• 한국전기전자재료학회논문지
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• 제26권12호
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• pp.867-871
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• 2013

The Ti adhesion layers were deposited onto the glass substrate for transparent capacitors using $Bi_2Mg_{2/3}Nb_{4/3}O_7$ (BMNO) dielectric thin films. Graphene was transferred onto the Ti/glass substrate after growing onto the Ni/$SiO_2$/Si using rapid-thermal pulse CVD (RTPCVD). The BMNO dielectric thin films were investigated for the microstructure, dielectric and leakage properties in the case of capacitors with and without Ti adhesion layers. Leakage current and dielectric properties were strongly dependent on the Ti adhesion layers grown for graphene bottom electrode.

• 한국재료학회지
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• 제15권1호
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• pp.6-13
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• 2005

Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

• 한국표면공학회지
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• 제53권6호
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• pp.306-311
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• 2020

In this work, diamond-like carbon (DLC) films are coated onto plasma nitrided AISI 4140 steel by DC-pulsed PECVD. One problem of DLC films is their very poor adhesion on steel substrates. The purpose of the nitriding was to enhance adhesion between the substrate and the DLC films. The white layer formation is avoided. Plasma nitriding increased adhesion from 8 N for DLC coating to 25 N for duplex coating. Duplex plasma nitriding/DLC coating was proven to be more effective in improving the adhesion. The purpose of the bond layer was to enhance adhesion between the substrate and the DLC films.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 1999년도 추계학술발표대회 논문집
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• pp.36-39
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• 1999

Steel tire cords were coated via RF Plasma Polymerization of acetylene in order to enhance adhesion to rubber compounds. Adhesion of tire cords was measured by TACT as a function of plasma polymerization and argon etching conditions such as power, treatment time and chamber pressure. Tested tire cords were analysed by SEM to elucidate the adhesion mechanism. The highest adhesion values were obtained with argon etching condition at 90W, 10min, 30mtorr followed by acetylene plasma polymerization condition at 10W, 30sec., 30mtorr. In SEM analysis, the plasma polymerized tire cord at the optimized condition showed 100% rubber coverage as observed from brass-plated steel tire cords.

• 열처리공학회지
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• 제13권2호
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• pp.98-102
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• 2000

The effect of vacuum heat treatment in the thermal sprayed ceramics coating on a capstan by either high velocity oxygen fuel(HVOF) or plasma thermal spray process was investigated. The coating materials applied on the capstan were tungsten and chrome carbides. In order to characterize the interface between coating layer and bare materials, hardness, adhesion strength, X-ray diffraction(XRD) and microstructural analysis are conducted. The adhesion strength of the carbide coated materials by HVOF process is over 500MPa compared to those of plasma coating process is 230MPa. In case of the carbide coated materials by HVOF process, the adhesion strength is increased to 15MPa and the porosity is reduced under 5% by vacuum heat treatment for 5 hrs at $1000^{\circ}C$. The XRD results reveal that the increasement is believed due to the phase stabilization of metastable $Cr_3C_2$ phase to stable $Cr_{23}C_6$ phase.

• 접착 및 계면
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• 제11권2호
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• pp.57-62
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• 2010

광원경화형 소재는 UV, 가시광선 등에 의해 반응하여 분자간의 가교가 일어나고 이러한 가교반응에 의해 물성이 제어되는 소재를 의미한다. 광원경화거동과정에서 수축현상이 발생하게 되는데 이때 발생하는 수축현상으로 인해 재료의 구조가 변하고 내부의 응력이 발생하는 현상 등의 문제가 발생한다. 열경화에 의한 수축현상을 분석하는 연구는 많이 진행되어 왔으나 광원경화에 대한 수축현상을 연구하는 분야는 현재 경화 수준이나 경화속도 등을 분석하는데 그치고 있다. 본 연구에서는 수축률 측정기를 통해 광원경화에 대한 수축현상을 실시간으로 살펴보고 재료의 차이에 따른 경화거동과 수축현상의 차이를 살펴보고자 한다. 관능기의 숫자가 변화함에 따라 수축률과 수축 속도의 변화가 생겼으며 분자량의 사슬길이에 따라 수축정도의 차이가 발생했다. 이러한 결과가 이론적인 결과 값인 양의 상관관계와는 반대로 음의 상관관계를 가짐을 분석하였다. 이는 수축률이 단순히 분자량과 관능기 숫자에 따라 결정되는 것이 아니라 분자구조에 따른 혼합물 내에서의 유동성 등에도 영향을 받음을 확인 할 수 있는 결과이다.

• Corrosion Science and Technology
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• 제8권1호
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• pp.15-20
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• 2009

Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.

• Journal of the Korean Wood Science and Technology
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• 제38권2호
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• pp.117-123
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• 2010

The objective of this research was executed to investigate the effect of molar ratio of formaldehyde to urea and melamine (F/(U+M)) of urea-melamine-formaldehyde (UMF) resin on bonding high and low moisture content veneers. For that purpose, UMF resin types with 5 different F/(U+M) molar ratios (1.45, 1.65, 1.85, 2.05, and 2.25) synthesized were used in present study. First, their curing behavior was evaluated by differential scanning calorimetry. Second, their adhesion performance in bonding high and low moisture content veneers was evaluated by probe tack and dry and wet shear strength tests. Curing temperature and reaction enthalpy decreased with the increase of F/(U+M) molar ratio. And the dry and wet shear strengthsof plywood manufactured from low moisture content veneers were higher than thoseof plywood manufactured from high moisture content veneers. Also, the maximum initial tack force on the low moisture content veneer was higher than that on the high moisture content veneer.

• 접착 및 계면
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• 제4권2호
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• 한국고분자학회지:고분자과학과기술
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• 제26권4호
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• pp.313-322
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• 2015