• 제목/요약/키워드: X-ray diffractrometry (XRD)

검색결과 2건 처리시간 0.019초

Antimicrobial Evaluation and Characterization of Copper Nanoparticles Synthesized by the Simple Chemical Method

  • Wazir, Arshad Hussain;Khan, Qudratullah;Ahmad, Nisar;Ullah, Faizan;Quereshi, Imdadullah;Ali, Hazrat
    • 한국재료학회지
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    • 제32권2호
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    • pp.80-84
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    • 2022
  • Copper nanoparticles (CuNPs) are considered of great importance due to their high catalytic and antimicrobial activities. This study focuses on the preparation and characterization of CuNPs, and on their antibacterial/antifungal activities. A copper salt (copper sulfate pentahydrate) as precursor, starch as stabilizing agent, and ascorbic acid as reducing agent were used to fabricate CuNPs. The resulting product was characterized via different techniques such as X-ray diffractrometry (XRD), Fourier Transform Infrared (FTIR) spectroscopy, and Scanning electron microscopy (SEM) to confirm its characteristic properties. Employing the Scherrer formula, the mean crystallite sizes of copper (Cu) and cuprous oxide (Cu2O) nanocrystals were found to be 29.21 and 25.33 nm, respectively, as measured from the main X-ray diffraction peaks. The functional groups present in the resulting CuNPs were confirmed by FTIR. In addition, the engineered CuNPs showed antibacterial and antifungal activity against tested pathogenic bacterial and fungal strains.

A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy

  • Kim, J.S.;Chang, I.T.;Falticeanu, C.L.;Davies, G.J.;Jiang, K.C.
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.722-723
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    • 2006
  • A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

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