• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.565-566
• /
• 2006

Slurry used in metal chemical mechanical polishing normally consists of an oxidizer, a complexing agent, a corrosion inhibitor and an abrasive. This paper investigates effects of citric acid as a complexing agent for Cu CMP with $H_2O_2$ as an oxidizer. In order to study chemical effects of a citric acid, x-ray photoelectron spectroscopy were performed on Cu sample after Cu etching test. XPS results reveal that CuO, $Cu(OH)_2$ layer decrease but Cu/$Cu_2O$ layer increase on Cu sample surface. To investigate nanomechanical properties of Cu sample surface, nanoindentation was performed on Cu sample. Results of nanoindentation indicate wear resistance of Cu Surface decrease. According to decrease of wear resistance on Cu surface, removal rate increases from $285\;{\AA}/min$ to $8645\;{\AA}/min$ in Cu CMP.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.208-208
• /
• 2010

본 연구에서는 투명전도성산화막으로 적용 가능한 Ga이 도핑된 ZnO(GZO)의 성장 및 후처리 과정에 따른 구조적, 전기적, 광학적 특성을 관찰하였다. GZO 박막은 상온과 $200^{\circ}C$, 50~250 mTorr (50 mTorr 단계)에서 RF 마그네트론 스퍼터법으로 증착하였다. 이와 같은 조건에서 성장 된 박막의 특성을 분석하여 최적의 온도 및 작업압력에서 RF power를 변화시켜 박막을 성장한 후 질소 및 수소를 이용한 후처리 공정을 통하여 GZO 박막을 제작, 각 조건에 따른 구조적, 전기적 및 광학적 특성 변화를 조사하였다. XRD 측정에서, 열처리 전 시료에서는 GZO (002) 상의 Bragg-Angle 위치가 호스트 물질 ZnO의 기준위치보다 낮은 각도 쪽에서 나타났으며, 이는 Ga이 Zn와 치환되지 못하고 격자 내에 침입형태로 존재함에 따른 것으로 판단된다. 열처리 이후 전반적으로 분위기 가스의 종류에 관계없이 결정성, 광투과율 및 전기적 특성이 향상되는 것이 관측되었다. 질소 분위기에서 열처리된 GZO 박막의 경우, 전반적으로 박막 증착 시 초기 작업압력의 증가에 따라 비저항이 증가하는 현상이 관측되었다. 반면, 수소 분위기에서 열처리된 박막에서는 박막 증착 초기 작업 압력이 증가함에 따라 비저항이 감소하는 경향이 관측되었다. 이러한 결과는 XPS(X-Ray Photoelectron Spectroscopy)로 분석한 결과, 질소 분위기에서 열처리된 GZO 박막은 O-H 결합이 Zn-O 결합에 비해 과도하지 않은 반면, 수소화 처리된 GZO 박막에서 Zn-O 결합에 비해 과도한 O-H 결합이 존재하기 때문으로 관측되었다. 그러한 이유는 O-H 결합이 GZO 박막 내 산소 결공($V_o$)과 밀접한 관계가 있기 때문이며, O-H 결합의 증가는 $V_o$-H 결합체의 증가를 의미하기 때문이다.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2003.05a
• /
• pp.41-41
• /
• 2003

텅스텐(W)은 높은 thermal stability 와 process compatibility 및 우수한 corrosion r resistance 둥으로 integrated circuit (IC)의 gate 및 interconnection 둥으로의 활용이 대두되고 있으며, 차세대 thin film transistor liquid crystal display (TFT-LCD)의 gate 및 interconnection m materials 둥으로 사용되고 았다. 그러나, 이러한 장점을 가지고 있는 팅스텐 박막이 실제 공정상에 적용되가 위해서는 건식 식각이 주로 사용되는데, 이는 wet chemical 을 이용한 습식 식각을 사용할 경우 낮은 etch rate, line width 의 감소 및 postetch residue 잔류 동의 문제가 발생하기 때문이다. 또한 W interconnection etching 을 하기 위해서는 높은 텅스텐 박막의 etch rate 과 하부 layer ( (amorphous silicon 또는 poly-SD와의 높은 etch selectivity 가 필수적 이 라 할 수 있다. 그러 나, 지금까지 연구되어온 결과에 따르면 텅스탠과 하부 layer 와의 etch selectivity 는 2 이하로 매우 낮게 관찰되고 았으며, 텅스텐의 etch rate 또한 150nm/min 이하로 낮은 값을 나타내고 있다. 따라서 본 연구에서는 halogen-based inductively coupled plasma 를 이용하여 텅스텐 박막 식각시 여러 가지 첨가 가스에 따른 높은 텅스탠 박막의 etch rate 과 하부 layer 와의 높은 etch s selectivity 를 얻고자 하였으며, 그에 따른 식각 메커니즘에 대하여 알아보고자 하였다. $CF_4/Cl_2$ gas chemistry 에 첨 가 가스로 $N_2$와 Ar을 첨 가할 경 우 텅 스텐 박막과 하부 layer 간의 etch selectivity 증가는 관찰되지 않았으며, 반면에 첨가 가스로 $O_2$를 사용할 경우, $O_2$의 첨가량이 증가함에 따라 etch s selectivity 는 계속적으로 증가렴을 관찰할 수 있었다. 이는 $O_2$ 첨가에 따라 형성되는 WOF4 에 의한 텅스텐의 etch rates 의 감소에 비하여, $Si0_2$ 등의 형성에 의한 poly-Si etch rates 이 더욱 크게 감소하였기 때문으로 사료된다. W 과 poly-Si 의 식각 특성을 이해하기 위하여 X -ray photoelectron spectroscopy (XPS)를 사용하였으며, 식각 전후의 etch depth 를 측정하기 위하여 stylus p pmfilometeT 를 이용하였다.

