• Tribology and Lubricants
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• 제36권5호
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• pp.267-273
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• 2020

This study experimentally investigates hydrophobic surfaces fabricated via additive manufacturing. Additive manufacturing, commonly known as 3D printing, is the process of joining materials to fabricate parts from 3D model data, usually in a layer-upon-layer manner. Digital light processing is used to fabricate hydrophobic surfaces in this study. This method uses photo-curable resins and ultraviolet (UV) sources. Moreover, this technique generally has faster shaping speeds and is advantageous for the fabrication of small components because it enables the fabrication of one layer at a time. Two photo-curable resins with different compositions are used to fabricate micro-patterns of hydrophobic surfaces. The resins are composed of a photo-initiator, monomer, and oligomer. Experiments are conducted to determine suitable process conditions for the fabrication of hydrophobic surfaces depending on the type of resin. The most important factors affecting the process conditions are the UV exposure time and slice thickness. The fabrication capability according to the process conditions is evaluated using the side and top views of the micro-patterns observed using a microscope. The micro-patterns are collapsed and intertwined when the exposure time is short because sufficient light (heat) is not applied to cure the photo-curable resin with a given slice thickness. On the other hand, the micro-patterns are attached to each other when the exposure time is prolonged because the over-curing time can cure the periphery of a given shape. When the slice is thicker, the additional curing area is enlarged in each slice owing to the straightness of UV light, and the slice surface becomes rough.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• 에너지공학
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• 제29권3호
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• pp.50-56
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• 2020

Currently, 3D printing technology is a new revolutionary additive manufacturing process that can be used for making three dimensional solid objects from digital films. In 2019, this 3D printing technology spreading vigorously in production parts (57%), bridge production (39%), tooling, fixtures, jigs (37%), repair, and maintenance (38%). The applications of 3D printing are expanding to the defense, aerospace, medical field, and automobile industry. The raw materials are playing a key role in 3D printing. Various additive materials such as plastics, polymers, resins, steel, and metals are used for 3D printing to create a variety of designs. The main advantage of the green cement for 3D printing is to enhance the mechanical properties, and durability to meet the high-quality material using in construction. There are several advantages with 3D printing is a limited waste generation, eco-friendly process, economy, 20 times faster, and less time-consuming. This research article reveals that the role of green cement as an additive material for 3D printing.

• 한국주조공학회지
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• 제28권5호
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• pp.237-241
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• 2008

This study has been carried out to investigate the wear and heat resistant properties of durable moldwash agent for Al gravity casting according to mold washing process conditions. The wear properties of coated specimen were performed by sliding wear testing machine and heat resistance were evaluated by measuring the loss of coated moldwash agent during emerging of coated specimen in Al melts. During testing, experimental variables were mold surface temperature, moldwash agent/distilled wear, and additive concentrations. The lower additive concentration and mold temperature caused the smooth surface roughness of coated specimen, It was found that the specimen coated with moldwash/water ratio 1:3, additive concentration 9wt% and mold temperature higher than $200^{\circ}C$ showed superior wear and heat treatment. Also, these results were supported by fluidity test.

• 동력기계공학회지
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• 제9권4호
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• pp.130-136
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• 2005

The effects of additional Mg content, the size and volume fraction of reinforcement phase on the mechanical properties of ceramic particle reinforced aluminium matrix composites fabricated by pressureless metal infiltration process were investigated. The hardness of $SiC_p/AC8A$ composites increased gradually with an increase in the additive Mg content, while the bending strength of $SiC_p/AC8A$ composites increased with an increase in additive Mg content up to 5%. However, this decreased when the level of additive Mg content was greater than 5% due to the formation of coarse precipitates by excessive Mg reaction and an increase in the porosity level. The hardness and strength of the composites increased with decreasing the size of SiC particle. It was found that the composites with smaller particles enhanced the interfacial bonding than those with bigger particles from fractography of the composites. The hardness of $Al_2O_{3p}/AC8A$ composites increased gradually with an increase in the volume fraction, however, the bending strength of $Al_2O_{3p}/AC8A$ composites decreased when the volume fraction of alumina particle was greater than 40% owing to the high porosity level.

• 한국기계가공학회지
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• 제21권5호
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• pp.91-97
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• 2022

The Directed Energy Deposition (DED) is a representative metal additive manufacturing method. Owing to its strong point of repairment, its application is gradually spreading in aerospace applications, power generation, military components, and mold making. 5-axis cladding is needed to repair damage, such as wear and scratches on cylindrical surfaces to circular-shaped parts, including sleeves and liners. Furthermore, the condition of cladding on inclined parts must also be considered to prevent interference between the nozzle and the part. In this study, the effects of changes in scanning speed due to the 5-axis control system and differences from the height of laser beam irradiation due to inclination are evaluated among the items that should be additionally considered in 5-axis cladding compared to 3-axis cladding. Moreover, the trends of the width and height of the clad are identified by different tilting angles via single line cladding. Lastly, cladding methods on cylindrical surfaces at various angles are proposed to enhance the clad quality and post-processing efficacy. These results can be applied with 5-axis cladding on inclined surfaces, including cylindrical surfaces.

• Bulletin of the Korean Chemical Society
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• 제34권3호
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• pp.927-930
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• 2013

We developed an electroplating process of cobalt nanowires of which line-widths were between 70 and 200 nm. The plating electrolyte was made of $CoSO_4$ and an organic additive, dimethyldithiocarbamic acid ester sodium salt (DAESA). DAESA in plating electrolytes had an accelerating effect and reduced the surface roughness of plated cobalt thin films. We obtained void-free cobalt nanowires when the plating current density was 6.25 mA/$cm^2$ and DAESA concentration was 1 mL/L.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 ITC-CSCC -1
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• pp.215-218
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• 2000

In this paper, a new algorithm for adaptive IIR filters based on equation error methods using the RLS algorithm is proposed. In the proposed algorithm, the concept of feedback of the scaled output error proposed by tin and Unbehauen is employed and the forgetting factor is varied in adaptation process for avoiding the accumulation of the estimation error for additive noise . The proposed algorithm has the good convergence property without the parameter estimation error under the existence of mea-surement noise.

• 제어로봇시스템학회논문지
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• 제11권8호
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• pp.717-725
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• 2005

The adaptive filter is proposed for the INS/GPS. The proposed filter can estimate the variance of the process noise using the residual of the filter. To verify the efficiency of the adaptive filter, it is applied to the loosely-coupled INS/CPS that employs the additive quaternion error model. Simulation results demonstrate that the proposed filter is more effective in estimating the attitude error than EKF.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.178-178
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• 2015

SAP 씨앗층용 구리필름에 대한 결정구조와 에칭속도의 상관관계를 알아보았다. 그 결과, 저지수 면보다는 고지수면이 우선적으로 성장되어 있는 구리피막이 높은 에칭속도를 나타내었다. 이와 같은 우선결정방위와 에칭속도의 관계를 결정구조적인 관점에서 해석하였다.