• 제목/요약/키워드: additive process

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Effects and Application Cases of Injection Molds by using DED type Additive Manufacturing Process (DED방식의 적층가공을 통한 금형으로의 응용사례 및 효과)

  • Kim, Woosung;Hong, Myungpyo;Kim, Yanggon;Suh, Chang Hee;Lee, Jongwon;Lee, Sunghee;Sung, Ji Hyun
    • Journal of Welding and Joining
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    • v.32 no.4
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    • pp.10-14
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    • 2014
  • Laser aided Direct Metal Tooling(DMT) process is a kind of Additive Manufacturing processes (or 3D-Printing processes), which is developed for using various commercial steel powders such as P20, P21, SUS420, H13, D2 and other non-ferrous metal powders, aluminum alloys, titanium alloys, copper alloys and so on. The DMT process is a versatile process which can be applied to various fields like the mold industry, the medical industry, and the defense industry. Among of them, the application of DMT process to the mold industry is one of the most attractive and practical applications since the conformal cooling channel core of injection molds can be fabricated at the slightly expensive cost by using the hybrid fabrication method of DMT technology compared to the part fabricated with the machining technology. The main objectives of this study are to provide various characteristics of the parts made by DMT process compared to the same parts machined from bulk materials and prove the performance of the injection mold equipped with the conformal cooling channel core which is fabricated by the hybrid method of DMT process.

Data-driven Approach to Explore the Contribution of Process Parameters for Laser Powder Bed Fusion of a Ti-6Al-4V Alloy

  • Jeong Min Park;Jaimyun Jung;Seungyeon Lee;Haeum Park;Yeon Woo Kim;Ji-Hun Yu
    • Journal of Powder Materials
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    • v.31 no.2
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    • pp.137-145
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    • 2024
  • In order to predict the process window of laser powder bed fusion (LPBF) for printing metallic components, the calculation of volumetric energy density (VED) has been widely calculated for controlling process parameters. However, because it is assumed that the process parameters contribute equally to heat input, the VED still has limitation for predicting the process window of LPBF-processed materials. In this study, an explainable machine learning (xML) approach was adopted to predict and understand the contribution of each process parameter to defect evolution in Ti alloys in the LPBF process. Various ML models were trained, and the Shapley additive explanation method was adopted to quantify the importance of each process parameter. This study can offer effective guidelines for fine-tuning process parameters to fabricate high-quality products using LPBF.

Study on the Surface Characterization of Structure made of Polyamide 12 manufactured by Additive Manufacturing Process (적층 기법으로 제작한 polyamide 12 소재 적용 구조물 표면 특성 분석 연구)

  • Kim, Moosun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.9
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    • pp.481-487
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    • 2019
  • Additive manufacturing is a state-of-the-art manufacturing process technology in which three-dimensional structures are fabricated by laminating two-dimensional sections of a structure using various materials such as plastic, ceramics, and metals. The additive manufacturing technology has the advantage of high design freedom, while the surface property (roughness) of the finished product varies depending on the process conditions, which necessitates performing a post-process after the products are manufactured. In this study, the surface roughness of a structure made of polyamide 12, which was manufactured by SLS (Selective Laser Sintering) and MJF (Multi Jet Fusion) process was compared. The processing condition was classified by the building orientation of structure as 0, 45, and 90 degrees, which is the angle between the analytical surface and the horizontal plane of the fabrication platform. Structures with a hole of various diameters ranging from 1mm to 10mm were manufactured and the hole characteristics (ratio of hole depth to diameter) and results of the specimens were compared. As a result of the surface characteristics analysis, the surface roughness value of the specimens manufactured with a building orientation of $45^{\circ}$ was the highest in both technologies. In the case of the through-hole structure fabrication, the shape was maintained with 5mm and 10mm diameter holes regardless of the building orientation, although the hole forming was difficult for the smaller holes.

A Study on the Method and Application of Shaft Repair using Directed Energy Deposition Process (직접식 에너지 용착 공정을 활용한 축 보수 방법 및 활용 사례 연구)

  • Lee, Yoon Sun;Lee, Min Kyu;Sung, Ji Hyun;Hong, Myeong Pyo;Son, Yong;An, Seouk;Jeong, Oe Cheol;Lee, Ho Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.9
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    • pp.1-10
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    • 2021
  • Recently, the repair and recycling of damaged mechanical parts via metal additive manufacturing processes have been industrial points of interest. This is because the repair and recycling of damaged mechanical parts can reduce energy and resource consumption. The directed energy deposition(DED) process has various advantages such as the possibility of selective deposition, large building space, and a small heat-affected zone. Hence, it is a suitable process for repairing damaged mechanical parts. The shaft is a core component of various mechanical systems. Although there is a high demand for the repair of the shaft, it is difficult to repair with traditional welding processes because of the thermal deformation problem. The objective of this study is to propose a repair procedure for a damaged shaft using the DED process and discuss its applications. Three types of cases, including a small shaft with a damaged surface, a medium-size shaft with a worn bearing joint, and a large shaft with serious damage, were repaired using the proposed procedure. The microstructure and hardness were examined to discuss the characteristics of the repaired component. The efficiency of the repair of the damaged shaft is also discussed.

