• Title/Summary/Keyword: Wet etching time

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Dry-etch Characteristics of InP/InGaAsP Photonic Crystal Structure (InP/InGaAsP 광자결정 구조 제작을 위한 건식 식각 특성)

  • Lee, Ji-Myon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.12
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    • pp.1271-1276
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    • 2004
  • Two-dimensionally arrayed nanocolumn lattices were fabricated by using double-exposure laser holographic method. The hexagonal lattice was formed by rotating the sample with 60 degree while the square lattice by 90 degree before the second laser-exposure. The reactive ion etching for a typical time of 30 min using CH$_4$/H$_2$ plasma enhanced the aspect-ratio by more than 1.5 with a slight increase of the bottom width of columns. The etch-damage was observed by photoluminescence (PL) spectroscopy which was removed by the wet chemical etching using HBr/$H_2O$$_2$/$H_2O$ solution, leading into the enhanced PL intensities of the PCs.

A Study on dry decapsulation by Using a UV Laser (자외선 레이저를 이용한 건식디캡슐레이션에 관한 연구)

  • Hong, Y.S.;Kim, J.B.;Seo, M.H.;Choi, J.H.;Yoon, M.K.;Nam, G.J.
    • Laser Solutions
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    • v.11 no.1
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    • pp.7-11
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    • 2008
  • Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

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Double Textured AZO Film and Glass Substrate by Wet Etching Method for Solar Cell Application

  • Jeong, Won-Seok;Nam, Sang-Hun;Bu, Jin-Hyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.594-594
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    • 2012
  • Al doped ZnO (AZO) thin films were deposited on textured glass substrate by magnetron sputtering method. Also, AZO films on textured glass were etched by hydrochloric acid (HCl). Average thickness of etched AZO films are 90 nm. We observed morphology of AZO film by AFM with various etchant concentration and etching time. Etched AZO films have low resistivity and high haze. The surface RMS roughness of AZO film was increased from 53.8 nm to 84.5 nm. The haze ratio was also enhanced in above 700 nm of wavelength due to light trapping effect was increased by rough AZO surface. The etched AZO films on textured glass are applicable to fabricate solar cell.

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Fabrication of Ordered Nanoporous Alumina Membrane by PDMS Pre-Patterning

  • Kim, Byeol;Lee, Jin-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.265.1-265.1
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    • 2013
  • Nanoporous anodic aluminum oxide (AAO), a self-ordered hexagonal array has various applications for nanofabrication such as nanotemplate, and nanostructure. In order to obtain highly-ordered porous alumina membranes, Masuda et al. proposed a two-step anodization process however this process is confined to small domain size and long hours. Recently, alternative methods overcoming limitations of two-step process were used to make prepatterned Al surface. In this work, we confirmed that there is a specific tendency used a PDMS stamp to obtain a pre-patterned Al surface. Using the nanoindentaions of a PDMS stamp as chemical carrier for wet etching, we can easily get ordered nanoporous template without two-step process. This chemical etching method using a PDMS stamp is very simple, fast and inexpensive. We use two types of PDMS stamps that have different intervals (800nm, 1200nm) and change some parameters have influenced the patterning of being anodized, applied voltage, soaking and stamping time. Through these factors, we demonstrated the patterning effect of large scale PDMS stamp.

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EFFECTS OF VARIOUS ETCHING TIMES ON DEPTH OF ETCH AND SHEAR BOND STRENGTH OF AN ORTHODONTIC RESIN TO BOVINE ENAMEL (부식시간이 소의 법랑질 부식깊이와 교정용 레진의 전단결합강도에 미치는 영향)

