• Title/Summary/Keyword: Wet process

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Wet Etching Behaviors of Transparent Conducting Ga-Doped Zinc Oxide Thin Film by Organic Acid Solutions

  • Lee, Dong-Kyoon;Lee, Seung-Jung;Bang, Jung-Sik;Yang, Hee-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.831-833
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    • 2008
  • 150 nm thick Ga-doped ZnO thin film, which was deposited by a sputtering process, was wet-chemically etched by using various organic acids such as oxalic, citric and formic acid. Wet etch parameters including etchant concentration and temperature are investigated for each etchant, and their effects on the etch rate and the feature of edge line are compared.

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The Influence of Diamond Abrasive Size on the Life of Tungsten Carbide Wet Drawing Dies (다이아몬드 연마재 입도가 초경 습식신선 다이스 수명에 미치는 영향)

  • Lee, S.K.;Kim, M.A.;Ko, D.C.;Kim, B.M.
    • Transactions of Materials Processing
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    • v.15 no.7 s.88
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    • pp.518-523
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    • 2006
  • Wet wire drawing of brass coated steel wire, used for tire reinforcement, is realized with Tungsten Carbide(WC) dies sintered with a cobalt(Co) binder. Dies wear represents an important limitation to the production process and cost savings. Several parameters, such as Co content, WC grain size of tungsten carbide, sintering conditions, and so on, affect on the wear of the drawing die. In this study, the effect of the diamond abrasive particle size on the life of the WC centered dies of the wet wire drawing was investigated. Wet wire drawing experiments were carried out on a wet wire drawing machine. From the experiments, the dies life, dies fracture, wire surface roughness, and wire breaks were investigated. From the results, it was found that the wear of the WC dies increased with the increase in the diamond abrasive particle size.

Development of Multi-Chemical Supply System for Semiconductor Wafer Cleaning Station

  • Chung, Myung-Jin;Song, Young-Wook
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.1309-1312
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    • 2005
  • A multi-chemical supply system is developed and applied to a wet station, which uses the multi-chemical process in one bath. To control the concentration of two chemicals, control logic of a supply pump is programmed using the programable logic controller (PLC). By using the multi-chemical supply system, wet station with single bath is applied to cleaning process using multi chemicals such as buffed oxide etchant (BOE) and standard clean 1 (SC-1). The concentration of each chemical is measured in the bath to verify the multi-chemical supply system. The control range in the each chemical concentration is measured to 1.33weight% in NH4OH and 0.23weight% in H2O2. The multi-chemical supply system can be movable and usable as an independent module of fixed wet station. By simply midifying the PLC, a multi-chemical supply system can be developed for a wet station.

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Application of wood flour spacers for increasing OCC solid content in wet pressing process (II) (스페이서 사용에 의한 OCC 압착공정의 고형분 증대 (II))

  • Jung, Jae Kwon;Ji, Sung Jil;Seo, Yung Bum
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.47 no.3
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    • pp.24-33
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    • 2015
  • Linerboards containing wood flours were developed to increase solid contents in wet pressing process. Presence of wood flours in recycled fibers allowed passage of pressurized water at high wet pressing pressure, and increased solid contents while keeping the bulk of the board. The amount of wood flour addition should be controlled based on the intensity of the wet pressing pressure and the properties of the wood flours. Addition of cationic starch to the wood flour containing OCC furnish showed synergic increase of solid content and strength properties. Shapes of the wood flours such as spherical and rod type added to OCC furnish affected largely their solid content, drainage, and board physical properties.

An experimental study on the arc stability improvement of underwater wet welding with flux ingredients (피복성분에 의한 수중용접봉의 아크안정성 개선에 관한 실험연구)

  • 김복인;정교헌;김민남
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2001.05a
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    • pp.276-281
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    • 2001
  • Wet Underwater arc welding process is inverstigated by using experimentally developed flux coated underwater arc welding electrode and SS400 steel plate of 12mm thickness as base metal. Two kinds of different flux covered wet arc welding electrode of 3.2mm diameter (UW-1, UW-2) are individually developed and one of the improved underwater welding electrode (UW-2) may be put to practical use for underwater arc welding process.

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Multilayer Coatings on Flexible substrate for Electromagnetic Shielding by Using Dry/Wet Hybrid Processes (건습식 혼합공정을 이용한 유연소재 상 전자파 차폐용 다층막 코팅)

  • Lee, Hoon-Seung;Lee, Myeong-Hoon
    • Journal of Surface Science and Engineering
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    • v.50 no.5
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    • pp.373-379
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    • 2017
  • Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared $2{\mu}m$ Zn/Cu/Ni multilayers coated on $12{\mu}m$ polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around $0.2{\Omega}$ by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.

Fabrication of $BaTiO_3-PTCR$ Ceramic Resister Prepared by Direct Wet Process (습식 직접합성법을 이용한 PTCR 소자개발 연구)

  • 이경희;이병하;이희승
    • Journal of the Korean Ceramic Society
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    • v.22 no.4
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    • pp.61-65
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    • 1985
  • $BaTiO_3$ powders doped with $BaTiO_3$ and $Nb_2O_5$ at 9$0^{\circ}C$ for 1hr. were synthesized by Direct Wet Process. These powders were very homogeneous and fine particle size. To obtain the highe PTCR effect AST($1/3Al_2O_3$.$3/4SiO_2$.$1/4TiO_2$) and $MnO_2$ were added in the semiconduc-ting $BaTiO_3$. In this case $Bi_2O_3$ and $MnO_2$ were used in the form of $Bi(NO)_3$ and $MnCl_2$.$4H_2O$ solution for Direct Wet Process. $BaTiO_3$ doped Nb2O5 and $MnO_2$ demostrated greater PTCR effect than $BaTiO_3$ doped $Nn_2O_5$ only.

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