• 제목/요약/키워드: Wetting

검색결과 953건 처리시간 0.026초

강우시 점토함유량에 따른 화강풍화토의 불포화 침투 특성 (Effect of Rainfall-Induced Infiltration on Unsaturated Weathered Soils with Varying Clay Contents)

  • 유남동;정상섬;김재홍;박성완
    • 한국지반공학회논문집
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    • 제20권8호
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    • pp.159-166
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    • 2004
  • 본 연구에서는 불포화 지반의 특성을 파악하고, 강우시 불포화 사면의 포화깊이에 따른 안정성을 파악하기 위해 국내 지반의 전형적인 화강풍화토(SW)에 점토(CH) 함유량 0∼30%을 변화시켜 가며 함수특성곡선 산정 실험을 수행하였다. 또한 강우로 인해 증가되는 포화깊이에 영향을 미치는 투수계수 및 suction을 구하기 위해 다짐도에 따른 강도정수 변화를 측정하였다. 침투로 인해 발생하는 지반내의 suction 변화를 점토함유량에 따라 모형 시험과 수치해석을 사용하여 분석하였다. 특히 불포화 지반에서 포화지반으로 바뀌는 과정에 잔류하는 wetting front suction은 점토함유량과 지반의 다짐도에 따라 민감하게 변화하였다. 강우시 침투수의 거동을 파악하기 위해 상용프로그램인 SEEP/W를 통해 침투해석을 수행하였고, 침투해석 결과를 연동시켜 포화깊이에 따른 사면의 안정성을 SLOPE/W 프로그램을 이용하여 포화깊이 및 점토함유량에 따라 비교ㆍ분석하였다. 해석결과를 통해 wetting front suction은 초기 포화깊이에 영향을 미치며 안전율이 변하는 것을 알 수 있다.

정적법을 이용한 Mg-Al계 합금과 순수 Ti의 고온 젖음현상 및 Al계면에서의 정합성에 미치는 영향 (Effects of Mg-Al Alloy and Pure Ti on High Temperature Wetting and Coherency on Al Interface Using the Sessile Drop Method)

  • 한창석;김우석
    • 한국재료학회지
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    • 제31권1호
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    • pp.38-42
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    • 2021
  • In this study, high temperature wetting analysis and AZ80/Ti interfacial structure observation are performed for the mixture of AZ80 and Ti, and the effect of Al on wetting in Mg alloy is examined. Both molten AZ80 and pure Mg have excellent wettability because the wet angle between molten droplets and the Ti substrate is about 10° from initial contact. Wetting angle decreases with time, and wetting phenomenon continues between droplets and substrate; the change in wetting angle does not show a significant difference when comparing AZ80-Ti and Mg-Ti. As a result of XRD of the lower surface of the AZ80-Ti sample, in addition to the Ti peak of the substrate, the peak of TiAl3, which is a Ti-Al intermetallic compound, is confirmed, and TiAl3 is generated in the Al enrichment region of the Ti substrate surface. EDS analysis is performed on the droplet tip portion of the sample section in which pure Mg droplets are dropped on the Ti substrate. Concentration of oxygen by the natural oxide film is not confirmed on the Ti surface, but oxygen is distributed at the tip of the droplet on the Mg side. Molten AZ80 and Ti-based compound phases are produced by thickening of Al in the vicinity of Ti after wetting is completed, and Al in the Mg alloy does not affect the wetting. The driving force of wetting progression is a thermite reaction that occurs between Mg and TiO2, and then Al in AZ80 thickens on the Ti substrate interface to form an intermetallic compound.

Stability of Unsaturated Soil Slopes considering the Effect of Wetting Front Suction Loss

  • Jeong, Sang-Seom;Kim, Jae-Young
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2007년 가을학술발표회
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    • pp.502-513
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    • 2007
  • This paper describes the rainfall-induced slope failures caused by infiltration due to prolonged rainfall. The emphasis was on quantifying the effect of fine-grained contents which are influencing on the infiltration rate in the wetting front of initially unsaturated slopes during rainfall. Suction tests by tensiometer were performed for five mixture specimens with varying fine-grained contents and then, numerical analyses for the stability of unsaturated slopes are carried out for different relative densities and mixture portions based on the soil water characteristic curves obtained by GCTS pressure plate. It is shown that the fines are highly influenced on wetting front suction of unsaturated soil slopes. Based on the results, it is found that until 15% fine content is the limit showing different wetting front suction, beyond which the wetting band depth do not affect considerably the stability of unsaturated slopes.

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인듐 솔더의 젖음특성 (The Wetting Property of Indium Solder)

  • 김대곤;이창배;정승부
    • Journal of Welding and Joining
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    • 제20권5호
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    • pp.106-112
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    • 2002
  • In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

텅스텐판상에서 구리액상의 습윤거동에 미치는 온도 및 니켈 첨가의 효과 (The Effcts of Temperature and Ni Addition on the Wetting Behaviour of Cu on W)

  • 이재성
    • 한국표면공학회지
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    • 제16권2호
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    • pp.41-47
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    • 1983
  • An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

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수침이 고결모래의 강도에 미치는 영향 (Strength variation of cemented sand due to wetting)

  • 박성식;김기영;김창우;최현석
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2009년도 세계 도시지반공학 심포지엄
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    • pp.511-518
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    • 2009
  • In this study, by the consideration of in situ curing conditions, cemented sand with cement ratio less than 20% is prepared by air dry condition and then wetted. A series of unconfined compression tests are carried out to evaluate the effect of wetting on the strength of cemented soils. Strength of air dry cured specimen drops to maximum 30% after wetting at the end of curing period when cement ratio is low. However, regardless of cement ratio, strength of repetitively wetted specimens during curing increases as the number of wetting increases. The results of this study can predict the strength variation of cemented sand depending on wetting conditions in the field, which can guarantee the safety of geotechnical structures such as dam.