  • Kim, Jeong-Hoon;Lee, Ki-Soo;Park, Young-Guk
    • The korean journal of orthodontics
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    • v.23 no.1 s.40
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    • pp.75-88
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    • 1993
  • Recent reports indicate that shorter etching times than 60 seconds can be adopted without affecting the bond strength and clinical disadvantages. The purpose of this in vitro study was to compare the shear bone strength and to measure depth of etch at different etching time length. One hundred and eight extracted bovine lower central incisors were embedded each in a tooth cup with cold-cure acrylic resin. The facial surfaces of the teeth were ground wet with 600-, 800-, 1000-, and 1200-grit Sic papers, and finally polished with a water slurry of extrafine silicon carbide powder, washed with tap water, and dried with hot air. Nine groups of nine prepared teeth were etched with a commercial($38\%$ phosphoric acid solution) for 0, 5, 10, 15, 20, 30, 60, 90, and 120 seconds, respectively, rinsed with tap water, and dried with hot air. One conditioned teeth from every group was selected randomly for the scanning electron microscopic examination, and the remaining eight teeth of the groups were used for measuring the push shear bond strength after bonding brackets and immensing them in the $36.5^{\circ}C$ water for 24 hours. Another nine groups of three teeth were used for measuring the depth of etch and surface roughness with a surface profilometer. after pieces of adhesive tape of 3mm inner diameter positioned on the ground enamel surfaces, and etched with the above mentioned. The data obtained form the above expeiments were analysed statistically with one way ANOVA and Dunkan's multiple range test with the $95\%$ confidence level. The results and conclusion of the study were as follows; 1. The results of shear bond strength for the given experimental etching times were not statistically different, but showed the tendency of decreasing shear bone strength after over 60 seconds etching times. 2. On the scanning election microscopic examination, it was observed that the morphological patterns of etched enamel surface for 5 to 20 seconds were similar and consitent, and those for 30 to 120 seconds showed increasing over-etched patterns depending on the length of etching times. 3. The depth of etch was increased almost proportionally by the length of etching times, but it was not associated with the shear bond strength. 4. The surface roughness increased depending on the length of etching times, but it was not associated with the shear bond strength. 5. This experiment indicated that proper etching time with $38\%$ phosphoric acid solution is in the range of 5 to 30 seconds.

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Dry Etching Using Atmospheric Plasma for Crystalline Silicon Solar Cells (대기압 플라즈마를 이용한 결정질 태양전지 표면 식각 공정)

  • Hwang, Sang Hyuk;Kwon, Hee Tae;Kim, Woo Jae;Choi, Jin Woo;Shin, Gi-Won;Yang, Chang-Sil;Kwon, Gi-Chung
    • Korean Journal of Materials Research
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    • v.27 no.4
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    • pp.211-215
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    • 2017
  • Reactive Ion Etching (RIE) and wet etching are employed in existing texturing processes to fabricate solar cells. Laser etching is used for particular purposes such as selective etching for grooves. However, such processes require a higher level of cost and longer processing time and those factors affect the unit cost of each process of fabricating solar cells. As a way to reduce the unit cost of this process of making solar cells, an atmospheric plasma source will be employed in this study for the texturing of crystalline silicon wafers. In this study, we produced the atmospheric plasma source and examined its basic properties. Then, using the prepared atmospheric plasma source, we performed the texturing process of crystalline silicon wafers. The results obtained from texturing processes employing the atmospheric plasma source and employing RIE were examined and compared with each other. The average reflectance of the specimens obtained from the atmospheric plasma texturing process was 7.88 %, while that of specimens obtained from the texturing process employing RIE was 8.04 %. Surface morphologies of textured wafers were examined and measured through Scanning Electron Microscopy (SEM) and similar shapes of reactive ion etched wafers were found. The Power Conversion Efficiencies (PCE) of the solar cells manufactured through each process were 16.97 % (atmospheric plasma texturing) and 16.29 % (RIE texturing).

Facile Synthesis of Vertically Aligned CdTe-Si Nanostructures with High Density (수직배양된 고집적 CdTe-Si 나노구조체의 제조방법)

  • Im, Jinho;Hwang, Sung-hwan;Jung, Hyunsung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.3
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    • pp.185-191
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    • 2017
  • Cadmium compounds with one dimension (1D) nanostructures have attracted attention for their excellent electrical and optical properties. In this study, vertically aligned CdTe-Si nanostructures with high density were synthesized by several simple chemical reactions. First, l D Te nanostructures were synthesized by silver assisted chemical Si wafer etching followed by a galvanic displacement reaction of the etched Si nanowires. Nanowire length was controlled from 1 to $25{\mu}m$ by adjusting etching time. The Si nanowire galvanic displacement reaction in $HTeO_2{^+}$ electrolyte created hybrid 1D Te-branched Si nanostructures. The sequential topochemical reaction resulted in $Ag_2Te-Si$ nanostructures, and the cation exchange reaction with the hybrid 1D Te-branched Si nanostructures resulted in CdTe-Si nanostructures. Wet chemical processes including metal assisted etching, galvanic displacement, topochemical and cation exchange reactions are proposed as simple routes to fabricate large scale, vertically aligned CdTe-Si hybrid nanostructures with high density.

