• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.37-42
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• 2003

In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.2
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• pp.55-62
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• 2021

This study aims to reduce the rancid odor generated during the fermentation process of kimchi by inserting zinc oxide (ZnO) into an inorganic porous material with a high surface area to decompose or adsorb the fermentation odor. ZnO activated by the presence of moisture exhibits decomposition of rancid odors. Mixed with Titanium dioxide (TiO₂), a photocatalyst. To manufacture the packaging liner used in this study, NaOH, ZnCl₂, and TiO₂ powder were placed in a tank with diatomite and water. The sludge obtained via a hydrothermal ultrasonication synthesis was sintered in an oven. After being pin-milled and melt-blended, the powders were mixed with linear low-density polyethylene (L-LDPE) to make a masterbatch (M/B), which was further used to manufacture liners. A gas detector (GasTiger 2000) was used to investigate the total amount of sulfur compounds during fermentation and determine the reduction rate of the odor-causing compounds. The packaging liner cross-section and surface were investigated using a scanning electron microscope-energy dispersive X-ray spectrometer (SEM-EDS) to observe the adsorption of sulfur compounds. A variety of sulfur compounds associated with the perceived unpleasant odor of kimchi were analyzed using gas chromatography-mass spectrometry (GC-MS). For the analyses, kimchi was homogenized at room temperature and divided into several sample dishes. The performance of the liner was evaluated by comparing the total area of the GC-MS signals of major off-flavor sulfur compounds during the five days of fermentation at 20℃. As a result, Nano-grade inorganic compound liners reduced the sulfur content by 67 % on average, compared to ordinary polyethylene (PE) foam liners. Afterwards SEM-EDS was used to analyze the sulfur content adsorbed by the liners. The findings of this study strongly suggest that decomposition and adsorption of the odor-generating compounds occur more effectively in the newly-developed inorganic nanocomposite liners.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.2
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• pp.41-49
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• 2014

This study illustrates the synthesis of gelatin based zinc oxide nanoparticle (ZnONPs) incorporated nanocomposite films using different concentrations of ZnONPs. The ZnONPs were oval in shape and the size ranged from 100- 200 nm. The nanocomposite films were characterized by UV-visible, FE-SEM, FT-IR, and XRD. The concentrations of ZnONPs greatly influenced the properties of nanocomposite films. The absorption peaks around 360 nm increased with the increasing concentrations of ZnONPs. The surface color of film did not change while transmittance at 280 nm was greatly reduced with increase in the concentration of ZnONPs. FTIR spectra showed the interaction of ZnONPs with gelatin. XRD data demonstrated the crystalline nature of ZnONPs. The thermostability, char content, water contact angle, water vapor permeability, moisture content, and elongation at break of nanocomposite films increased, whereas, tensile strength and modulus decreased with increase in the concentrations of ZnONPs. The gelatin/ZnONPs nanocomposite films showed profound antibacterial activity against both Gram-positive and Gram-negative food-borne pathogenic bacteria. The gelatin/$ZnONP^{1.5}$ nanocomposite film showed the best UV barrier and antimicrobial properties among the tested-films, which indicated a high potential for use as an active food packaging films with environmentally-friendly nature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.377-377
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• 2007

A simplified integration process including packaging is presented, which enables the realization of the portable fluorescence detection system. A fluorescence detection microchip system consisting of an integrated PIN photodiode, an organic light emitting diode (OLED) as the light source, an interference filter, and a microchannel was developed. The on-chip fluorescence detector fabricated by poly(dimethylsiloxane) (PDMS)-based packaging had thin-film structure. A silicon-based integrated PIN photo diode combined with an optical filter removed the background noise, which was produced by an excitation source, on the same substrate. The active area of the finger-type PIN photo diode was extended to obtain a higher detection sensitivity of fluorescence. The sensitivity and the limit of detection (LOD S/N = 3) of the system were $0.198\;nA/{\mu}M$ and $10\;{\mu}M$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.61-67
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• 2002

The number of passive components used in hand held devices and computers continue to increase so that the passive to active ratio continues to grow. Embedded passives are the best technology for very high component density with increased electrical performance. improved reliability, reduced size, weight and lower cost. Specially embedded capacitors are strongly under development. This paper discusses dielectric materials used in embedded capacitors and remained challenges.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.02a
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• pp.1-14
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• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.25-29
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• 2002

We have fabricated a vertical trench Hall device which is sensitive to the magnetic field parallel to the sensor surface. The vertical trench Hall device has been built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT has been measured.

• Food Science and Industry
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• v.50 no.2
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• pp.2-11
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• 2017

Packaging is the last defensive barrier that protects food products from insect infestation during storage. However, though packaging films are hermetically sealed, insects can still be attracted by strong olfactory cues and penetrate through packaging materials, resulting in contamination. Insect contamination may cause consumers to be repulsed by contaminated food products. Especially, it is well known that stored-product insects cause critical problems in the cereal industry by inducing quantitative and qualitative damages to the grain products. The contaminations are caused by insects' metabolic byproducts and body parts, consequentially caused customer repulsion. Therefore, it is necessary to repel and control insects. However, management systems for storage insects in food industry have been inadequate for many years. Synthetic pesticides has been widely used, but pesticides may accumulate in foods, causing acute and chronic symptoms in consumers. For this reason, there is a growing need for the development of natural insecticides that can replace synthetic pesticides. Thus, various reports about anti-insect packaging materials and strategies to repel insects were introduced in this study. Furthermore, we suggested new strategies to develop an insect-repelling active packaging materials which could be applied in the food packaging industry.

• Journal of the Korea Safety Management & Science
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• v.15 no.4
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• pp.233-243
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• 2013

As companies were concerned with developing green logistics and environment, most logistics concerned functions like packaging, loading, storage, transportation and IT studies are active in study. Even if active in research studies, companies still recognized that logistics cost increases as green concepts are applied. For the efficient execution of green logistics management, it is absolutely necessary but difficult to build an optimal logistics system where each function is smoothly interacted through the proper integration and the link of various logistics functions and partners. This study aims to development of green logistics through integration of supply chain functions and partners. With this aim of study, case studies with analysis of embodiment, planning and operations for supply chain of companies are carried out.