• The Transactions of the Korean Institute of Electrical Engineers B
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• v.48 no.12
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• pp.709-714
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• 1999

This paper is focused on the adhesion control method to improve traction efficiency using the estimated adhesion for railway propulsion system. Recently, the wheel slippery is frequently occurred due to light weight of train and power increasement of traction parts. This phenomenon occurs a traction loss and a poor ride comport. Therefore, the adhesion control which is able to prevent the slippery and to control the traction on a maximum adhesion is absolutely needed. This paper introduces typical methods for adhesion control and proposes two novel adhesion methods using the estimated adhesion.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.109-114
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• 2002

The adhesion of electroless plated Ni layer on Al/Si substrates has been investigated. The zincating treatment was conducted with a conventional method and a modified method. In a modified method, ultrasonic agitation was applied during zincating. Adhesion strength was evaluated by a pull-off test. The ultrasonic agitation during zincating increased the nucleation density of Zn particles and refined Zn particle size. the adhesion strength of electroless Ni layer deposited on the modified zincated surface was higher than that on the conventionally zincated surface. the improvement of adhesion was attributed to the fine and dense Zn particles.

• Korean Journal of Materials Research
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• v.19 no.8
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• pp.437-442
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• 2009

This paper describes an improved strategy for controlling the adhesion force using both the antiadhesion and adhesion layers for a successful large-area transfer process. An MPTMS (3-mercaptopropyltrimethoxysilane) monolayer as an adhesion layer for Au/Pd thin films was deposited on Si substrates by vapor self assembly monolayer (VSAM) method. Contact angle, surface energy, film thickness, friction force, and roughness were considered for finding the optimized conditions. The sputtered Au/Pd ($\sim$17 nm) layer on the PDMS stamp without the anti-adhesion layer showed poor transfer results due to the high adhesion between sputtered Au/Pd and PDMS. In order to reduce the adhesion between Au/Pd and PDMS, an anti-adhesion monolayer was coated on the PDMS stamp using FOTS (perfluorooctyltrichlorosilane) after $O_2$ plasma treatment. The transfer process with the anti-adhesion layer gave good transfer results over a large area (20 mm $\times$ 20 mm) without pattern loss or distortion. To investigate the applied pressure effect, the PDMS stamp was sandwiched after 90$^{\circ}$ rotation on the MPTMS-coated patterned Si substrate with 1-${\mu}m$ depth. The sputtered Au/Pd was transferred onto the contact area, making square metal patterns on the top of the patterned Si structures. Applying low pressure helped to remove voids and to make conformal contact; however, high pressure yielded irregular transfer results due to PDMS stamp deformation. One of key parameters to success of this transfer process is the controllability of the adhesion force between the stamp and the target substrate. This technique offers high reliability during the transfer process, which suggests a potential building method for future functional structures.

• Electrical & Electronic Materials
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• v.9 no.7
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• pp.727-732
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• 1996

In the present paper, the Cu films 4.mu.m thick were deposited by RF magnetron sputtering method on Si wafer. The Cu films deposited at a condition of 100W, 10mtorr exhibited a low electrical resistivity of 2.3.mu..ohm..cm and densed microstructure, poor adhesion. The Cu films grown by 200W, 20mtorr showed a good adhesion property and higher electrical resistivity of 7.mu..ohm..cm because of porous columnar microstructure. Therefore, The Cu films were deposited by double layer deposition method using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adhesion, and reflectance in the CU films [C $U_{4-d}$(low resistivity) / C $U_{d}$(high adhesion) / Si-wafer] on the thickness of d has been investigated. The films formed with this deposition methods had the low electrical resistivity of about 2.6.mu..ohm..cm and high adhesion of about 700g/cm.m.m.

