• Journal of the Korean Society for Precision Engineering
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• v.3 no.1
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• pp.40-49
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• 1986

Crack, craze and void are common defects which may be found in the bulk of polymeric materials such as either themoplastics or thermosets. The healing phenomena, autohesion, of these defects are known to be a intrinsic material property of various polymeric materials. However, only a few experimental and theoretical investigations on crack, void and craze healing phenomena for various polymeric materials have been reported up to date [1, 2, 3]. This may be partly due to the complications of healing processes and lacking of appropriate theoretical developments. Recently, some investigators have been urged to study the healing phenomena of various polymenic materials since the significance of the use of polymer based alloys or composites has been raised in terms of specific strength and energy saving. In the earlier published reports [1, 2, 3, 4], the crack and void healing velocity, healing toughness and some other healing mechanical and physical properties were measured experimentally and compared with predicted values by utilizing a simple model such as the reptation model under some resonable assumptions. It seems, however, that the general acceptance of the proposed modeling analyses is yet open question. The crack healing processes seem to be complicate and highly dependent on the state of virgin material in terms of mechanical and physical properties. Furthermore, it is also strongly dependent on the histories of crack, craze and void development including fracture suface morphology, the shape of void and the degree of disentanglement of fibril in the craze. The rate of crack healing may be a function of environmental factors such as healing temperature, time and pressure which gives different contact configurations between two separated surfaces. It seems to be reasonable to assume that the crack healing processes may be divided in several distinguished steps like stress relaxation with molecular chain arrangement, surface contact (wetting), inter- diffusion process and com;oete healing (to obtain the original strength). In this context, it is likely that we no longer have to accept the limitation of cumulative damage theories and fatigue life if it is probable to remove the defects such as crack, craze and void and to restore the original strength of polymers or polymer based compowites by suitable choice of healing histories and methods. In this paper, we wish to present a very simple and intuitive theoretical model for the prediction of healed fracture toughness of cracked or defective polymeric components. The central idea of this investigation, thus, may be the modeling of behavior of chain molecules under healing conditions including the effects of chain scission on the healing processes. The validity of this proposed model will be studied by making comparisons between theoretically predicted values and experimentally determined results in near future and will be reported elsewhere.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Composites Research
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• v.28 no.4
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• pp.232-238
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• 2015

As a new method to predict the degree of dispersion in carbon nanocomposites, the electrical resistance (ER) method has been evaluated. After CNT epoxy resin was dropped on CF tow, the change in electrical resistance of carbon fiber tow was measured to evaluate dispersion condition in CNT epoxy resin. Good dispersion of CNTs in carbon nanocomposite exhibited low change in ER due to wetted resin penetrated on CF tow. However, because CNT network was formed among CFs, non-uniform dispersion occurred due to nanoparticle filtering effect by CF tow. The change in ER for poor dispersion exhibited large ER signal change. The change in ER was used for the dispersion evaluation of CNT epoxy resin. Correlation between interlaminar shear strength (ILSS) and dispersion condition by ER method was established. Good CNT dispersion in nanocomposites led to good interfacial properties of fiberreinforced nanocomposites.

• Polymer(Korea)
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• v.28 no.5
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• pp.404-411
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• 2004

The microcapsules containing triphenyl phosphate (TPP), a flame retardant, were prepared by phase-inversion emulsification technique using the epoxy resin (Novolac type) with excellent physical properties and network structure. This microencapsulation process was adopted for the protection of TPP evaporation and wetting of polymer composite during the polymer blend processing. The TPP, epoxy resin and mixed surfactants were emulsified to oil in water (O/W) by the phase inversion technology and then conducted on the crosslinking of epoxy resin by in-situ polymerization. The capsule size and size distribution of TPP capsules was controlled by mixed surfactant ratio, concentration and TPP contents, The formation and thermal property of TPP capsules were measured by differential scanning calorimetry and thermogravimetric analysis. The morphology and size of TPP capsules were also investigated by scanning and transmission electron microscopies. As the surfactant concentration increased, the TPP capsules were more spherical and mono-dispersed at the same weight ratio of mixed surfactants (F127: SDBS).

• Journal of the Korean Geotechnical Society
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• v.39 no.1
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• pp.15-25
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• 2023

Recent weather changes have led to an increase in heavy rainfall resulting in frequent large-scale slope failures. To minimize damage to life and property, a measurement system is used in slope failure warning systems. However, understanding the slope failure behavior is difficult as the measurement system only measures a specific point. Therefore, numerical analysis must be p erformed with the measurement system. The soil water characteristic curve (SWCC) drying curve and boundary conditions that consider evapotranspiration and precipitation have been applied to numerical analysis, but the hysteresis of SWCC affects the numerical analysis results. To address this, a new evapotranspiration calculation method is proposed and applied to boundary conditions, and the measurement data are compared with the results of the numerical analysis. This method takes into account the different infiltration behaviors on evapotranspiration according to the drying and wetting curves of the SWCC, and allows for a more rational prediction of water movement on unsaturated slopes.