• Journal of the Korean Wood Science and Technology
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• v.41 no.2
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• pp.134-140
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• 2013

UV curing was introduced via a chemical treatment by adding small amounts of a hexafunctional acrylic monomer and a photoinitiator to improve the mechanical properties of PLA. This study also employed a semi-interpenetrated structured polymer network through the process of UV-curing. The UV curing behaviors were investigated using FTIR-ATR spectroscopy and gel fraction determination. Also, the tensile strength was investigated with different hexafunctional acrylic monomer contents and UV doses. The results showed that the crosslinking of UV-induced chemically treated PLA started at a low content of hexafunctional acrylic monomer, resulting in a significant improvement of the mechanical properties compared to those of neat PLA due to crosslinking.

• Journal of the Korean institute of surface engineering
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• v.39 no.1
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• pp.1-8
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• 2006

In this study, effect of sputtering after plasma nitriding and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution and surface roughness, which in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrN coatings showed an approximately twice increase in the binding strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.5
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• pp.445-450
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• 2011

We studied the adhesion characteristics of polymer films (PC, PET, EVA) treated by atmospheric pressure plasma. The process parameters were the frequency, gas flow, and treatment time; we studied the effects of these parameters on the adhesion characteristics of the polymer materials. We used de-ionized water and diiodomethane as the polar and nonpolar solvents, respectively, for measuring the contact angles, and subsequently calculated the surface free energy of each polymer film. The adhesion characteristics were studied by carrying out a $180^{\circ}$ peel-off test. The polymer films treated with plasma developed a hydrophilic surface, which led to increased surface free energy and improved adhesion properties. From the results for contact angle, surface free energy, and adhesion strength, we obtained the optimal plasma-treatment conditions.

• Journal of Adhesion and Interface
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• v.12 no.1
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• pp.26-33
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• 2011

Phosphoric acid treatments were conducted to improve the adhesion property of polyketone film to rubber. The effects of phosphoric acid treatments were characterized by using a contact angle analyzer and a XPS (X-ray photoelectron spectroscopy). Morphological changes were observed by using a scanning electron microscope (SEM) and an atomic force microscope (AFM) as the acid treatment condition varied in concentration and time. The contact angle was found to significantly decrease with the acid treatment. According to the XPS, increased wettability was attributed to the inclusion of oxygen containing groups such as hydroxyl, carbonyl and carboxyl by acid treatments. Cracks and pores were produced on the polyketone film surface and thus, roughness increased with the acid treatment. Interfacial adhesion strength between polyketone and natural rubber was largely improved by acid treatment due to the increased wettability and roughness of the polyketone surface. However, the higher level of acid treatment caused the degradation of the polyketone surface, and thus, its interfacial adhesion consequently decreased.

• Journal of the Korean institute of surface engineering
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• v.36 no.4
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• pp.347-355
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• 2003

Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

• Composites Research
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• v.29 no.5
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• pp.276-281
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• 2016

Improvement of the thermal and adhesion properties of stone/wood composites was studied. Tensile test was performed for wood and stone to know the basic mechanical properties. Real-time temperature of stone and wood was measured when stone and wood was heated. To compare thermal transfer properties of stone/wood composites, two types of specimens were tested: one was stone upper whereas another was wood upper. Real time temperature measurement and lap shear test were performed to know thermal and adhesion properties by using CNT-epoxy adhesive in which CNT was dispersed in epoxy adhesive uniformly. The thermal transfer property was better for the wood upper case than stone upper case. Adding CNT improved the heat transfer as well as mechanical properties including lap shear strength.

• Current Research on Agriculture and Life Sciences
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• v.32 no.1
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• pp.18-23
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• 2014

The present study examined the effect of cellulose ether on the compression and adhesion characteristics of rice dough using a rheometer. When increasing the amount of hydroxypropyl methylcellulose (HPMC), the adhesion strength consistently increased. However, the compression strength of the rice dough was the highest with 2% HPMC. When increasing the molecular weight and decreasing the water content, the compression and adhesion strength of the rice dough were both increased. Furthermore, the substitution type and degree of cellulose ether were also found to be key factors determining the compression and adhesion strength of the rice dough.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.4.1-4.1
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• 2011

Recently, circuit printing technology has been considered as a promising alternative to conventional PCB fabrication, for it can greatly reduce the manufacturing costs. Even though printed circuit has many advantages over typical subtractive technology such as fewer processes, it has some disadvantages. The major problems are low adhesion and poor resolution. Efforts to overcome these problems have been mainly focused on ink developments with a limited success. And surface treatments showed some improvements. Therefore, various plasma treatments and primer coatings on plastic substrates have been tested. Plasma treatments using hydrocarbon gases including methane and propane improved the pattern quality of the inkjet printed circuit, which are further improved upon heating of substrate. On the other hand, there is little effect on the adhesion, which is improved only by a special primer coating. The adhesion of inkjet printed circuit has been increased more than 10 times upon treatment. As for the screen printed circuits, the overall effects are less significant since there is some organic binder in the ink. Nonetheless, the treatment has strong positive effects on pattern quality and adhesion. The adhesion of 1 kgf/cm2, which is comparable with those of the conventional PCB circuits, is possible through primer coating for both screen and inkjet printed circuits. The resulting circuit also showed good thermal, mechanical and electrical properties.

• Journal of the Korean Wood Science and Technology
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• v.35 no.2
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• pp.39-50
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• 2007

The purpose of this study was to investigate the physico-mechanical properties and characteristics on reduction of formaldehyde and total volatile organic compound (TVOC) emission from particleboard (PB) with added volcanic pozzolan. Pozzolan was added as a scavenger at the level of 1, 3, 5, and 10 wt.% of urea formaldehyde (UF) resin for PB manufacture. The moisture content, density, thickness swelling, water absorption and physical properties of PBs were examined. Three-point bending strength and internal bond strength were determined using a universal testing machine. Formaldehyde and TVOC were determined by desiccator and 20L small chamber methods. With increasing pozzolan content the physical and mechanical properties of the PBs were not significantly changed, but formaldehyde and TVOC emissions were decreased. Because pozzolan has a rough and irregular surface with porous form, it can be used as a scavenger for PBs at a content up to 10 wt.% without any detrimental effect on the physical and mechanical properties.

• Journal of the Korean Wood Science and Technology
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• v.35 no.4
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• pp.38-44
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• 2007

As environmental issues is important thing, our study aims to develop natural adhesives made by rosin instead of synthesis adhesive with the formaldehyde emission. Natural adhesives were formulated to enhance curing speed and adhesion performances with various drying agent contents. Adhesion performances were evaluated with tack values measured by texture analyzer and shear strengths determined by single lap shear test. The adhesion performances of nature adhesives developed in this study and compared with those of overseas natural adhesives made by AURO, BioFa, Livos. Optimum drying agent formulation was Co 0.7 part, Zr 1.0 part, Ca 0.5 part, and Activ8 0.1 part. Shear strength of the adhesives manufactured by the optimum drying agent formulation was $93.2{\pm}19.1N/cm^2$.