• Journal of the Korean Society of Safety
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• v.30 no.3
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• pp.26-31
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• 2015

This paper describes the characteristics of voltage drop and thermal for poor connection on electrical connector of circuit breaker in control box of small size pulverizer. In order monitor, we did the changes of RMS in voltage and temperature value with video and made normal state over $2.5N{\cdot}m$ and poor connections state below $0.2N{\cdot}m$ by screw gage. In case of voltage signal, the voltage drop was increased when the current was increased due to poor connections. In case of temperature signal, the temperature difference indicates ten times at 5A and fourteen times at 15A in the normal state. According to increase thermal energy, the insulation of electrical wiring and connector of circuit breaker can be carbonized. The results of this study will be useful to the development of preventive devices and system for electric fire by poor connection at small size pulverizer.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.71-82
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• 2011

Electronic display markets has been developed. The cathode ray tube of brown form recently celebrated their 100th by first display. Also LCD of flat form recently celebrated their 25th by second display and it has advantage of small volume, lower consumption power. But FPD has problem that is property of brittle and noncarrying by glass substrate. Therefore the arrival of portable electronics devices has put an increasing premium on durable, lightweight and inexpensive display components. It is flexible display by third display. Also electronics field such as printed wiring board, RFID, membrane switch prefer flexible display. The conductive pattern can be used mostly in field of electronic displays and electronics. This manufacture of conductive pattern in present used is screen printing. The the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity. screen printing has problem that is low productivity and use not flexible substrate because of high fire temperature. This study was developed novel method to form the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity.

• Journal of the Korean Institute of Rural Architecture
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• v.14 no.3
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• pp.25-32
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• 2012

Traditional folk houses in Yongdong, Gangwon province play important roles in figuring out natural, human, and social value in the past time including housing life. However, according to the introduction of electric or plumbing equipment in housing life styles, many conventional architectures have been changed by installations of new electric or plumbing equipment, convenience facilities, and etc. Therefore, this study aims to make basic data to prepare for standardized installations of the electric or plumbing equipment, and convenience facilities by surveying of the present installation status, such as electric lights, outlets, switches, wiring, pipe laying, or monitoring devices for crime, disaster prevention facilities, and home appliances etc. Additionally, this paper is related to the meaning and usage, which are connected with the electric or plumbing equipment installations of the traditional folk houses to be prepare for the proper solutions between preservations of the original form and convenient lives for residents.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Journal of Institute of Control, Robotics and Systems
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• v.7 no.6
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• pp.532-539
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• 2001

In robot teleoperation, much research has been carried out to control the slave robot from remote site. One of the essential devices for robot teleoperation is the masterarm, which is a path command generating device worn on human arm. In this paper, a new masterarm based on human kinematics is proposed. Its controller is based on the distributed controller architecture composed of two controller parts: a host controller and a set of satellite controllers. Each satellite controller measures the corresponding joint angle, while the host controller performs forward and inverse kinematics calculation. This distributed controller architecture can make the data updating faster, which allows to implement real-time implementation. The host controller and the satellited controllers are networked via three-wire daisy-chained SPI(Serial Peripheral Interface) protocol, so this architecture makes the electrical wiring very simple, and enhances maintenance. Analytical method for finding three additional unknown joint angles is derived using only three measured angles for each shoulder and wrist, which makes th hardware implementation very simple by minimizing the required number of satellite controllers. Finally, the simulation and experiment results are given to demonstrate the usefulness and performance of the proposed masterarm.

• Journal of the Korean Society of Safety
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• v.29 no.2
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• pp.12-17
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• 2014

This paper is aimed to analyze the characteristics of simultaneous voltage, current and temperature signals for poor connection on electrical connector. In order to attain this purpose, detected were the current and voltage signals on electric wire with series arc, named arc signals, and also monitored were the changes of RMS, instantaneous value of waveform in time domain and temperature value with video. Two states are made normal state over $5kgf{\cdot}cm$ and poor connections state below $0.5kgf{\cdot}cm$ by screw gage. In the voltage signal case, the voltage drop was increased with which the current was increased. In the current signal case, poor connections at the time interval 1~4A all showed "shoulder", as distinct difference from the normal state shown waveform pattern. In the temperature signal case, poor connections are twice at 1A and five times at 4A in the normal state. The temperature continues insulation of electrical wiring and connector can be carbonized. The results of this study will be effectively used in developing the preventive devices and system for electric fire by poor connections.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.8
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• pp.671-677
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• 2016

A Controller Area Network (CAN) is a serial communication protocol that is highly reliable and efficient in many aspects, such as wiring cost and space, system flexibility, and network maintenance. Therefore, it is chosen for the communication protocol between a single chip controller based on Field Programmable Gate Array (FPGA) and peripheral devices. In this paper, the design and implementation of CAN IP, which is written in VHSIC Hardware Description Language (VHDL), is presented. The implemented CAN IP is based on the CAN 2.0A specification. The CAN IP consists of three processes: clock generator, bit timing, and bit streaming. The clock generator process generates a time quantum clock. The bit timing process does synchronization, receives bits from the Rx port, and transmits bits to the Tx port. The bit streaming process generates a bit stream, which is made from a message received from a micro controller subsystem, receives a bit stream from the bit timing process, and handles errors depending on the state of the CAN node and CAN message fields. The implemented CAN IP is synthesized and downloaded into SmartFusion FPGA. Simulations using ModelSim and chip test results show that the implemented CAN IP conforms to the CAN 2.0A specification.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.10
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• pp.479-484
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• 2002

Recently it is reported that many a malfunction of ELB which is represented by non-operated type ELB for an impulse wave, is caused by lightning impulse and transient ground potential rise due to nearby lightning strokes. In order to examine the cause of malfunction, 5 samples were investigated experimentally in this study. As each ELB has a different leakage current detecting circuit and wiring method, various characteristics were measured. As a result, all of them brought about malfunctions under the lightning impulse voltage less than 7 kV and the surge current less than 3 kA. Also the different aspects were measured with a polarity of injected surge and a position of MOV to protect the inner circuit of ELB. The Position and effects of protecting devices were suggested as a remedy.

• Aerospace Engineering and Technology
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• v.7 no.1
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• pp.236-244
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• 2008

The evolution and application of RFID technologies have been at the forefront of allowing aviation industries to improve the quality of aircraft maintenance and air cargo handling. However, safety problems in airplane operation are arising from the hazards of frequencies transmitted due to RFID systems. Though the intensities of frequencies back-scattered from the tags are very weak, some malfunctions are anticipated due to induction coupling on aircraft wiring. Therefore, safety assessment such as electromagnetic compatability should be accomplished upon aircraft critical and essential equipments before installations.