• 한국초전도ㆍ저온공학회논문지
• /
• 제6권1호
• /
• pp.12-17
• /
• 2004

High critical current density. $J_c$ over $1MA/cm^2$ at 77 K in a self field was successfully achieved from the YBCO film prepared on (100) $SrTiO_3$ single-crystal substrates by the TFA-MOD process. Unlike a normal TFA-MOD process, we prepared the TFA precursor solution by dissolving YBCO powder into the trifluoroacetic acid. A significant amount of the second phases, including $BaF_2$, was observed in the films fired at $700-725^{\circ}C$ for 2 h under $P(O_2)=10^{-3}$ atm and $P(H_2O)=4.2%$, most probably due to an insufficient reaction time, and hence $T_c$ was greatly degraded. However the films fired at $750-800^{\circ}C$ for 2 h were composed of strongly c-axis oriented YBCO grams without any second phases. and exhibited the $T_c$ values of 89.5 ~ 91 K with a sharp transition. With increasing the firing temperature from 750 to $800^{\circ}C$ average grain size of YBCO was increased and grain connectivity was enhanced. The highest $J_c$ value of $1.1MA/cm^2$ was obtained from the YBCO film fired at $800^{\circ}C$.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1997년도 제12회 학술발표회 논문개요집
• /
• pp.72-72
• /
• 1997

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1996년도 재료학회 추계학술발표회
• /
• pp.89-89
• /
• 1996

• 한국전기전자재료학회논문지
• /
• 제23권6호
• /
• pp.487-490
• /
• 2010

This paper describes the elecrtical and optical characteristics of $N_2$ doped porous 3C-SiC films. Polycrystalline 3C-SiC thin films are anodized by $HF+C_2H_5OH$ solution with UV-LED exposure. The growth of in-situ doped 3C-SiC thin films on p-type Si (100) wafers is carried out by using APCVD (atmospheric pressure chemical vapor deposition) with a single-precursor of HMDS (hexamethyildisilane: $Si_2(CH_3)_6)$. 0 ~ 40 sccm $N_2$ was used for doping. After the growth of doped 3C-SiC, porous 3C-SiC is formed by anodization with $7.1\;mA/cm^2$ current density for anodization time of 60 sec. The average pore diameter is about 30 nm, and etched area is increased with $N_2$ doping rate. These results are attributed to the decrease of crystallinity by $N_2$ doping. Mobility is dramatically decreased in porous 3C-SiC. The band gaps of polycrystalline 3C-SiC films and doped porous 3C-SiC are 2.5 eV and 2.7 eV, respectively.

• Journal of Korean Vacuum Science & Technology
• /
• 제4권3호
• /
• pp.73-77
• /
• 2000

Single crystal and polycrystalline Si thin films were doped with phosphorus by a 2-zone diffusion method to develop the low-resistivity polycrystalline Si electrode for a hemispherical grain. Solid phosphorus source was used in order to achieve uniformly and highly doped surface region of polycrystalline Si films having rough surface morphology. In case of 2-zone diffusion method, it is proved that the heavy doping near the surface area can be achieved even at a relatively low temperature. SIMS analysis revealed that phosphorus doping concentration in case of using solid P as a doping source was about 50 times as that of phosphine source at 750$^{\circ}C$. Also, ASR analysis revealed that the carrier concentration was about 50 times as that of phosphine. In order to evaluate the electrical characteristics of doped polycrystalline Si films for semiconductor devices, MOS capacitors were fabricated to measure capacitance of polycrystalline Si films. In ${\pm}$2 V measuring condition, Si films, doped with solid source, have 8% higher $C_{min}$ than that of unadditional doped Si films and 3% higher $C_{min}$ than that of Si films doped with $PH_3$ source. The leakage current of these films was a few fA/${\mu}m^2$. As a result, a 2-zone diffusion method is suggested as an effective method to achieve highly doped polycrystalline Si films even at low temperature.

• 한국세라믹학회지
• /
• 제39권9호
• /
• pp.829-834
• /
• 2002

$Er(NO_3)_3{\codt}5H_2O,\;Mn(CH_3CO_2)_2{\cdot}4H_2O$를 출발원료로 사용하여 졸-겔 법으로 Si(100) 기판 위에 코팅된 $ErMnO_3$ 박막의 강유전 특성에 관하여 연구하였다. $ErMnO_3$ 박막은 800$^{\circ}C$에서 결정화가 시작되었으며, (001)로 우선 배향된 $ErMnO_3$ 박막을 얻을 수 있었다. 본 실험에서 800$^{\circ}C$에서 1 h 열처리하여 얻은 $ErMnO_3$ 박막은 1∼100 KHz의 주파수 범위에서 유전 상수(k)는 26, 유전 손실(tan ${\delta}$)은 0.032의 값을 나타내었으며, 이때 $ErMnO_3$ 박막의 입자 크기는 10∼30 nm이었다. 강유전 특성은 (001) 배향성이 증가할수록 잔류 분극 값이 증가하였으며, 800$^{\circ}C$에서 1시간 열처리하여 $ErMnO_3$ 박막의 잔류 분극 값($P_r$)은 400 nC/$cm^2$를 나타내었다. 또한 열처리 시간이 증가할수록 치밀하고 균일한 박막을 얻어 낮은 항전계 ($E_c$) 값을 가졌다.