Study on the Micro Channel Assisted Release Process (미세 유체통로를 이용한 대면적 평판 구조의 부양에 관한 연구)

  • Kim, Che-Heung;Lee, June-Young;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2001.07c
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    • pp.1924-1926
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    • 2001
  • A novel wet release process ($\mu$ CARP - Micro Channel Assisted Release Process) for releasing an extreme large-area plate structure without etching hole is proposed and experimented. Etching holes in conventional process reduce a effective area and degrade an optical characteristics by a diffraction. In addition, as the area of a released structure increases, the stietion becomes more serious. The proposed process resolves these problems by the introduction of a micro fluidic channel beneath the structure which will be released. In this paper, a 5 mm${\times}$5mm-single crystal silicon plate structure was released by the proposed $\mu$CARP without etch holes on the structure. The variation in etching time with respect to the of the introduced micro channel is also examined. This process is expected to be beneficial for the actuator of a nano-scale data storage and the scanning mirror.

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Effect of Plasma Treatment on Permeability and Selectivity Characteristics of Mixture Gas through Polyimide Membrane (플라즈마 처리된 폴리이미드 막의 기체투과특성)

  • 배성렬;노상호;류대선;박희진
    • Membrane Journal
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    • v.11 no.1
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    • pp.38-49
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    • 2001
  • The surface of polyimide membrane was modified by plasma treatment using Ar and NH~. and the permeability and selectivity for the mixture gas $(CO_2/N_2=20/80 vol%)$ were measured. The per¬meation experiments were performed by a variable volume method at $30^{\circ}$C and total pressure of 5 atm, The effect of the plasma conditions such as treatment time, power input, gas flow rate and pressure in the reactor on the transport Dwperties of modified membranes was investigated. The surface of the plasma treated membrane was analyzed by means of FTlR - ATH, ESCA and AFM. The dependences of the wettability and the etching on plasma treatment time were investigated by use of the contact angle and the weight loss measurement. Measurements of gas pcnneability characteristic were performed using both dry and wet membranes. The effects of experimental conditions such as temperature on the membrane performance were studied.

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Effect of Surface Microstructure of Silicon Substrate on the Reflectance and Short-Circuit Current (실리콘 기판 표면 형상에 따른 반사특성 및 광 전류 개선 효과)

  • Yeon, Chang Bong;Lee, Yoo Jeong;Lim, Jung Wook;Yun, Sun Jin
    • Korean Journal of Materials Research
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    • v.23 no.2
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    • pp.116-122
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    • 2013
  • For fabricating silicon solar cells with high conversion efficiency, texturing is one of the most effective techniques to increase short circuit current by enhancing light trapping. In this study, four different types of textures, large V-groove, large U-groove, small V-groove, and small U-groove, were prepared by a wet etching process. Silicon substrates with V-grooves were fabricated by an anisotropic etching process using a KOH solution mixed with isopropyl alcohol (IPA), and the size of the V-grooves was controlled by varying the concentration of IPA. The isotropic etching process following anisotropic etching resulted in U-grooves and the isotropic etching time was determined to obtain U-grooves with an opening angle of approximately $60^{\circ}$. The results indicated that U-grooves had a larger diffuse reflectance than V-grooves and the reflectances of small grooves was slightly higher than those of large grooves depending on the size of the grooves. Then amorphous Si:H thin film solar cells were fabricated on textured substrates to investigate the light trapping effect of textures with different shapes and sizes. Among the textures fabricated in this work, the solar cells on the substrate with small U-grooves had the largest short circuit current, 19.20 mA/$cm^2$. External quantum efficiency data also demonstrated that the small, U-shape textures are more effective for light trapping than large, V-shape textures.