• 제목/요약/키워드: X-ray inspection

검색결과 213건 처리시간 0.032초

X-Ray TDI Camera를 이용한 알루미늄 주강품 검사장치 개발 (Development of Inspection System for Aluminum Castings with X-Ray TDI Camera)

  • 남문호;박성욱;김창호;정찬수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2011년도 제42회 하계학술대회
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    • pp.1734-1735
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    • 2011
  • In case of inspection on aluminum castings, traditional RT (Radiographic Testing) method have been utilized for its advantages in interpretation, cost and perpetual storage. But it has disadvantages like time consumption in film processing, low efficiency in storage and environmental pollution. In this thesis, a DRS (Digital Radiography System) utilizing X-Ray TDI Camera (Time Delay and Integration Camera) is developed. Inspections on aluminum castings are performed using the developed Digital Radiography System, DRS and reviewed if newly developed system can substitute for the traditional method.

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X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출 (Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image)

  • 송춘삼;조성만;김준현;김주현;김민영;김종형
    • 제어로봇시스템학회논문지
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    • 제15권9호
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    • pp.916-921
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    • 2009
  • The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

초음파를 이용한 추진제/라이너 미접착 및 추진제 미세 크랙의 결함 검출 기법 (Ultrasonic Inspection Technology of Defect Detection of Propellant/Liner Debond & Propellant Microcrack)

  • 나성엽
    • 한국추진공학회지
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    • 제11권1호
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    • pp.34-42
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    • 2007
  • 초음파를 이용한 추진기관의 비파괴검사는 X-ray 검사에 비하여 경제성이 우수하고, X-ray 검사 시 취약한 미접착, 손상 등의 결함 검출이 우수한 편이다. 그리고 전용 시설 없이 현장에서 실시간으로 검사가 가능하며 방사선 작업에 비하여 안전한 방법이다. 본 논문에서는 고체 추진제에 대한 초음파 특성을 분석하고, 추진제/라이너 미접착에 대한 내측과 외측 검사 방법 및 추진제 손상에 의한 미세 크랙 검출에 대하여 실험 및 분석하였다. 실험 결과, 추진제/라이너 미접착에 대한 내.외측 검사에 있어서 검출 가능성을 보였으며, 그리고 손상에 의한 추진제 미세 크랙도 초음파의 감쇠특성을 이용하여 검출 가능함을 보였다.

CAD 데이터 및 엑스레이 CT이미지 비교를 통한 다이캐스팅 부품의 내부 결함 검사방법 (Internal Defects Inspection of Die-cast Parts via the Comparison of X-ray CT Image and CAD Data)

  • 홍경택;심재홍
    • 반도체디스플레이기술학회지
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    • 제17권1호
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    • pp.27-34
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    • 2018
  • Industrially, die-casting products are formed through casting, and so the methods to inspect the defects inside them are very restrictive. External inspection methods including visual inspection, sampling judgment, etc. enables researchers to inspect possible external defects, but x-ray inspection equipment has been generally used to inspect internal ones. Recently, they have been also applying three-dimensional internal inspections using CT equipment. However, they have their own limitations in applying to the use of industrial inspection due to limited detection size and long calculation time. To overcome the above problems, this paper has suggested a method to inspect internal defects by comparing the CAD data of the product to be inspected with the 3D data of the CT image. In this paper, we proposed a method for fast and accurate inspection in three dimensions by applying x-ray inspection to find internal defects in industrial parts such as aluminum die casting products. To show the effectiveness of the proposed method, a series of experiments have been carried out.

X-RAY Inspection for PCB/SMT & Electronics Components Latest Development

  • Maur Friendhelm W.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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    • pp.17-25
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    • 2004
  • During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of .5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging and SMT.

