• Title/Summary/Keyword: White Light Scanning Interferometry

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Unequal-path Low-coherence Interferometry Using Femtosecond Pulse Lasers (펨토초 레이저를 이용한 비동일 광경로 저결맞음 간섭계)

  • Oh J.S.;Kim S.W.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.204-207
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    • 2005
  • We discuss two possibilities of using femtosecond pulse lasers as a new interferometric light source fer enhanced precision surface profile metrology. First, a train of ultra-fast laser pulses yields repeated low temporal coherence, which allows performing unequal-path scanning interferometry that is not feasible with white light. Second, high spatial coherence of femtosecond pulse lasers enables to test large size optics in non-symmetric configurations with relatively small size reference surfaces. These two advantages are verified experimentally using Fizeau and Twyman-Green type scanning interferometers.

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Development of Elimination Method of Measurement noise to Improve accuracy for White Light Interferometry (백색광 간섭계의 정밀도 향상을 위한 노이즈 제거 방법)

  • Ko, Kuk-Won;Cho, Soo-Yong;Kim, Min-Young
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.6
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    • pp.519-522
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    • 2008
  • As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

A curvature profilometry using white-light (백색광을 이용한 곡률 측정법 개발)

  • Kim, Byoung-Chang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.3
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    • pp.81-86
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    • 2008
  • I present a 3-D profiler specially devised for the profile measurement of specular surfaces that requires precision shape accuracy up to a few nanometer. A profile is reconstructed from the curvature of a test part of the surface at several locations along a line. The local curvature data are acquired with White-light Scanning Interferometry. Test measurement proves that the proposed profiler is well suited for the specular surface inspection like precision mirror.

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Thin film thickness profile measurement using white light scanning interferometry (백색광 주사 간섭법을 이용한 박막의 두께 형상 측정법)

  • 김기홍;김승우
    • Korean Journal of Optics and Photonics
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    • v.10 no.5
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    • pp.373-378
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    • 1999
  • White light scanning interferometry is increasingly used for precision profile metrology of engineering surfaces, but its current application is primarily limited to opaque surfaces with relatively simple optical reflection behaviors. In this paper, a new attempt is made to extend the interferometric method to the thickness profile measurement of transparent thin film layers. An extensive frequency domain analysis of multiple reflection is performed to allow both the top and bottom interfaces of a thin film layer to be measured independently at the same time using nonlinear least squares technique. This rigorous approach provides not only point-by-point thickness probing but also complete volumetric film profiles digitized in three dimensions.

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Roughness Measurement Performance Obtained with Optical Interferometry and Stylus Method

  • Rhee Hyug-Gyo;Lee Yun-Woo;Lee In-Won;Vorburger Theodore V.
    • Journal of the Optical Society of Korea
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    • v.10 no.1
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    • pp.48-54
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    • 2006
  • White-light scanning interferometry (WLI) and phase shifting interferometry (PSI) are increasingly used for surface topography measurements, particularly for areal measurements. In this paper, we compare surface profiling results obtained from above two optical methods with those obtained from stylus instruments. For moderately rough surfaces ($Ra{\approx}500\;nm$), roughness measurements obtained with WLI and the stylus method seem to provide close agreement on the same roughness samples. For surface roughness measurements in the 50 nm to 300 nm range of Ra, discrepancies between WLI and the stylus method are observed. In some cases the discrepancy is as large as 109% of the value obtained with the stylus method. By contrast, the PSI results are in good agreement with those of the stylus technique.

Optical Probe of white Light Interferometry for Precision Coordinate Metrology (정밀 삼차원 측정을 위한 백색광 간섭 광학 프로브 개발)

  • 김승우;진종한;강민구
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.195-198
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    • 2002
  • Demand for high precision measurement of large area is increasing in many industrial fields. White-light Scanning Interferometer(WSI) is a well-known method for 3D profile measurement. However WSI has some limitations in a measurement range because of the sensing mechanism. Therefore, in this paper we use a heterodyne laser interferometer to get over the limitations of a short measurement range in WSI, We suggest a new WSI system combined with heterodyne laser interferometer. This system is aimed at eliminating Abbe error with measuring the focus point directly. With the use of triggering functionality of WSI, we can use this system as a probe of a precision stage such as a probe of CMM. The suggested system gives a repeatability of 87 nm in the absolute distance measurement test under the laboratory environment.

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Interference Fringe Signal Filtering Method for Performance Enhancing of White Light Interfrometry (가간섭 영역 외의 배경 잡음성 간섭무늬 신호 필터링을 통한 백색광 주사간섭계의 성능 향상)

  • Yim, Hae-Dong;Lee, Min-Woo;Lee, Seung-Gol;Park, Se-Geun;Lee, El-Hang;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.20 no.5
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    • pp.272-275
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    • 2009
  • In order to enhance the background noise filtering performance of the white light interferometry(WLI), we demonstrate the noise filtering performance of preprocessing of the measured fringe signals. The WLI was realized through a mirau interferometer which was equipped with a green LED. When measuring large-height and rough surface objects, the illumination optics are considered the numerical aperture(NA) and the depth of focus(DOF). In this case, the limited NA of the illumination optics has a considerable impact on the interference fringe. Therefore, we propose a preprocessing method that uses the intensity difference between the measured intensity and the moving average intensity. The performance is demonstrated by measuring an array of metal solder balls fabricated on printed circuit board(PCB). The proposed method reduces the noise pixels by 15 percent.

3-D Surface Profile Measurement Using An Acousto-optic Tunable Filter Based Spectral Phase Shifting Technique

  • Kim, Dae-Suk;Cho, Yong-Jai
    • Journal of the Optical Society of Korea
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    • v.12 no.4
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    • pp.281-287
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    • 2008
  • An acousto-optic tunable filter based 3-D micro surface profile measurement using an equally spaced 5 spectral phase shifting is described. The 5-bucket spectral phase shifting method is compared with a Fourier-transform method in the spectral domain. It can provide a fast measurement capability while maintaining high accuracy since it needs only 5 pieces of spectrally phase shifted imaging data and a simple calculation in comparison with the Fourier transform method that requires full wavelength scanning data and relatively complicated computation. The 3-D profile data of micro objects can be obtained in a few seconds with an accuracy of ${\sim}10nm$. The 3-D profile method also has an inherent benefit in terms of being speckle-free in measuring diffuse micro objects by employing an incoherent light source. Those simplicity and practical applicability is expected to have diverse applications in 3-D micro profilometry such as semiconductors and micro-biology.