• 한국표면공학회지
• /
• 제32권3호
• /
• pp.351-355
• /
• 1999

BN films with a high content of cubic phase has been deposited by a variety of techniques. It is well known that c-BN films grow with a unique microstructure consisting of $sp^2$ and $sp^{3-}$ bonded layers. Because of existence of the initially grown $sp^{2-}$ /bonded layer, BN films are not adhesive to the substrates. In this study, post-N$^{+ }$ / implantation was applied to improve the adhesion of the films. A Monte Carlo program TAMIX was used to simulate this modification process. The simulation showed nitrogen concentration profile at $1200\AA$ in depth in case of 50keV -implantation energy. FTIR spectra of the $N^{+}$ implanted specimens demonstrated a strong change of absorption band at 1380 cm$^{ -1 }$The films were also investigated by HRTEM. From these results, it is concluded that the post ion implantation could be an effective technique which improves the adhesion between BN film and substrate.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2003년도 춘계종합학술대회
• /
• pp.501-504
• /
• 2003

본 연구에서는 박막트랜지스터의 특성 향상을 위하여 강유전성 박막을 게이트 절연충으로 사용하기 위하여 강유전성 박막과 a-Si:H 의 계면특성을 조사하였다. 먼저 강유전성 박막 중에 대표적인 SrTiO$_3$를 E-BEAM 증착기로 박막을 형성시켰다. 형성된 박막은 $N_2$ 분위기에서 15$0^{\circ}C$~$600^{\circ}C$로 1시간 ANNEALING 하여 전자현미경으로 표면을 측정하였다. SrTiO$_3$의 유전상수는 50~100 정도였으며 항복전계는 1~l.5 MV/cm로 매우 우수한 유전특성을 갖고 있었다. 강유전체 박막 위에 a-SiN:H,a-Si:H(n-type a-Si:H) 등을 PECVD로 증착하여 MFNS구조를 형성하였다. 계면특성을 C-V PLOTTER로 측정한 결과 SrTiO$_3$ 박막은 SiN 과의 접합이 매우 안정되어 있었고 C-V특성은 SiN/a-Si:H 과 유사하였다. 그러나 FERROELECTRIC/a-S:H의 경우가 훨씬 CAPACITANCE값이 컸으며, 이는 강유전체 박막의 높은 유전상수에 기인 된 것이라 생각된다.

• E2M - 전기 전자와 첨단 소재
• /
• 제11권10호
• /
• pp.53-59
• /
• 1998

Paraelectric lead landthanum titanate(PLT) thin films have been prepared by a reactive dc magnetron sputtering system using a multicomponent metal target. The surface area control of each element on the target markedly facilitates the fabrication of thin films of complex ceramic compounds. A postdeposition heat-treatment was applied to all as-deposited PLT thin films at annealing temperatures up to 75$0^{\circ}C$ for crystalization. The composition of the PLT(28) thin filmannealed at $650^{\circ}C$ was: Pb, 0.73; La, 0.28; Ti, 0.88; O, 2.9. The dielectric constant and dissipation factor of the thin film(200 nm) at low filed measurements (500 Vcm-1) are 1216 and 0.018, respectively. The charge storage density using a typical Sawyer-Tower circuit with a 500 Hz sine wave was 12.5 $\mu$Ccm-2 at the electric field of 200 kVcm-1.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
• /
• pp.1402-1404
• /
• 2009

The silicon nitride films for gate dielectric were deposited by catalytic chemical vapor deposition at low temperature (${\leq}200^{\circ}C$). The mixture of $SiH_4$, $NH_3$ and $H_2$ was used as source gases. The current-voltage (I-V) and the capacitance-voltage (C-V) characteristics of the films were measured. The breakdown voltage and the flat band voltage shift of samples were improved by increase of the $NH_3$ contents and $H_2$ dilution ratio. The defect states were analyzed by photoluminescence (PL) spectra. As the defect states decreased, the breakdown voltage and the flat band voltage shift increased.