• 한국산학기술학회논문지
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• 제12권3호
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• pp.1479-1487
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• 2011

모바일 IT기기 등의 전자부품 분야에서 다기능, 고용량 메모리를 가능하게 하는 패키지의 중요성이 점차 증대되고 있다. 이러한 목적으로 여러개의 칩을 하나의 패키지에 실장하여 다기능, 고용량을 구현하는 Multi Chip Package(MCP)가 활용되고 있다. 이러한 MCP에서 칩과 칩간 접합 혹은 칩과 지지부재(substrate)간 접합을 구현하기위해 에폭시계 필름형 접착제가 사용되고 있다. 에폭시, 아민, 머캡탄, 아이소시아네이트 등의 유기 반응기를 가진 실란커플링제를 적용하여 에폭시계 필름형 접착제에 대한 점착성과 신뢰성을 확인하였다. 결과로부터 에폭시계 반응기를 가진 실란커플링제를 적용한 시료의 점착성과 필특성이 가장 뛰어났으며, 내습 테스트에서 계면파괴가 억제되어 가장 좋은 신뢰성을 나타내었다.

• 한국정밀공학회지
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• 제19권8호
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• pp.180-186
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• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• 폴리머
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• 제29권1호
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• pp.96-101
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• 2005

PTFE 및 PFA 등의 불소수지는 최대 연속 사용 온도가 260$^{\circ}C$에 달하는 고온 내열성 고분자 소재로서, 본 연구에서 수행된 280 $^{\circ}C$, 7주 간의 열노화에 의해서도 충분한 열적 안정성이 유지됨을 관측하였다. 그러나 기계적 강도, 융점 및 열분해 개시 온도 등의 소재적 물성이 유지됨을 의미하는 상기한 열적 안정성은 본 연구에서 수행된 코팅막으로서의 표면접촉각, 미세 모폴로지, 내스크래치성 분석에 의한 방법을 기준하면 충분하지 못하다는 것이 확인 되었다. 공기 치환율이 제어되는 기어식 노화시험기로 진행된 불소수지 코팅막의 280 $^{\circ}C$ 열노화에 대한 분석의 결과는 심각한 표면 모폴로지의 손상과 금속기재에 대한 접착력의 손실을 지적하고 있다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 A
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• pp.278-280
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• 1996

This paper presents a high performance AC propulsion system for electric car to improve traction capability. The presented VVVF inverter was composed of as GTO thyristor and the the controller was fully digitalized by using 32bit DSP. The improved PWM algorithms and the new adhesion control were adapted to improve traction characteristics. This system could be possible the higher reliability and flexibility. The field test results showed the higher performances characteristics of the presented system.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.43-43
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• 2003

Carbon nanotubes(CNTs) have many application points, which are field emission devices, composites, hydrogen storage, nanodevices, supercapacitor and secondary battery. The most promising application point is emitter tip mays of field emission devices. Furthermore, it may be also useful as a vacuum device for high frequency and high power. But, there are some obstacles to fabricate carbon nanotube field emission device. One is that CNTs grown by CVD method has weak adhesion with substrate and the other is non-uniform length of them. These problems are very crucial in aging property and reliability of device in the field emission.

• Journal of Electrical Engineering and Technology
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• 제9권1호
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• pp.214-230
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• 2014

This paper presents a high performance sensor less control four motorized wheels for electric vehicle. Firstly, we applied a sensor less master-slave DTC based control to both the two in wheel motors by using sliding mode observer for its quick response and its high reliability in electric vehicle application. Secondly, to overcome the possible loss of adherence of one of the four wheels which is likely to destabilize the vehicle a solution is proposed in this paper. Thirdly, a Fuzzy logic anti-skid control structure well adapted to the non-linear system is used to overcome the main problem of power train system in the wheel road adhesion characteristic. Various Simulation results have been include in this paper to show that the proposed control strategy can prevent vehicle sliding and show good vehicle stability on a curved path.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2001년도 제17회 학술발표회 논문초록집
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• pp.90-93
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• 2001

In the present work, ultrasonic testing method has been developed to evaluate adhesive layers in rocket motor case assembly for the reliability of the rocket. The main objective of the present work was to find debonding between steel and rubber layers. The relationship between adhesion ratio and reflected ultrasonic amplitude was calculated by considering reflection coefficient at the interface between steel and rubber layers. It was found that the higher amplitude of ultrasound is reflected for the debonding area, and shown good agreements with experimental results. The ultrasonic C-scan images offers good implements for the determination of debonding area. The nondestructive testing results were compared with the micrography of destruective testing. As results, ultrasonic testing could be utilized for the evaluation of adhesive layer in the rocket motor case assembly.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• Advanced Composite Materials
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• 제16권2호
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• pp.83-94
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• 2007

Woven sisal textile fiber reinforced composites were used to evaluate fracture toughness, tensile and three-point bending. The water absorption testing of all specimens was repeated five times in this study. All specimens were immersed in pure water during 9 days at room temperature, and dried in 1 day at $50^{\circ}C$. Two kinds of polymer matrices such as epoxy and vinyl-ester were used. Fractured surfaces were taken to study the failure mechanism and fiber/matrix interfacial adhesion. It is shown that it can be enhanced to improve their mechanical performance to reveal the relationship between fracture toughness and water absorption fatigue according to different polymer matrices. Water uptake of the epoxy composites was found to increase with cycle times. Mechanical properties are dramatically affected by the water absorption cycles. Water-absorbed samples showed poor mechanical properties, such as lower values of maximum strength and extreme elongation. The $K_{IC}$ values demonstrated a decrease in inclination with increasing cyclic times of wetting and drying for the epoxy and vinyl-ester.