• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.479-482
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• 2006

The most the electronic industry has recently accelerated the modularization, the miniaturization and the high integrated trend of electronics fields such as electronics components, appliances and etc., the most increasingly the heat generation problem rises. Even though the conventional cooling technologies are widely used in order to reduce the heat loads, the technologies are not easy to meet the present trends due to the fact that most of many conventional methods are relative to external form environments such as size, design and so on. With regardless of those environments, however, a heat pipe is one of the most efficient systems to improve the heat transfer performance. And then the performance of the heat pipe depends on a wick structure. Of various wick structures, sintered metal wick is known so that it has some advantages such as smaller pore size, increasing porosity as well as high reliability. In this study sintered metal wicks, thickness 0.7 mm, 0.8 mm and 0.9 mm, were manufactured as of $100{\mu}m$ copper powder to obtain the manufacturing technology of heat pipes mounted with a sintered metal wick. Furthermore, experiments for the operational performance factors such as capillary limit, thermal resistance were not only performed but also compared with a theoretical model simultaneously. Experimental results agreed with the theoretical model, and then it seems to be required to study various development processes of sintered metal wicks for the high performance of a heat pipe system.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• Tribology and Lubricants
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• v.38 no.5
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• pp.185-190
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• 2022

Among the operating limits of a heat pipe, the capillary limit is significantly affected by the characteristics of the wick, which is determined by the capillary performance. The major parameters for determining capillary performance are the maximum capillary pressure and the spreading characteristics that can be expected through the wick. A well-designed wick structure improves capillary performance and helps improve the stability of the heat pipe by enhancing the capillary limit. The capillary performance can be improved by forming a porous microstructure on the surface of the wick structure through surface modification techniques. In this study, a microstructure is formed on the surface of the wick by using a surface modification method (i.e., an electrochemical etching process). In the experiment, specimens are prepared using stainless-steel screen mesh wicks with various fabrication conditions. In addition, the spreading and capillary rise performances are observed with low-surface-tension fluid to quantify the capillary performance. In the experiments, the capillary performance, such as spreading characteristics, maximum capillary pressure, and capillary rise rate, improves in the specimens with microstructures formed through surface modification compared with the specimens without microstructures on the surface. The improved capillary performance can have a positive effect on the capillary limit of the heat pipe. It is believed that the surface microstructures can enhance the operational stability of heat pipes.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2130-2135
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• 2007

Operating characteristics of a loop heat pipe (LHP) having a bypass line was investigated experimentally. The LHP had a sintered metal wick as a capillary structure and methanol as a working fluid. The sintered metal wick was made of stainless steel of which the average pore size was 5 ${\mu}m$and porosity of 47%. A bypass line of a small diameter was attached between the vapor escape passage and the liquid reservoir. The dimension of the flat evaporator was $50(L){\times}40(W){\times}30(H)$ mm and that of the condenser was $50(L){\times}40(W){\times}11(H)$ mm. Wall and pipe material of the LHP was stainless steel and heating area was 35(W) mm${\times}$35(L) mm. The inner diameters of vapor and liquid transport lines were 4.0 mm and 2.0 mm, and the lengths of the two lines were both 0.5 m. The LHP was tested for three different tilt angles of horizontal, favorite tilt, and adverse tilt. The thermal load range was up to 290 W at the condenser above evaporation position. Furthermore, the effect of a bypass line on the start-up transient as well as steady-state operation was presented and discussed.

• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.1052-1061
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• 2005

A small-scale loop heat pipe (LHP) with polypropylene wick was fabricated and tested for investigation of its thermal performance. The container and tubing of the system were made of stainless steel and several working fluids were tested including methanol, ethanol, and acetone. The heating area was $35\;mm\;{\times}\;35\;mm$ and nine axial grooves were provided in the evaporator to provide vapor passages. The pore size of the polypropylene wick inside the evaporator was varied from $0.5\; {\mu}m\;to\;25\;{\mu}m.$ The inner diameter of liquid and vapor transport lines were 2.0 mm and 4.0 mm, respectively and the length of which were 0.5 m. The size of condenser was $40\;mm\;(W)\;{\times}\;50\;mm\;(L)$ in which ten coolant paths were provided. Start-up characteristics as well as steady-state performance was analyzed and discussed. The minimum thermal load of $10\;W\;(0.8\;W\;/cm^{2})$ and maximum thermal load of $80\;W\;(6.5\;W\;/cm^{2})$ were achieved using methanol as working fluid with the condenser temperature of $20^{\circ}C$ with horizontal position.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Geotechnical Engineering
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• v.3 no.1
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• pp.7-24
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• 1987

Preloading surcharge method along with vertical drains was adopted to improve the performance of a very soft marine clay deposit. The onshore deposit, located in the Ulsan Bay area, consists of a 2 to 10m thick, very soft, highly compressible marine clay layer developed just below. the sea water level. The initial undrained shear strength of the clay layer was about 0.6 ton/m2. But, the deposit was designed after treatment to support some auxiliary facilities for a new ilo refinery plant, requiring bearing capacities of 3.6 to 5.4 ton/m2 and maximum allowablee settlement of less than 7.5cm. A total of 35, 000 wick drains Ivas installed to expedite drainage during preloading, and surcharge loads of up to 5m above the original ground level were applied in a step-by-step loading sequence to prevent ground failure by excess surcharge loads. An extensive program of field instrumentation was implemented to monitor the behavior of the clay deposit. Measurers!ends included settlements, excess pore pressure and its dissipation, ground farmer level fluctuation, and lateral movement of the so(t clay layer under the preloads. This paper describes the design concepts, construction methods and control procedures used for improvement of the clay layer. It also presents the ground behavior measured during construction, rind comparisons with theoretical predictions.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.5
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• pp.713-723
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• 1986

The purpose of this research was to study the heat transfer characteristics of heat pipe which used non-metallic(SiO$_{2}$), circumferential wick and meshed slab wick as ADI method and experimental results. Compared wick experimental data and results by ADI method showed the good agreement and ADI method was utilized in pridicting the performance of heat pipe. Also, ADI method was applied to predict heat pipe performance according to the various volume ratios of metallic bond. The heat transfer characteristics of heat pipe could be predicted by heat flux and superheat term below the maximum heat flux limit. According to the addition ratio of metallic bond, heat transfer ratio could be improved as 2-3 times and when heat conductivity ratio(K$_{b}$/K$_{a}$) was increased at 4-12 ratio, heat transfer was in creased as 1.7-2.4 times, and the prediction of heat transfer could be show as exponential type. In producting non-metallic wick used to low heat pipe, metallic bond which is the conductivity of good quality and enduring for high temperature will be improved as in important problem.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.572-578
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• 2001

This study is to research the heat transfer characteristics in copper-water heat pipes with screen wick, #100. Recently, the semiconductor capacity of an electronic unit has been larger, on the contrary, its size is smaller than before. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle ${-6}^{\circ}$, #100 2layer screen mesh is shown the best heat transfer performance.

• The Korean Journal of Financial Management
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• v.25 no.1
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• pp.85-108
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• 2008

In this paper, the fBm interest rate theory is investigated by using Wick integral. The well-known Affine, Quadratic and HJM are derived from fBm framework, respectively. We obtain new theoretical results, and zero coupon bond pricing formula from newly obtained probability measure.