된 분석조건은 출토유물에서 옻을 확인하거나 건조에 따른 옻의 성분 변화를 파악하는데 활용될 수 있을 것으로 보인다.

• Corrosion Science and Technology
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• 제7권1호
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• pp.50-60
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• 2008

The majority of the described experimental results deal with relatively pure aluminium. Variations were made in the pretreatment of the aluminum substrates and an investigation was performed on the resulting changes in oxide layer composition and chemistry. Subsequently, the bonding behavior of the surfaces was investigated by using model adhesion molecules. These molecules were chosen to represent the bonding functionality of an organic polymer. They were applied onto the pretreated surfaces as a monolayer and the bonding behavior was studied using infrared reflection absorption spectroscopy. A direct and clear relation was found between the hydroxyl fraction on the oxide surfaces and the amount of molecules that subsequently bonded to the surface. Moreover, it was found that most bonds between the oxide surface and organic functional groups are not stable in the presence of water. The best performance was obtained using molecules, which are capable of chemisorption with the oxide surface. Finally, it was found that freshly prepared relatively pure aluminum substrates, which are left in air, rapidly lose their bonding capacity towards organic functional groups. This can be attributed to the adsorption of contamination and water to the oxide surface. In addition the adhesion of a typical epoxy-coated aluminum system was investigated during exposure to water at different temperatures. The coating was found to quite rapidly lose its adhesion upon exposure to water. This rapid loss of adhesion corresponds well with the data where it was demonstrated that the studied epoxy coating only bonds through physisorptive hydrogen bonding, these bonds not being stable in the presence of water. After the initial loss the adhesion of the coating was however found to recover again and even exceeded the adhesion prior to exposure. The improvement could be ascribed to the growth of a thin oxyhydroxide layer on the aluminum substrate, which forms a new, water-stable and stronger bond with the epoxy coating. Two routes for improvement of adhesion are finally decribed including an interphasial polymeric thin layer and a treatment in boiling water of the substrate before coating takes place. The adhesion properties were finely also studied as a function of the Mg content of the alloys. It was shown that an enrichment of Mg in the oxide could take place when Mg containing alloys are heat-treated. It is expected that for these alloys the (hydr)oxide fraction also depends on the pre-treatment and on the distribution of magnesium as compared to the aluminium hydroxides, with a direct impact on adhesive properties.

• 한국전기전자재료학회논문지
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• 제22권3호
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

• 한국진공학회지
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• 제6권S1호
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• pp.122-126
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• 1997

the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form $1.5\times$1015 to 15$\times$1015 ions/cm2. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy and x-ray emission spectrocopy are employed to investigate the chemical bonds and the interlayer compound formation of the films Cu/Al/polyimide showed more adhesion strength than Cu/polyimide after ion beam mixing and N2+ ions are more effective in the adhesion enhancement than Ar+ with the same sample geometry. The XES results shows the formation of interlayer compound of CuAl2O4 which can reflect more adhesive Cu/Al/polyimide which has not been reported previously. The latter results is understood by the fact that N2+ ions produce more pyridinelike moiety, amide group and tertiary amine moiety whcih are known as adhesion promotors.