• Title/Summary/Keyword: X-ray inspection

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Development of Inspection System for Aluminum Castings with X-Ray TDI Camera (X-Ray TDI Camera를 이용한 알루미늄 주강품 검사장치 개발)

  • Nam, Mun-Ho;Park, Seong-Wook;Kim, Chang-Ho;Chung, Chan-Soo
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1734-1735
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    • 2011
  • In case of inspection on aluminum castings, traditional RT (Radiographic Testing) method have been utilized for its advantages in interpretation, cost and perpetual storage. But it has disadvantages like time consumption in film processing, low efficiency in storage and environmental pollution. In this thesis, a DRS (Digital Radiography System) utilizing X-Ray TDI Camera (Time Delay and Integration Camera) is developed. Inspections on aluminum castings are performed using the developed Digital Radiography System, DRS and reviewed if newly developed system can substitute for the traditional method.

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Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image (X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출)

  • Song, Chun-Sam;Cho, Sung-Man;Kim, Joon-Hyun;Kim, Joo-Hyun;Kim, Min-young;Kim, Jong-Hyeong
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.916-921
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    • 2009
  • The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

Ultrasonic Inspection Technology of Defect Detection of Propellant/Liner Debond & Propellant Microcrack (초음파를 이용한 추진제/라이너 미접착 및 추진제 미세 크랙의 결함 검출 기법)

  • Na, Sung-Youb
    • Journal of the Korean Society of Propulsion Engineers
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    • v.11 no.1
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    • pp.34-42
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    • 2007
  • Ultrasonic inspection method is more profitable than X-ray radiographic inspection in cost and effect of defect detection such as debond, damage, and it doesn't need special constructions. The method can also be a possible real time inspection with safety. This report explains 1)the experiment and analysis of ultrasonic property of solid propellant, 2)the inspection methods of propellant/liner debond by inside or outside inspection, and 3)the inspection methods of propellant microcrack by damage. From the results, it is possible to detect the defect of propellant/liner debond by inside or outside inspection. Futhermore, it can be possible to detect the propellant microcrack caused by damage using the ultrasonic attenuation.

Internal Defects Inspection of Die-cast Parts via the Comparison of X-ray CT Image and CAD Data (CAD 데이터 및 엑스레이 CT이미지 비교를 통한 다이캐스팅 부품의 내부 결함 검사방법)

  • Hong, Gyeong Taek;Shim, Jae Hong
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.1
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    • pp.27-34
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    • 2018
  • Industrially, die-casting products are formed through casting, and so the methods to inspect the defects inside them are very restrictive. External inspection methods including visual inspection, sampling judgment, etc. enables researchers to inspect possible external defects, but x-ray inspection equipment has been generally used to inspect internal ones. Recently, they have been also applying three-dimensional internal inspections using CT equipment. However, they have their own limitations in applying to the use of industrial inspection due to limited detection size and long calculation time. To overcome the above problems, this paper has suggested a method to inspect internal defects by comparing the CAD data of the product to be inspected with the 3D data of the CT image. In this paper, we proposed a method for fast and accurate inspection in three dimensions by applying x-ray inspection to find internal defects in industrial parts such as aluminum die casting products. To show the effectiveness of the proposed method, a series of experiments have been carried out.

X-RAY Inspection for PCB/SMT & Electronics Components Latest Development

  • Maur Friendhelm W.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.02a
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    • pp.17-25
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    • 2004
  • During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of .5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging and SMT.

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Shape Reconstruction of Solder Joints on PCB using Iterative Reconstruction Technique (반복복원 기법을 이용한 전자회로기판의 납땜부 형상 복원)

  • 조영빈;권대갑
    • Journal of Institute of Control, Robotics and Systems
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    • v.5 no.3
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    • pp.353-362
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    • 1999
  • This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

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A Study on the Test of Efficiency of the Diagnostic X-ray Equipment according to Their Rectifications (진단용 X선장치의 성능 실태 조사연구)

  • Seon, Jong-Ryul
    • Journal of radiological science and technology
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    • v.20 no.2
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    • pp.44-48
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    • 1997
  • For the efficient management of the diagnostic x-ray equipment, a nation-wide inspection of hospitals was performed by an inspection institute in Taejon in the first half of 1997. Among those hospitals inspected, 28 equipments(machines) which were over 500 mA were randomly selected according to their characteristics : 7 condenser type x-ray equipments, 7 three control phase of full wave rectification of type remote control x-ray equipments, 7 single phase of full wave rectification type for general radiography equipments, and 7 single phase of full wave rectification type of R/F equipments. We obtained the following results by conducting the experiment based on the efficiency of the equipments mentioned above. 1) When the equipments are analyzed, 2 out of 7 single phase of full wave rectification type of general radiography equipments(28.6%), 3 out of 7 single phase of full wave rectification type of R/F equipments(42.9%), 5 out of 7 three phase of full wave rectification type remote of control x-ray equipments(71.4%), and 4 out of 7 condenser type of x-ray equipments(57.1%) showed suitability. It proves the superiority of the three phase of full wave rectification type of remote control x-ray equipments. 2) From the overall analysis, only about 50% of the equipments(suitability of 14 out of 28) maintain the efficient management. Therefore, maintenance management of equipments is more necessary. If the efficiency of the x-ray equipment is uniformly maintained and managed to prevent the breakdown(trouble) beforehand especially through the continuous inspection of tube voltage, tube current, exposure time, and collimator, the financial loss and exposure dose to the patient, as well as the workers engaged in radiation, can be reduced for better medical service.

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Investigation of a novel on-site U concentration analysis method for UO2 pellets using gamma spectroscopy

  • Lee, Haneol;Park, Chan Jong
    • Nuclear Engineering and Technology
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    • v.53 no.6
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    • pp.1955-1963
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    • 2021
  • As the IAEA has applied integrated safeguards and a state level approach to member states, the importance of national inspection has increased. However, the requirements for national inspection for some member states are different from the IAEA safeguards. In particular, the national inspection for the ROK requires on-site U concentration analysis due to a domestic notification. This research proposes an on-site U concentration analysis (OUCA) method for UO2 pellets using gamma spectroscopy to satisfy the domestic notification requirement. The OUCA method calculates the U concentration of UO2 pellets using the measured net X-ray counts and declared 235U enrichment. This research demonstrates the feasibility of the OUCA method using both MCNP simulation and experiment. It simulated and measured the net X-ray counts of different UO2 pellets with different U concentrations and 235U enrichments. The simulated and measured net X-ray counts were fitted to polynomials as a function of U concentration and 235U enrichment. The goodness-of-fit results of both simulation and experiment demonstrated the feasibility of the OUCA method.

The development of product inspection X-ray DR image processing system using intensifying screen (형광지를 이용한 물품검사 X-선 DR 영상처리 시스템 개발)

  • Park, Mun-kyu;Moon, Ha-jung;Lee, Dong-hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.7
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    • pp.1737-1742
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    • 2015
  • In the industrial field for product inspection needs not only on the surface of the product but also the internal components defect inspection. Generally, optical inspection is mainly used for item inspection from production process. However, this is only to check defect of surface it is difficult to perform inspection of goods internal. To overcome these limitations, Instead of optical device by using the portable X- ray DR image acquisition device system developed to obtain an image in real time at the same time and determine product defects. After obtaining the X- ray image, the inspection product within error range is passed after machine image processing. Also, the results and numbers are stored by users.