• Journal of Welding and Joining
• /
• v.30 no.3
• /
• pp.26-31
• /
• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Elastomers and Composites
• /
• v.40 no.1
• /
• pp.22-28
• /
• 2005

In this work, the effect of oxygen plasma treatment of nano-scaled silica on the mechanical interfacial properties and thermal stabilities of the silica/rubber composites was investigated. The surface properties of the silica were studied in X-ray photoelectron spectroscopy (XPS) and contact angles. And, their mechanical interfacial properties and thermal stabilities of the composites were characterized by tearing energy ($G_{IIIC}$) and thermogravimetric analysis (TGA), respectively. As a result, it was found that the introduction rate of oxygen-containing polar functional groups onto the silica surfaces was increased by increasing the plasma treatment time, resulting in improving the tearing energy. Also, the thermal stabilities of the composites were increased by increasing the treatment time. These results could be explained that the polar rubber, such as acrylonitrile butadiene rubber (NBR), showed relatively a high degree of interaction with oxygen-containing functional groups of the silica surfaces in a compounding system.

• Journal of Industrial and Engineering Chemistry
• /
• v.67
• /
• pp.244-254
• /
• 2018

Surface modified poly ${\text\tiny{L}}$-lactic acid (PLLA) samples with hydroxyapatite (HA), heparin and bone morphogenetic protein-2 (BMP-2) mediated by polydopamine (pDA) coating (PLLA/pDA/HA/Hep/BMP-2) were prepared, and their effects on the enhancements of bone formation and osseointegration were evaluated in vitro and in vivo as compared to PLLA, PLLA/pDA/HA, and PLLA/pDA/Hep/BMP-2. The changes in surface chemical compositions, morphologies and wettabilities were observed by X-ray photoelectron spectroscopy (XPS), field-emission scanning electron microscopy (FE-SEM), atomic force microscopy (AFM) and water contact angle measurements. Pre-coating of HA particles with pDA provided uniform and homogeneous anchoring of particles to PLLA surface. In addition, the strong ionic interaction between heparin and pDA led PLLA surface readily heparinized for loading of BMP-2. In vitro experiments revealed that the levels of alkaline phosphatase (ALP) activity, calcium deposition, and osteocalcin (OCN) gene expression were higher in MG-63 human osteosarcoma cell lines grown on PLLA/pDA/HA/Hep/BMP-2 than on control PLLA, PLLA/pDA/HA, and PLLA/pDA/Hep/BMP-2. In vivo studies using micro-computed tomography (micro-CT) also showed that PLLA/pDA/HA/Hep/BMP-2 screw exhibited greatest value of bone volume (BV) and bone volume/tissue volume (BV/TV) among samples. Histological evaluations with H&E and Von Kossa staining demonstrated that a combination of HA and BMP-2 contributed to the strong osseointegration.

• Nuclear Engineering and Technology
• /
• v.56 no.1
• /
• pp.34-41
• /
• 2024

This work presents experimental data and modelling of the release of Mo from high-burnup spent nuclear fuel (63 MWd/kgU) at two different pH values, 8.4 and 13.2 in air. The release of Mo from SF to the solution is around two orders of magnitude higher at pH = 13.2 than at pH = 8.4. The high Mo release at high pH would indicate that Mo would not be congruently released with uranium and would have an important contribution to the Instant Release Fraction, with a value of 5.3%. Parallel experiments with pure non irradiated Mo(s) and XPS determinations indicated that the faster dissolution at pH = 13.2 could be the consequence of the higher releases from metallic Mo in the fuel through a surface complexation mechanism promoted by the OH^- and the oxidation of the metal to Mo(VI) via the formation of intermediate Mo(IV) and Mo(V) species.