• Tribology and Lubricants
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• v.21 no.1
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• pp.1-7
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• 2005

Effect of Surface roughness on nanoscale adhesion was studied experimentally by using colloidal probe technique. Glass micro balls having the radius of $3.3\~17.4{\mu}m$ were glued at the end of AFM cantilevers to prepare colloidal probes. Adhesion force between the colloidal probe and Si-wafer was measured using pull-off force measuring method. Results showed that the measured adhesion forces are not the function of the radius of the glued balls because the ball surfaces are rough. It is also found that roughness parameters such as $R_a,\;R_q\;and\;R_{max}$ do not have important role on nanoscale adhesion. In order to find the effect of surface roughness on nanoscale adhesion, the bearing areas were extracted from the measured topography of glued balls. After normalizing the measured adhesion force with the bearing area, it was found that the normalized adhesion force kept constant as function of the radius of glued ball.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.7
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• pp.721-730
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• 2012

The present paper presents a numerical study on multiphase flows induced by wall adhesion. The continuum surface force (CSF) model with the wall adhesion boundary condition model is used for calculating the surface tension force; this model is implemented in an in-house solution code (PowerCFD). The present method (code) employs an unstructured cell-centered method based on a conservative pressure-based finite-volume method with a volume capturing method (CICSAM) in a volume of fluid (VOF) scheme for phase interface capturing. The effects of wall adhesion are then numerically simulated by using the present method for a shallow pool of water located at the bottom of a cylindrical tank with no external forces such as gravity. Two different cases are computed, one in which the water wets the wall and one in which the water does not wet the wall. It is found that the present method efficiently simulates the surface tension-dominant multiphase flows induced by wall adhesion.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.67-72
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• 2016

In this study, the texturing and the emitter formation processes were carried out with the wafer adhesion method to increase the productivity and reduce the production cost of the multi-crystalline silicon solar cell. After fabricating $156{\times}156mm$ solar cell according to the wafer adhesion method, the operation characteristics were analyzed and compared with those of the solar cell fabricated by the standard process method. In the case of a solar cell formed by the wafer adhesion method, it showed Jsc of $32.87mA/cm^2$, Voc of 0.612V, FF of 78.04% and efficiency of 15.71% respectively. The efficiency of the solar cell formed by the wafer adhesion method was 0.1% higher than that of the solar cell formed by the standard method. In addition, the productivity of the texturing and the emitter formation processes is expected to be approximately doubled. Therefore, it is expected that the manufacturing cost of the multi-crystalline solar cell can be reduced due to the improved productivity compared with the standard process.

• Proceedings of the KSR Conference
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• 2006.11b
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• pp.659-664
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• 2006

It is one of the most effective method for improving the performance of electric railway vehicles to make better the wheel-rail adhesion characteristics. To study adhesion characteristic is to develop the equivalent reduction machine to experiment on the adhesion system. The experiment system makes it possible to change the wheel-rail adhesion force with various adhesion parameters, and therewith to test the adhesion control system with the reduction machine in a laboratory. In this paper for improving adhesion performance show actually control methods.

• Journal of Practical Engineering Education
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• v.15 no.2
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• pp.419-427
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• 2023

In this study, optimal adhesion conditions to alleviate defects caused by heat shrinkage with FDM type 3D printers with machine learning are researched. Machine learning is one of the "statistical methods of extracting the law from data" and can be classified as supervised learning, unsupervised learning and reinforcement learning. Among them, a function model for adhesion between the bed and the output is presented using supervised learning specialized for optimization, which can be expected to reduce output defects with FDM type 3D printers by deriving conditions for optimum adhesion between the bed and the output. Machine learning codes prepared using Python generate a function model that predicts the effect of operating variables on adhesion using data obtained through adhesion testing. The adhesion prediction data and verification data have been shown to be very consistent, and the potential of this method is explained by conclusions.

• Journal of Microbiology and Biotechnology
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• v.11 no.1
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• pp.35-39
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• 2001

A simple method for studying the lectin-like interactions between Helicobacter pylori and cultured human epithelial cell lines was developed using an enzyme-linked, biotin-streptavidin bacterial-adhesion assay. The present study suggests that this method is suitable for evaluating the participation of lectin interactions in the adhesion of H. pylori to cultured HeLa S3 and Kato III cells, both fixed and glycosidase-treated cells, as well as assessing glycoconjugated binding inhibition studies. The time-course and dose-dependent kinetics of the biotin-labeled H. pylori adhesion th the formaldehyde-fixed Hela S3 and Kato III cell lines exhibited saturation. In addition, the binding of the biotin-labeled H. pylori to the formaldehyde-fixed cultured cells was partially blocked by pre-incubation with glycoconjugates and polyclonal antibodies against a heparan sulfate binding protein from H. pylori.