• Journal of the Korean Society of Food Science and Nutrition
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• v.45 no.3
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• pp.402-408
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• 2016

Master packaging system consists of an inner individual package and secondary outer package. During the stages of chilled transport and distribution, the combination of primary individual package and secondary package was used to maintain a modified atmosphere for shiitake mushrooms. During the retail stage at higher temperature ($25^{\circ}C$), the primary individual package was exposed to display conditions after dismantling of the secondary packaging. The master packaging system was constructed to contain eight individual $30-{\mu}m$ thick polypropylene film bags of 500 g shiitake mushrooms inside a $40-{\mu}m$ low-density polyethylene bag. Carbon dioxide absorbent material [$Ca(OH)_2$] and/or moisture absorbent (superabsorbent polymer) were designed in their required amounts based on respiration characteristics and then applied to the outer secondary packaging in sachet form. Gas concentration of the packaging, temperature, and humidity were monitored throughout transport and storage. The quality of shiitake mushrooms was measured at the retail stage to determine the packaging effect. During the distribution stage of 108 h, $O_2$ and $CO_2$ concentrations in the master packaging system were maintained at 9~11% and 1~4% in the inner packaging, respectively, which are good for quality preservation. Compared to the control, the master packaging with $CO_2$ and/or moisture absorbents improved mushroom preservation and particularly reduced decay.

• Food Science and Preservation
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• v.10 no.4
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• pp.574-583
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• 2003

There have been a lot of research efforts on development of active food packaging structures and materials in the form of plastic films and containers, along with investigating novel polymers and bioactive compounds for packaging purpose, in order to improve storage stability and safety of foods during distribution and sale. Recently, great interests focus on antimicrobial package films, as an active packaging system, made from synthetic plastic polymer% and natural biopolymers containing various antimicrobial substances for food packaging applications. In this active system, substances are slowly released onto the food surface. However, antimicrobial activity as well as physical properties of the films can be significantly influenced by several factors such as polymer matrix, antimicrobial compounds, and interactions between polymers and compounds. Thus, this study reviews present status of antimicrobial food packaging films in overall performance aspects including types of polymers and active substances, test for antimicrobial activity, and changes in mechanical and antimicrobial properties by preparation method.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.1-7
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• 2002

The purpose of this work is to develop High-Frequency Active Filter and super-miniaturation technology(SMD Type) of Filter which are essential for the key R/F Microwave components in the Mobile telecommunication system. The cut-off frequency of high frequency active filter for multimedia is 2.5 MHz, the gain is 0.5dB at 100 kHz, the passband ripple is 1.2 dB max at 100 kHz~2.0 kHz, GDT is 60 nsec at 100 kHz-2.0 MHz, the attenuation is 40 dB min at 3.75 MHz.

• Food Science of Animal Resources
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• v.43 no.6
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• pp.1128-1149
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• 2023

In order to extend the shelf life of refrigerating raw lamb by inhibiting the growth of microorganisms, preventing the oxidation of fat and protein, and absorbing the juice outflow of lamb during storage, an active packaging system based on plastic/gelatin bilayer film with essential oil was developed in this study. Three kinds of petroleum-derived plastic films, oriented polypropylene (OPP), polyethylene terephthalate, and polyethylene, were coated with gelatin to make bilayer films for lamb preservation. The results showed significant improvement in the mechanical properties, oxygen, moisture, and light barriers of the bilayer films compared to the gelatin film. The OPP/gelatin bilayer film was selected for further experiments because of its highest acceptance by panelists. If the amount of juice outflow was less than 350% of the mass of the gelatin layer, it was difficult for the gelatin film to separate from lamb. With the increase in essential oil concentration, the water absorption capacity decreased. The OPP/gelatin bilayer films with 20% mustard or 10% oregano essential oils inhibited the growth of bacteria in lamb and displayed better mechanical properties. Essential oil decreased the brightness and light transmittance of the bilayer films and made the film yellow. In conclusion, our results suggested that the active packaging system based on OPP/gelatin bilayer film was more suitable for raw lamb preservation than single-layer gelatin film or petroleum-derived plastic film, but need further study, including minimizing the amount of essential oil, enhancing the mechanical strength of the gelatin film after water absorption.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.2
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• pp.57-64
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• 2018

This article delves into the current status of various packaging technologies, which are currently being applied or are under development for the shelf-life extension and quality improvement of fresh and processed meat products. Traditional packaging methods include vacuum packaging, modified atmosphere packaging, and air-permeable packaging. Recently, innovative packaging methods have been introduced that utilize technologies such as barrier-films, active packaging, nanotechnology, microperforated films, far-infrared radiations, and plasma treatment. All of these packaging methods have their own merits and drawbacks in terms of shelf-life and quality maintenance. A right choice of packaging system for fresh and processed meat products must be made in accordance with the conditions of the raw material, storage, and distribution in the market and household, and while considering the environmental sustainability and consumer's expectations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.938-944
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• 1994

Active damping has been shown to offer increased suspension performance in terms of vehicle isolation, suspension packaging, and road-tire contract force. Many semi-active damping strategies have been introduced to approximate the response of active damping with the modulation of passive damping parameters. This study investigates the characteristics of semi-active suspension control through the simulation of passive, skyhook active, and semi-active damping models. A quarter car model is studied with the conrolled damping replacing both passive and active damping. A new semi-active scheme is suggested to eliminate the abrupt changes in semi-active damping force. It is shown that the new strategy performs almost identically to the so called "force controlled" semi-active law without steep changes in damping force or body acceleration.eleration.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.546-553
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• 2012

Urushiol extracted from lacquer tree exhibits good thermal stabilities as well as antimicrobial andantioxidant properties. However, it has been known that the urushiol derivates bring out allergy. In this study, polyurushiol (PUOH) powders were successfully synthesized for the safe and convenient handling of allergic urushiol. First, the as-synthesized PUOH was confirmed by Fourier transform infrared spectroscopy (FTIR), scanning electron microscope (SEM), thermal gravimetric analyzer (TGA), antioxidant test and antimicrobial test. And then, six different LDPE/PUOH composite films were prepared via a twin screw extruder system and investigated their feasibility to use as active packaging materials. Their chemical structures, morphology, thermal optical and antimicrobial properties of the LDPE/PUOH composite films were investigated as a function of PUOH contents. FTIR and SEM results showed that LDPE/PUOH composite films have a weak interfacial interaction and poor dispersion with a high PUOH loading. The thermal properties increased up to 3 wt% as the content of PUOH increases. Compared to the pure LDPE films, LDPE/PUOH composite films are more effective in the UV absorbance and antibacterial activity against E. coli. To maximize the performance of LDPE/PUOH compositefilms as the packaging materials, further researches are required to enhance the dispersion of PUOH powders in the LDPE matrix.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.1-6
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• 2016

The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.