• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.67-71
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• 2003

실리콘 주괴(ingot)에서 실리콘 웨이퍼를 제조할 때 사용되는 슬러리는 SiC 연마재와 절삭유를 포함한다. 실리콘 웨이퍼 제조 시 생긴 폐슬러지에서 SiC 연마재와 절삭유는 분리되어 재활용된다. 본 연구는 폐슬러지 Si 분말에 C분말을 혼합하여 SiC를 합성하는 것에 관한 것이다. 다양한 크기의 SiC 분말과 휘스커가 제조되었으며 기존의 휘스커의 크기보다 작은 나노미터 크기의 휘스커도 발생하였다. 일반적으로 휘스커는 금속 불순물을 첨가하여 제조되는데, 본 연구에서 나노미터 크기의 휘스커 발생은 폐슬러지에 첨가되어있는 미세한 크기의 금속불순물의 영향으로 판단된다.

• 한국지구물리탐사학회:학술대회논문집
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• 한국지구물리탐사학회 2003년도 Proceedings of the international symposium on the fusion technology
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• pp.637-641
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• 2003

Abrasive powders were recovered from electrical industry sludge by simple physical separation for their recycling. The raw electrical industry sludge was filter pressed, dried, dispersed and then classified by air classifier at various conditions. The three kinds of particles with different particle size distribution were classified by controlling rotor speed and air volumes of the classifier. The recovered abrasive powders, which are classified at 5,000,9000 and 13,000 rpm of rotor speed, are almost same properties to raw pumice, garnet and rouge powders, respectively. The results of particle size analysis, X-ray diffraction and SEM observation show that the recovered powders can be reused as an abrasive powders.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권11호
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• pp.551-555
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• 2004

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1091-1092
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• 2006

Silicon nitride - silicon carbide composite was developed by using an abrasive SiC powders as a raw material. The composites were prepared by mixing abrasive SiC powder with silicon, pressing and sintering at $1400^{\circ}C$ under nitrogen atmosphere in atmosphere controlled vacuum furnace. The proportion of silicon in the initial mixtures varied from 20 to 50 wt%. After sintering, crystalline phases and microstructure were characterized. All composites consisted of ${\alpha}-Si_3N_4$ and ${\beta}-Si_3N_4$ as the bonding phases in SiC matrix. Their physical and mechanical properties were also determined. It was found that the density of the obtained composites increased with an increase in the $Si_3N_4$ content formed in the reaction.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1877-1880
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• 2003

We were interest in Deburring using MAF(magnetic abrasive finishing) method. So Magnetic inductor was designed and manufactured to generate proper magnetic induction fer deburring the burr formed in drilling SM45C. We experienced according to the Rotational speed, table feed rate, grain size of powder and working gap are changed to investigate the effect on deburring. At this time we experienced in abrasive effect mainly.

• 한국재료학회지
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• 제11권10호
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• pp.907-911
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• 2001

In order to improve the grindability of magnetic abrasive, Fe-WC magnetic abrasives were made by a plasma melting method after ball milling at various times. This study aims to investigate homogeneously distributed hard phases in Fe matrix and strong bonding between the Fe-matrix and the hard phase. According to XRD, SEM and OM observation, Fe-WC magnetic abrasive powders exhibit the best grindability by plasma melting for 30h ball milling. As a result of magnetic abrasive polishing, the surface roughness, R_{max}$ 5.0$\mu\textrm{m}$, before magnetic abrasive polishing, was reduced to R_{max}$ 2.4$\mu\textrm{m}$. The new magnetic abrasive polishing process is thought to be the useful methods for the automation of three dimensional surface polishing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.109-112
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• 2003

Recently, CMP (Chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. Also, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국주조공학회지
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• 제14권5호
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• pp.447-454
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• 1994

Wear resistance and wear mechanism of hypereutectic Al-($15{\sim}40$)wt%Si alloys were investigated. Primary Si particles under $20{\mu}m$ size were formed in hypereutectic Al-Si alloy powders due to rapid solidification. But the Si particles of extruded bars were finely distributed in smaller size than that of atomized powders. The wear mechanism of hypereutectic Al-Si alloys was divided into three types of wear phenomena, which were abrasive wear, delamination wear and severe adhesive wear according to sliding speed and load. At low sliding speed and load, wear mechanism was abrasive wear, so Al-15wt%Si alloy showed the best wear resistance. At high sliding speed and load, wear mechanism was adhesive wear, and Al-40wt%Si alloy showed the best wear resistance.