• 반도체디스플레이기술학회지
• /
• 제10권3호
• /
• pp.15-19
• /
• 2011

The performance of the DRAM is strongly dependent on the purity and surface roughness of the TIT (TiN/Insulator/ TiN) capacitor electrodes. Hence, in the present study, we evaluate the effects of organic contamination and change of surface roughness on the cylindrical TIT capacitor electrodes during the wet cleaning process by various analytical techniques such as TDMS, AFM, XRD and V-SEM. Once the sacrificial oxide and PR (Photo Resist) are removed by HF, the organic contamination and surface oxide films on the bottom Ti/TiN electrode become visible. With prolonged HF process, the surface roughness of the electrode is increased, whereas the amount of oxidized Ti/TiN is reduced due to the HF chemicals. In the 80nm DRAM device fabrication, the organic contamination of the cylindrical TIT capacitor may cause defects like SBD (Storage node Bridge Defect). The SBD fail bit portion is increased as the surface roughness is increased by HF chemicals reactions.

• 한국의류학회지
• /
• 제47권2호
• /
• pp.353-370
• /
• 2023

In this study, the performance of ultrasonic cleaners for ultrasonic washing, which is one of the wet cleaning methods, was evaluated. The washing performances of ultrasonic cleaners were compared with commercial washing machines under normal and wool courses based on different parameters such as detergency, wrinkle formation, fabric damage, dimensional stability, and germ removal ability. Cotton, silk and wool were used in this experiment. Results revealed that the ultrasonic washing detergency of cotton fabrics was lower than that of commercial washing machines under the normal course and similar to that of commercial washing machines under the wool course. Detergency of silk fabrics was similar under both normal and wool courses. In terms of wrinkle formation and dimensional stability, ultrasonic cleaners showed lesser wrinkles and lower shrinkage than commercial washing machines. Considering damage evaluation, ultrasonic cleaners more effectively removed soil without damaging fabrics compared with commercial washing machines. The bacteria removal rate of both cotton and silk was more effective than the wool course of a commercial washing machine. Thus, this study compares the performance of ultrasonic cleaners and commercial washing machines and provides meaningful results related to ultrasonic washing performance.

• 한국항해항만학회지
• /
• 제40권1호
• /
• pp.1-6
• /
• 2016

본 연구에서는 선박에서 발생하는 대기오염물질을 처리하기 위해 사용되는 습식 스크러버를 이용한 배기가스 세정시스템(EGCS: Exhaust Gas Cleaning System)에서 발생되는 폐수를 재이용 할 수 있는 순환시스템을 개발하기 위해 진행되었다. 선박 배기가스 DePM, DeSOx 순환처리장치 (Recycle system)의 세정수의 입자성물질과 분산유를 효과적으로 제거할 수 있는 수 처리 시스템을 개발한 결과 원심분리형 Purifier만으로는 미세한 분산유의 처리가 어렵다는 결과가 도출되어 원심분리형 Purifier 후처리로 유수분리 경사 분리판을 이용한 유수분리기의 일종인 Coalescer를 본 시스템에 적용하였다. Coalescer는 2차 분산 상태의 에멀젼화 된 미세 기름입자를 합착시켜 분리하는 기술이다. 선박 배기가스 DePM, DeSOx 순환처리장치 (Recycle system)에서 배출되는 세정수를 Purifier와 Coalescer를 이용하여 처리한 결과 입자성물질은 55% 분산유는 유입수 대비 99%이상 처리되는 것을 확인하였다. 따라서 선박 대기오염 저감을 위한 습식세정탑 시스템에 본 세정수 처리시스템을 도입하면 세정수로서 재사용이 가능하다고 판단된다.