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반복복원 기법을 이용한 전자회로기판의 납땜부 형상 복원 (Shape Reconstruction of Solder Joints on PCB using Iterative Reconstruction Technique)

  • 조영빈;권대갑
    • 제어로봇시스템학회논문지
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    • 제5권3호
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    • pp.353-362
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    • 1999
  • This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

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진단용 X선장치의 성능 실태 조사연구 (A Study on the Test of Efficiency of the Diagnostic X-ray Equipment according to Their Rectifications)

  • 선종률
    • 대한방사선기술학회지:방사선기술과학
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    • 제20권2호
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    • pp.44-48
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    • 1997
  • For the efficient management of the diagnostic x-ray equipment, a nation-wide inspection of hospitals was performed by an inspection institute in Taejon in the first half of 1997. Among those hospitals inspected, 28 equipments(machines) which were over 500 mA were randomly selected according to their characteristics : 7 condenser type x-ray equipments, 7 three control phase of full wave rectification of type remote control x-ray equipments, 7 single phase of full wave rectification type for general radiography equipments, and 7 single phase of full wave rectification type of R/F equipments. We obtained the following results by conducting the experiment based on the efficiency of the equipments mentioned above. 1) When the equipments are analyzed, 2 out of 7 single phase of full wave rectification type of general radiography equipments(28.6%), 3 out of 7 single phase of full wave rectification type of R/F equipments(42.9%), 5 out of 7 three phase of full wave rectification type remote of control x-ray equipments(71.4%), and 4 out of 7 condenser type of x-ray equipments(57.1%) showed suitability. It proves the superiority of the three phase of full wave rectification type of remote control x-ray equipments. 2) From the overall analysis, only about 50% of the equipments(suitability of 14 out of 28) maintain the efficient management. Therefore, maintenance management of equipments is more necessary. If the efficiency of the x-ray equipment is uniformly maintained and managed to prevent the breakdown(trouble) beforehand especially through the continuous inspection of tube voltage, tube current, exposure time, and collimator, the financial loss and exposure dose to the patient, as well as the workers engaged in radiation, can be reduced for better medical service.

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Investigation of a novel on-site U concentration analysis method for UO2 pellets using gamma spectroscopy

  • Lee, Haneol;Park, Chan Jong
    • Nuclear Engineering and Technology
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    • 제53권6호
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    • pp.1955-1963
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    • 2021
  • As the IAEA has applied integrated safeguards and a state level approach to member states, the importance of national inspection has increased. However, the requirements for national inspection for some member states are different from the IAEA safeguards. In particular, the national inspection for the ROK requires on-site U concentration analysis due to a domestic notification. This research proposes an on-site U concentration analysis (OUCA) method for UO2 pellets using gamma spectroscopy to satisfy the domestic notification requirement. The OUCA method calculates the U concentration of UO2 pellets using the measured net X-ray counts and declared 235U enrichment. This research demonstrates the feasibility of the OUCA method using both MCNP simulation and experiment. It simulated and measured the net X-ray counts of different UO2 pellets with different U concentrations and 235U enrichments. The simulated and measured net X-ray counts were fitted to polynomials as a function of U concentration and 235U enrichment. The goodness-of-fit results of both simulation and experiment demonstrated the feasibility of the OUCA method.

형광지를 이용한 물품검사 X-선 DR 영상처리 시스템 개발 (The development of product inspection X-ray DR image processing system using intensifying screen)

  • 박문규;문하정;이동훈
    • 한국정보통신학회논문지
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    • 제19권7호
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    • pp.1737-1742
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    • 2015
  • 물품 검사를 위한 산업현장에서는 물품의 표면뿐만 아니라 내부 부품결함 검사 또한 필요하다. 일반적으로 생산 공정에서의 물품 검사로 광학 검사를 많이 이용한다. 하지만 이는 표면상의 결함만을 검사할 뿐 물품 내부의 검사를 수행하기는 어렵다. 이러한 제한점을 극복하기 위해 광학 장치 대신 휴대용 X-선 DR 영상 획득 장치를 이용하여 영상을 실시간으로 얻는 동시에 제품 불량을 판별할 수 있는 시스템을 개발하였다. X-선 영상을 얻은 후 머신영상 처리를 통해 설정한 기준 값에 오차범위를 허용하면 통과, 그렇지 않으면 불량으로 인식되도록 시스템을 개발하였다. 또한, 물품의 불량 유무 결과와 그 수치는 사용자가 저장할 수 있도록 하였다.