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Durability of CFRP strengthened RC beams under wetting and drying cycles of magnesium sulfate attack

  • Rahmani, Hamid;Alipour, Soha;Mansoorkhani, Ali Alipour
    • Advances in concrete construction
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    • 제8권1호
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    • pp.39-45
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    • 2019
  • Durability of strengthened reinforced concrete (RC) beams with CFRP sheets under wetting and drying cycles of magnesium sulfate attack is investigated in this research. Accordingly, 18 RC beams were designed and made where 10 of them were strengthened by CFRP sheets at their tension side. Magnesium sulfate attack and wetting and drying cycles with water and magnesium sulfate solution were considered as exposure conditions. Finally, flexural performance of the beams was measured before and after 5 months of exposure. Results indicated that the bending capacity of the strengthened RC beams was reduced about 10% after 5 months of immersion in the magnesium sulfate solution. Wetting and drying cycles of magnesium sulfate solution reduced the bending capacity of the strengthened RC beams about 7%. Also, flexural capacity reduction of the strengthened RC beams in water and under wetting and drying cycles of water was negligible.

UBM(Under Bump Metallurgy)이 단면 증착된 Si-wafer의 젖음성에 관한 연구 (A Study on the Wetting Properties of UBM-coated Si-wafer)

  • 홍순민;박재용;박창배;정재필;강춘식
    • 마이크로전자및패키징학회지
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    • 제7권2호
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    • pp.55-62
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    • 2000
  • Si-wafer에 단면 코팅된 UBM(Under Bump Metallurgy)의 젖음성을 Sn-Pb 솔더에서 평가하기 위하여 wetting balance 법을 사용하였다. 단면 코팅된 UBM의 젖음곡선은 양면 코팅된 시편의 젖음 곡선과 비교할 때, 젖음곡선의 모양이 비슷하고 젖음곡선을 특징짓는 변수들의 온도에 대한 변화경향이 일치하였다. 단면 코팅된 금속층의 젖음성을 젖음곡선으로부터 정의한 새로운 젖음 지수 $F_{min}$, $F_{s}t_{s}$로 평가할 수 있었다. Au/Cu/Cr UBM은 젖음시간의 측면에서 Au/Ni/Ti UBM보다 젖음성이 우수하였다 Si-wafer에 단면 코팅된 UBM과 Sn-Pb 솔더의 접촉각을 $F_{s}$와 기울어짐각을 측정하고 메니스커스의 정적상태에서 힘의 평형으로부터 유도된 식을 이용하여 계산할 수 있었다.

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$Al/Al_2O_3$ 계면의 젖음특성 및 계면반응 (Wetting Characteristics and Interfacial Reaction at $Al/Al_2O_3$ Interface)

  • 권순용;정대영;최시경;구형회;이종수
    • 한국세라믹학회지
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    • 제31권8호
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    • pp.815-822
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    • 1994
  • Sessile drop studies of molten Al on single crystal sapphire substrate were conducted to understand the wetting behavior and interfacial reaction at Al/Al2O3 interface. To investigate the wetting mechanism, the variation in contact angle was determined with time. The contact angle obtained in this study decreased exponentially with time. This result means that the driving force for wetting is the reduction in interfacial energy between liquid Al and sapphire caused by the interfacial reaction. The closer examination revealed that the reaction was the dissolution of sapphire by molten Al. Ti has been frequently used to improve wetting on ceramic materials. Therefore, the influence of Ti content on the wetting behaviour was investigated in this work. The equilibrium wetting angles of pure Al, Al-0.3 wt%Ti, and Al-1.0 wt%Ti at 100$0^{\circ}C$ were 63$^{\circ}$, 59$^{\circ}$, and 54$^{\circ}$respectively. The difference is considered as the result of the change in interfacial energy caused by the reaction between Ti and sapphire and the interfacial reaction formed the reaction products of varying stoichiometry (TiO, Ti2O3, TiO2 etc.).

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표면형상이 젖음각과 마이크로/나노 트라이볼로지 특성에 미치는 영향 (Effect of surface topography on wetting angle and micro/nano-tribological characteristics)

  • 윤의성;오현진;양승호;공호성
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.25-33
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    • 2002
  • Effect of surface topography on the water wetting nature and micro/nano tribological characteristics of Si-wafer and PTFE was experimentally studied. The ion beam treatment was performed with a hollow cathode ion gun in different argon don dose conditions in a vacuum chamber to change the surface topography, Micro/nano tribological characteristics, water wetting angles and roughness were measured with a micro tribo tester, SPM (scanning prove microscope), contact anglemeter and profilometer, respectively. Results showed that surface roughness increased with the argon ion dose. The water wetting angle of tile ion beam treated samples also increased with the ion dose. Results also showed that micro-adhesion and micro-friction depend on the wetting characteristics of the PTFE samples. However, nano-triboloSical characteristics showed little dependence on the wetting angles. The water wetting characteristics of modified PTFE samples were discussed in terms of the surface topographic characteristics.

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