• Korean Journal of Food Science and Technology
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• v.31 no.5
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• pp.1227-1234
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• 1999

Modified atmosphere packaging of peaches(Prunus persica L. Batsch) was investigated to extend their freshness during distribution. Peaches were packaged in the PE film(20LD, 40LD), the PE film modified by addition of 5%(w/w) zeolite(20CK, 40CK), and the PE film containing $Purafil^{\circledR}$ sachet(20LP, 40LP). Quality indexes of peaches during storage at $20^{\circ}C$ were measured in terms of weight loss, soluble solids content, pH, titratable activity, firmness, color and sensory properties. Gas composition and ethylene content In the film bags changed rapidly at the early stage of storage. Within 8 days, weight loss of the unpacked control increased upto ll.8% but those of the packaged remained below 2%. There was no significant difference in soluble solids content and pH in all the treatments. Ethanol content of peaches packed in 40LD was 12.88 mL/kg and acetaldehyde content in 40CK was $160\;{\mu}L/kg$ for 8 days. Peaches packed in 20CK showed a good visual and sensory Quality. The result suggested that active packaging treatment such as 20CK could be used for extending freshness of peaches during transport period at ambient temperature.

• Industrial Engineering and Management Systems
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• v.10 no.2
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• pp.123-127
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• 2011

Nowadays, green purchasing, stop global warming, love the mother earth, and others that related to environment become hot issues. Manufactures industries tend to more active and responsive to those issues by adopting green strategies or program like Environmentally Conscious Manufacturing (ECM). In this article, an electronic company had applied 12 ECM Program and tries to choose one of those programs using 6 criteria, such as total cost involved, quality, recyclable material, process waste reduction, packaging waste reduction, and regulation compliance. By using multi-criteria decision making model, i.e. Analytical Hierarchy Process (AHP), Technique for Order Preference by Similarity to Ideal Solution (TOPSIS), and Modified TOPSIS methods, the ECM Program 9 (Open pit) is the best option.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.709-713
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• 1996

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $\mu\textrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.71-76
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• 2015

Recently, light emitting diodes (LEDs) have been studied to improve their efficiencies for the uses in various fields. Particularly in the aspect of chip structure, via hole type vertical LED chip is developed for improvement of light output power, and heat dissipations. However, current vertical type LEDs have still drawback, which is current concentration around the n-contact holes. In this research, to solve this phenomenon, we introduced isolation layer under n-contact electrodes. With this sub-electrode, even though the active area was decreased by about 2.7% compared with conventional via-hole type vertical LED, we could decrease the forward voltage by 0.2 V and wall-plug efficiency was improved approximately 4.2%. This is owing to uniform current flow through the area of n-contact.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.77-82
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• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.1-4
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• 2009

This work shows how the adoption of a dual-dicing process for silicon wafer separation affects the thermal-cycling reliability (i.e. $-65^{\circ}C$ to $150^{\circ}C$) of the semiconductor devices utilizing lead-on-chip (LOC) die attach technique. In-situ examinations show that conventional single-dicing process directly attacks the edge region of diced devices but dual-dicing process effectively protects the edge region of diced devices from dicing-induced mechanical damage. Probably, this is because the preferential and sacrificial fracture of notched regions induced on the active surface of wafers saves the edge regions. It was also investigated through thermal-cycling tests that the number of thermal-cycling induced failures is much lower at the dual-dicing process than the single-dicing process.

• FLOWER RESEARCH JOURNAL
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• v.19 no.3
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• pp.158-163
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• 2011

The purpose of this study was to find new way for vitality of flower shop. The subjects for this research were composed of 58 male and 155 female. In survey of satisfaction of flower shop's product price, 'satisfied' responses in male and female respondents were 8.62 and 14.21%, respectively. Results of survey of consumer's awareness on packaging of flower shop's products have shown that the 'satisfied' responses in male and female respondents were 6.88 and 12.91%, respectively. In question of the satisfaction of flower products as a gift, the 'satisfied' responses in male and female respondents were 8.61% and 1.95%, respectively. In question of the attitude of seller, the 'satisfied' responses in male and female respondents were 6.88% and 6.46%, respectively. In survey of the mind of consumer's repurchase, male and female respondents were satisfied 5.16% and 9.05%, respectively. Our results have shown that consumer's satisfaction in most questions was of low level. Therefore, we propose that these results are associated with the needs of active efforts of flower shop's manager.

• Korean Journal of Agricultural Science
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• v.49 no.4
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• pp.973-981
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• 2022

'Shine Muscat' (Vitis labruscana Bailey x Vitis vinifera L.) grapes recently have been greatly favored in Korea, and as of 2022, account for 38.6% of the total grape market in Korea. However, there is a lack of research on post-harvest quality control appropriate to the unique characteristics of 'Shine Muscat'. In order to continuously increase domestic demand and exports in the future, it is essential to establish proper postharvest techniques. Essential oils have remarkable potential as biologically active and environmentally friendly antiseptics for the fruit industry. The objective of this study is to evaluate the effects of essential oils and aroma constituent treatment on fruit quality attributes of 'Shine Muscat' grapes in order to extend fruit quality during a simulated export period. A cluster of 'Shine Muscat' grapes was placed in a newly developed paper box container, and treated with rosemary essential oil, thyme essential oil, and linalool, along with an untreated control. The results showed no significant effect on fruit quality indices, such as cluster weight loss, berry firmness, soluble solids content, titratable acidity, sugar acid ratio, and color change, but showed a positive effect on the alleviation of berry shatter compared to the untreated control. In addition, rosemary oil treatment reduced the proportion of unhealthy berries. Therefore, the results indicated that the newly developed packaging container along with certain essential oil treatment could be applied as a promising packaging material for table grape export.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.71-75
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• 2022

In this research, Fe-Ni alloy films were electrodeposited on stainless steel (SS304 and SS430) and Ti plates to investigate the effects of surface conditions of cathode on deposits. The Ti plates were electropolished in 3 M H₂SO₄-methanol electrolytes at various conditions before electrodeposition, and unpolished Ti and the optimized specimen, polished at 10 V for 8 min, were used as cathode. The anomalous codeposition, the phenomenon which more active Fe is reduced preferentially, occurred on all substrate, however, there were differences in composition of all deposits. As the results of potential monitoring during electrodeposition, it was confirmed that the larger overpotential was applied to the deposition cell when using Ti cathode, leading to high Fe content of deposits from unpolished Ti due to increase in nucleation of Fe. Also, it was founded that the polished Ti can reduced deposition overpotential.