• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.583-589
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• 2012

This work is concerned with a statistical approach to the life prediction on irradiation-assisted stress corrosion cracking (IASCC) of stainless steel (SS) for core internals of a pressurized water reactor (PWR). The previous results of the time-to-failure of IASCC measured on neutron-irradiated stainless steel components were statistically analyzed in terms of stress and irradiation. The accelerating life testing model of IASCC of cold worked Type 316 SS was established based on an inverse power model with two stress-variables, the applied stress and irradiation dose. Considering the variation of the yield strength and applied stress with the irradiation dose in the model, the remaining life of the baffle former bolt was statistically predicted during operation under complex environments of stress and irradiation.

• Fire Science and Engineering
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• v.33 no.1
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• pp.1-6
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• 2019

The activation energy of CPVC (Chlorinated Poly Vinyl Chloride) used for non-metallic synthetic resin piping in fire-fighting was measured by thermogravimetric analysis (TGA). The activation energy was determined using by TGA kinetic methods, such as Kissinger and Flynn-Wall-Ozawa method. The calculated activation energy was 128.07 kJ/mol (Kissinger method) and 145.60 kJ/mol (Flynn-Wall-Ozawa method). The difference in activation energies calculated by the Kissinger method and Flynn-Wall-Ozawa method was not considered to be significant considering that the different analysis methods. The combustion characteristics will be tested in a future study through an evaluation of thermal deterioration using an accelerated deterioration and air oven aging test and the lifetime of CPVC will be predicted.

• Journal of Conservation Science
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• v.35 no.2
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• pp.153-158
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• 2019

The traditional sizing treatment for the Hanji is performed to give the following functions. Those are to stabilize the paint of the painting, to prevent the paint of painting and moisture from smearing into the painting itself, to prevent the paint of the painting and moisture from passing to the lining paper, and to make the colors of painting match the surrounding.This study analyzed a result of the effect of Hanji sizing characteristic according to glue and alum mixing ratio and applying times, affects to pigments of painting and fastness of Hanji using accelerated aging test. As a result of color measurement of sizing treated Hanji, the concentration of glue and the number of application increased, the brightness and the $L^*$ value decreased but the yellowness index increased.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.9
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• pp.1293-1298
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• 2010

In most power plants, wall thinning in carbon-steel pipes due to flow-accelerated corrosion is one of the major aging phenomena, and it reduces the load-carrying capacity of the piping system. Various types of wall-thinning defects were manufactured in real-scale elbows, and monotonic in-plane bending tests were performed under internal pressure to evaluate the failure behavior of the elbows. In this paper, the behavior of elastic and plastic limit leads of locally thinned elbows in a real-scale failure test is presented. The loads determined on the basis of TES (twice elastic slope) were considered to be the limit loads of locally thinned elbows so that the integrity of the thinned elbows could be maintained, even when a small amount of plastic deformation might have occurred.

• Elastomers and Composites
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• v.47 no.3
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• pp.254-258
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• 2012

Material characteristics and the prediction of life time of polyacrylic rubber (ACM) for automotive engine gasket were studied. Two kinds of ACM rubber compounds, having chlorine cure-site and carboxyl cure-site, were made with optimum formulations and the properties of each materials were examined. As a test results for the thermal properties and compression set, which are very important in the application for the automotive engine gasket, the compound using ACM with carboxyl cure-site was evaluated as having a better characteristics than that of ACM with chlorine cure-site. Arrhenius relationship based on time-temperature superposition principle (TTSP) was obtained through the accelerated heat aging test to predict the useful life-time for the compound using ACM with carboxyl cure-site.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.207-210
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• 2017

The suspension arrangement of insulators provides flexibility and assists in power transmission in transmission lines. The performance of the insulator string is strongly influenced by the environmental conditions to which it is exposed, its shape and the inherent material properties of suspension-type insulators. The suspension-type insulators are mostly made from glass, porcelain and ceramic material due to their high resistivity. Irregularity in charge distribution throughout the porcelain insulator may lead to accelerated aging and electrical breakdown. A very high and steep lightning impulse voltage may also cause breakdown of suspension-type insulators. We investigated various material characteristics such as alumina addition, surface morphology, x-ray diffraction pattern and relative density of suspension porcelain insulators manufactured in 1989 (36,000 lbs.), 1995 (36,000 lbs.) and 2001 (36,000 lbs.) by the KRI Company for use in 154 kV high power transmission lines. We compared the material characteristics of these porcelain insulators with that of the top-of-the-line porcelain insulators (36,000 lbs.) manufactured by the NGK Company in 2000. These suspension-type porcelain insulators were exposed to arc and flashover tests to examine their electrical and mechanical strength. It was noted that alumina addition (17 wt.%) for K-2001 was one of the major contributors to the enhancement of the performance of the porcelain insulators and to their ability to withstand very high current generation during the arc test. The porcelain insulators manufactured during 2001 also showed the highest relative density of 95.8% as compared to the other insulators manufactured in 1989 and 1995 respectively 94.2% and 91.5%. We also discuss reports of various failure modes of suspension-type porcelain insulators.

• Tribology and Lubricants
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• v.35 no.4
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• pp.222-228
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• 2019

As rubber products such as O-rings, which are also known as packings or toric joints, come in regular, long term contact with liquid fuel, they can eventually swell, become mechanically weakened, and occasionally crack; this diminishes both their usefulness and intrinsic lifetime and could cause leaks during the steady-state flow condition of the fuel. In this study, we evaluate the lifetime of such products through compression set tests of FKM, a family of fluorocarbon elastomer materials defined by the ASTM international standard D141; these materials have great compression, sunlight, and ozone resistance as well as a low gas absorption rate. In this process, O-rings are immersed in the liquid fuel of airtight containers that can be expressed as a compression set, and the liquid fuel leakage in a flow rig tester at variable temperatures over 12 months is investigated. Using the Power Law model, our study determined a theoretical O-ring lifetime of 2,647 years, i.e. a semi-permanent lifespan, by confirming the absence of liquid fuel leakage around the O-ring assembled fittings. These results indicate that the FKM O-rings are significantly compatible for fuel tests to evaluate long-term sealing conditions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.700-707
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• 2016

Recently, ammunition malfunctions of the 40mm grenade were reported during live fire training. When 72 40mm grenades were fired by the army, 11 duds were encountered. The dud ammunition rate was approximately 15%. Because ammunition is used a long time after its manufacture, it is necessary to ensure its performance after long-term storage. In this study, we attempted to decrease the dud ammunition rate of 40mm grenade (K200) fuzes through quality improvement. First, it was determined by the detonator performance test that abnormal explosions occurred due to the degradation of the detonator as a result of its aging characteristics. Second, we improved the fuze quality of the 40mm grenade. Third, we tested its shelf life to estimate its life expectancy. The shelf life of the 40mm grenade fuze obtained using the Arrhenius equation was 6.5 years for the existing grenade fuze and 45.5 years for the improved grenade fuze. This showed that the shelf life of the improved grenade was increased approximately 7 times. Therefore, the improved 40mm grenade fuze contributes to the quality improvement of the 40mm grenade by decreasing the dud ammunition rate during long term storage.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.