• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1288-1291
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• 2004

In this study, physical characteristics of alumina slurry on variation of pH value and the effect of non-ionic surfactants on alumina slurry for copper chemical mechanical planarization (CMP) slurry have been investigated. After pH value of the slurry with alumina abrasive was changed by adding various amount of $HNO^3$ or KOH, the differences of settling rate, particle size, and zeta-potential were estimated. Better settling rates were shown in slurries with alumina abrasive at near pH 1. Higher zeta-potential was shown at around pH 2 in alumina slurry and the point of zero charge (PZC) was measured at about pH $9\sim10$. Non-ionic surfactant was added in the slurry with 5wt% alumina abrasive to get its effect on slurry practically. Abrasive size was smaller increased when amount of surfactant increased in slurry with P-4 as abrasive; on the other side, it was smaller when amount of surfactant decreased with AES-12. Variation of zeta-potential has no tendency with adding surfactant; however, values of zeta-potential were between $35\sim50mV$. The proper amount of surfactant was $0.1\sim1.0wt%$ in slurry with P-4 and $0.5\sim1.0wt%$ in slurry with AES-12 respectively. Excellent dispersion stabilization was obtained by addition of non-ionic surfactant

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.4
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• pp.14-19
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• 2009

Micro fluid channels are machined on quartz glass using powder blasting, and the machining characteristics of the channels are experimentally evaluated. The powder blasting process parameters such as injection pressure, abrasive particle size and density, stand-off distance, number of nozzle scanning, and shape/size of the required patterns affect machining results. In this study, the influence of the number of nozzle scanning, abrasive particle size, and blasting pressure on the formation of micro channels is investigated. Machined shapes and surface roughness are measured, and the results are discussed. Through the experiments and analysis, LOC are ettectinely machined on quartz glass using powder blasting.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.487-487
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• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.9
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• pp.1013-1018
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• 2014

Magnetic Abrasive Polishing (MAP) process is a nontraditional method for polishing the surface of workpiece by using the flexibility of tool. At present, a mixture of polishing abrasives and ferrous particles is used as the tool in the MAP process. Previously, an experiment was conducted with different sizes of polishing abrasives with an aim to improve the polishing accuracy. However, the sizes of ferrous particles are also expected to have a dominant effect on the process, warranting a study on the effect of the size of ferrous iron particles. In this study, an experiment was conducted using three different sizes of ferrous particles. Iron powder of average diameters 8, 78 and $250{\mu}m$ was used as ferrous particles. The effect of each ferrous particle size was evaluated by comparing the improvements in surface roughness. The particle size of a ferrous iron was found to play a significant role in MAP and particles of $78{\mu}m$ facilitated the best improvement in surface roughness.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.97-101
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• 1998

In this study, The ultra-precision finishing system is applicable to all kind of the cylnderical workpiece products fast and easy. This system was applied to chrome coated steel to investigate the characteristic of grinding; (1) 3$mu extrm{m}$ of abrasive film is not use for grinding performance. (2) Grinding condition of coated chrome steel would set up differently, in 30~12${\mu}{\textrm}{m}$, in 9~5${\mu}{\textrm}{m}$. (3) The surface roughness of chrome coated steel was about Ra 0.0009${\mu}{\textrm}{m}$ in abrasive grain size 5${\mu}{\textrm}{m}$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.520-523
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• 2002

The o]d technique of sandblasting which has been used for paint or scale removing, deburring, and glass decorating has recently been developed into a powder blasting technique for brittle materials, capable of producing micro structures larger than $100\mu\textrm{m}$. In this study, we investigated the effect of the size of abrasive and the stand-off distance on the machinability of SUS 304. The varying parameters were the impact angle $90^{\circ}$, scanning times of nozzle 10 and the different nozzle height between 70mm and 140mm. The diameter of dot pattern were 0.2mm. The powder were alumina sharp particles, WA #600, #800 and #2000. The blasting pressure of powder at 0.3 Mpa.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.5
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• pp.578-584
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• 2011

In mechanical cutting process, burr was generated at workpiece by cutting tool generally. It is working disturbance during manufacturing process. Besides burr was taken shape relatively large size more micro scale machining than macro scale machining. Many researches have been studied to remove micro burr(de-burring), because it was negative effect for accuracy of machining shape. However, micro de-burring was constrained by burr height, micro feature and so on. In this paper, experimental research was carried out to compare de-burring characteristics of $Al_2O_3$ abrasive and polymer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.40-41
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• 2005

In this study, we proposed CMP micro-scratches generated by contaminative particle which existed on the wafer surface prior to CMP process. The CMP micro-scratches are one of the slurry abrasive related damage. To reduce the micro-scratches, research efforts have been devoted to the optimization of slurry abrasive size distribution. In addition of slurry abrasive, it was found that contaminative particles also were major CMP micro-scratch source.

• Journal of IKEEE
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• v.23 no.4
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• pp.1175-1181
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• 2019

In this paper, we have studied the chemical mechanical polishing(CMP) characteristics of mixed abrasive silica slurry(MAS) retreated by adding of manganese oxide(MnO₂) abrasives within 1:10 diluted silica slurry. A slurry designed for optimal performance should produce high removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The polishing performances of MnO₂ abrasive-added MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared to original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, our proposed MnO₂-MAS can be useful to save on the high cost of slurry consumption since we used a 1:10 diluted silica slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.140-143
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• 2004

Chemical mechanical polishing(CMP) is essential technology to secure the depth of focus through the global planarization of wafer. But a variety of defects such as contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the resistance because they decrease the interconnect section area, and ultimately reduce the life time of the semiconductor. Due to this dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred over-polishing. Decreasing of abrasive concentration results in advanced pattern selectivity which can lead the uniform removal in chip and decrease of over-polishing. The fixed abrasive pad was applied and tested to reduce dishing and erosion in this paper. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed fixed abrasive pad and chemicals.