• Korean Journal of Materials Research
• /
• v.34 no.3
• /
• pp.152-162
• /
• 2024

In this study, we introduce a novel TiN/Ag embedded TiO₂/FTO resistive random-access memory (RRAM) device. This distinctive device was fabricated using an environmentally sustainable, solution-based thin film manufacturing process. Utilizing the peroxo titanium complex (PTC) method, we successfully incorporated Ag precursors into the device architecture, markedly enhancing its performance. This innovative approach effectively mitigates the random filament formation typically observed in RRAM devices, and leverages the seed effect to guide filament growth. As a result, the device demonstrates switching behavior at substantially reduced voltage and current levels, heralding a new era of low-power RRAM operation. The changes occurring within the insulator depending on Ag contents were confirmed by X-ray photoelectron spectroscopy (XPS) analysis. Additionally, we confirmed the correlation between Ag and oxygen vacancies (V_o). The current-voltage (I-V) curves obtained suggest that as the Ag content increases there is a change in the operating mechanism, from the space charge limited conduction (SCLC) model to ionic conduction mechanism. We propose a new filament model based on changes in filament configuration and the change in conduction mechanisms. Further, we propose a novel filament model that encapsulates this shift in conduction behavior. This model illustrates how introducing Ag alters the filament configuration within the device, leading to a more efficient and controlled resistive switching process.

• Applied Chemistry for Engineering
• /
• v.35 no.4
• /
• pp.352-359
• /
• 2024

Environmental pollution from heavy metal ions (HMIs) is a global concern. Recently, biosorption methods using cellulose sorbents have gained popularity. The objective of this study was to assess the removal efficiency of Cu(II), Pb(II), and Hg(II) ions at low concentration levels (100-700 ppb) from aqueous solutions using three different cellulose fiber-based filter media. Sample A was pure cellulose fiber, Sample B was 10% activated carbon-cellulose fiber, and Sample C was cellulose fiber-glass fiber-30% activated carbon-20% amorphous titanium silicate (ATS). The samples were characterized by several physicochemical techniques. The porosity measurements using N₂ sorption isotherms revealed that Samples A and B are nonporous or macroporous materials, whereas the addition of 50% filler materials into the cellulose resulted in a microporous material. The Brunauer-Emmett-Teller (BET) surface area and pore volume of Sample C were found to be 320.34 m²/g and 0.162 cm³/g, respectively. The single ion batch adsorption experiments reveal that at 700 ppb initial metal ion concentration, Sample A had removal efficiencies of 7.5, 11.5, and 13.7% for Cu(II), Pb(II), and Hg(II) ions, respectively. Sample B effectively eliminated 99.6% of Cu(II) ions compared to Pb(II) (14.2%) and Hg(II) (31.9%) ions. Cu(II) (99.37%) and Pb(II) (96.3%) ions are more efficiently removed by Sample C than Hg(II) (68.2%) ions. The X-ray photoelectron spectroscopy (XPS) wild survey spectrum revealed the presence of Cu(II), Pb(II), and Hg(II) ions in HMI-adsorbed filter media. The high-resolution C1s spectra of Samples A and B reveal the presence of -C-OH and -COOH groups on their surface, which are essential for HMIs adsorption via complexation reactions. Additionally, the ATS in Sample C facilitates the adsorption of Pb(II) and Hg(II) ions through ion exchange.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.38 no.12
• /
• pp.8-13
• /
• 2001

Cerium oxide ($CeO_2$) thin film has been proposed as a buffer layer between the ferroelectric thin film and the Si substrate in Metal-Ferroelectric-Insulator-Silicon (MFIS) structures for ferroelectric random access memory (FRAM) applications. In this study, $CeO_2$ thin films were etched with $Cl_2$/Ar gas mixture in an inductively coupled plasma (ICP). Etch properties were measured for different gas mixing ratio of $Cl_2$($Cl_2$+Ar) while the other process conditions were fixed at RF power (600 W), dc bias voltage (-200 V), and chamber pressure (15 mTorr). The highest etch rate of $CeO_2$ thin film was 230 ${\AA}$/min and the selectivity of $CeO_2$ to $YMnO_3$ was 1.83 at $Cl_2$($Cl_2$+Ar gas mixing ratio of 0.2. The surface reaction of the etched $CeO_2$ thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. There is a Ce-Cl bonding by chemical reaction between Ce and Cl. The results of secondary ion mass spectrometer (SIMS) analysis were compared with the results of XPS analysis and the Ce-Cl bonding was monitored at 176.15 (a.m.u). These results confirm that Ce atoms of $CeO_2$ thin films react with chlorine and a compound such as CeCl remains on the surface of etched $CeO_2$ thin films. These products can be removed by Ar ion bombardment.