Investigation of Applicability of Additive Manufacturing Processes to Appropriate Technologies for Developing Countries (개발 도상국들을 위한 적층 제조 공정의 적정 기술 분야 적용성 고찰)

  • Ahn, Dong-Gyu
    • Journal of Appropriate Technology
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    • v.7 no.2
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    • pp.188-195
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    • 2021
  • In recent years, additive manufacturing (AM) processes have emerged as an important manufacturing technology for a multi-item small sized production to lead the 4th industrial revolution. The layer-by-layer deposition characteristics of AM process can rapidly produce physical parts with three-dimensional geometry and desired functionality in a relatively low cost environment. The goal of this paper is to investigate the applicability of AM process to appropriate technologies for developing countries. Through the review of examples of appropriate technology of the AM process, the possibility of a practical usage of the AM process for the appropriate technologies is examined. In addition, significant applications of the AM process to the appropriate technology are introduced. Finally, future issues related to production of physical parts for developing countries using the AM process are discussed from the viewpoint of the appropriate technology.

Comparison of Removal Capabilities among Several Aqueous Amine Absorbents for Sweeting Acid Gases Contained in Natural Gas (다양한 아민 흡수제를 이용한 천연가스 중에 포함되어 있는 산성가스 제거 성능 비교)

  • Cho, Du-hee;Kim, Dong-sun;Cho, Jung-ho
    • Plant Journal
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    • v.10 no.1
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    • pp.34-39
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    • 2014
  • Simulation works for comparing removal capabilities of acid gases contained in natural gas among several aqueous amine absorbents using commercial process simulator PROMAX(BR&E Co.) were carried out. Amine aqueous solution used in this study were 30 wt% MEA, 30 wt% DEA, 50 wt% MDEA, and 50 wt% MDEA with 3 wt% piperazine as additive. We obtained the simulated results that while MEA aqueous solution is relatively capable of more $CO_2$ gas, but DEA, MDEA, MDEA aqueous solutions with piperazine as additive are capable of more $H_2S$ gas. Also, we found that 30 wt% MDA aqueous solution is the smallest circulate rate of lean amine solution, and 50 wt% MDEA aqueous solution with 3 wt% piperazine as additive is the smallest heat duty in stripping unit. 50 wt% MDEA aqueous solution with 3 wt% piperazine as additive is found less amine circulation rate than 50 wt% MDEA due to the introduction of additive.

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Correlation between UV-dose and Shrinkage amounts of Post-curing Process for Precise Fabrication of Dental Model using DLP 3D Printer (DLP 공정을 이용한 정밀 치아모델 제작에서 UV 조사량과 후경화 수축률의 상관관계 분석)

  • Shin, Dong-Hun;Park, Young-Min;Park, Sang-Hu
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.2
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    • pp.47-53
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    • 2018
  • Nowadays, additive manufacturing (AM) technology is a promising process to fabricate complex shaped devices applied in medical and dental services. Among the AM processes, a DLP (digital light processing) type 3D printing process has some advantages, such as high precision, relatively low cost, etc. In this work, we propose a simple method to fabricate precise dental models using a DLP 3D printer. After 3D printing, a part is commonly post-cured using secondary UV-curing equipment for complete polymerization. However, some shrinkage occurs during the post-curing process, so we adaptively control the UV-exposure time on each layer for over- or under-curing to change the local shape-size of a part in the DLP process. From the results, the shrinkage amounts in the post-curing process vary due to the UV-dose in 3D printing. We believe that the proposed method can be utilized to fabricate dental models precisely, even with a change of the 3D CAD model.

THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES

  • Takagi, Kiyoshi
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.289-296
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    • 1999
  • The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

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Through-Silicon-Via Filling Process Using Cu Electrodeposition (구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정)

  • Kim, Hoe Chul;Kim, Jae Jeong
    • Korean Chemical Engineering Research
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    • v.54 no.6
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    • pp.723-733
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    • 2016
  • Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

Process Conditions for the Fabrication of Hydrophobic Surfaces with Different Photo-curable Resins (광경화성 레진의 성분 변화에 대한 소수성 표면 제작을 위한 공정 조건)

  • Hong, Sung-Ho;Woo, Heung-Sik
    • Tribology and Lubricants
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    • v.36 no.5
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    • pp.267-273
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    • 2020
  • This study experimentally investigates hydrophobic surfaces fabricated via additive manufacturing. Additive manufacturing, commonly known as 3D printing, is the process of joining materials to fabricate parts from 3D model data, usually in a layer-upon-layer manner. Digital light processing is used to fabricate hydrophobic surfaces in this study. This method uses photo-curable resins and ultraviolet (UV) sources. Moreover, this technique generally has faster shaping speeds and is advantageous for the fabrication of small components because it enables the fabrication of one layer at a time. Two photo-curable resins with different compositions are used to fabricate micro-patterns of hydrophobic surfaces. The resins are composed of a photo-initiator, monomer, and oligomer. Experiments are conducted to determine suitable process conditions for the fabrication of hydrophobic surfaces depending on the type of resin. The most important factors affecting the process conditions are the UV exposure time and slice thickness. The fabrication capability according to the process conditions is evaluated using the side and top views of the micro-patterns observed using a microscope. The micro-patterns are collapsed and intertwined when the exposure time is short because sufficient light (heat) is not applied to cure the photo-curable resin with a given slice thickness. On the other hand, the micro-patterns are attached to each other when the exposure time is prolonged because the over-curing time can cure the periphery of a given shape. When the slice is thicker, the additional curing area is enlarged in each slice owing to the straightness of UV light, and the slice surface becomes rough.