• 한국분무공학회지
• /
• 제12권4호
• /
• pp.185-190
• /
• 2007

There is a growing interest to develop a new cleaning technology to overcome the disadvantages of wet cleaning technologies such as environmental pollution and the cleaning difficulty of contaminants on integrated circuits. Laser cleaning is a potential technology to remove various pollutants on a wafer surface. However, there is no fundamental data about cleaning efficiencies and cleaning mechanisms of contaminants on a wafer surface using a laser cleaning technology. Therefore, the cleaning characteristics of a wafer surface using an excimer laser were investigated in this study. Fingerprint consisting of inorganic and organic materials was chosen as a representative of pollutants and the effectiveness of a laser irradiation on a wafer cleaning has been investigated qualitatively and quantitatively. The results have shown that cleaning degree is proportional to the laser irradiation time and repetition rate, and quantitative analysis conducted by an image processing method also have shown the same trend. Furthermore, the cleaning efficiency of a wafer contaminated by fingerprint strongly depended on a photothermal cleaning mechanism and the species were removed in order of hydrophilic and hydrophobic contaminants by laser irradiation.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2013년도 춘계학술대회 논문집
• /
• pp.1005-1006
• /
• 2013

• Tribology and Lubricants
• /
• 제31권6호
• /
• pp.239-244
• /
• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

• 한국의류학회지
• /
• 제36권2호
• /
• pp.127-137
• /
• 2012

This study focuses on the optimal washing conditions for dry cleaning recommended fabrics to minimize dimensional changes using wet cleaning. We suggest water-based alternatives to a perchloroethylene based cleaning process. Wool and rayon fabrics were laundered under various washing conditions and then air-dried for 24hrs. All specimens were extended after spinning and shrunk after drying. This is probably because the fibers were swollen and extended by wetting. The wool fabrics were shown to be acutely influenced by washing temperature and mechanical force. The optimal washing conditions for wool fabric to minimize the dimensional change implied a normal washing temperature and minimized mechanical force. For rayon specimens, dimensional change by a hand wash showed a remarkable decrease compared with a machine wash. Rayon fabric seemed to be influenced by the quantity of water contained in the fabric after spinning and washing time. Therefore, the desirable washing conditions for rayon fabric are to reduce the time required for washing and to increase the spin speed.

• 전자공학회논문지A
• /
• 제30A권11호
• /
• pp.99-104
• /
• 1993

We analyzed the D.I. water used in wet cleaning process of semiconductor device manufacturing both at the D.I. water plant and at the wafer cleaning bath to detect the impurity source of D.I. water contamination. This shows that the quantity of impurity is related to the resistivity of D.I. water, and we found that the cleanliness of the wafer surface processed in D.I. water bath was affected by the degree of the ionic impurity contamination. So we evaluated the cleaning effect as different method for Fe ion, having the best adsoptivity on wafer surface. Moreover the temperature effect of the D.I. water is investigated in case of anion in order to remove the chemical residue after wet process. In addition to the control of D.I. water resistivity, chemical analysis of impurity control in D.I. water should be included and a suitable cleaning an drinsing method needs to be investigated for a high yielding semiconductor device.

• 복식
• /
• 제65권7호
• /
• pp.47-59
• /
• 2015

This paper studies the conservation treatment of Lady Shim's costume, which was excavated in Jecheon Province in 2012. There were the significant problems, which were encountered in the treatment of the costume ; First the Jeogoris were transformed during the excavation, Second fibers were seriously deteriorated, Third most of the fabrics such as Chusa were readily deformed. To overcome these problems and to secure stability in the conservation treatment, we decided to alternate between two different washing methods ; dry cleaning by n-hexane and wet cleaning by water. The costume shape was recovered by steaming and by swelling with Hanji(Korean traditional paper). The combined cleaning method proved to be relatively efficient and stable. In addition, the shape of Chusa was well preserved by dry cleaning.(using n-hexane also solved the problem of bad smell after washing with organic solvents.) The effects of the conservation treatment on the excavated costumes could be seen in the change of Lab color difference. Washing made the distribution of Lab color difference narrower, which may suggest that the impurities on the fiber was removed by washing. In addition, the value of L was greater than a-value and b-value after the treatment. This result indicates that the change of value represents the change of color difference by cleaning.

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2010년도 추계학술대회 초록집
• /
• pp.48.1-48.1
• /
• 2010

단결정 실리콘 태양전지 제조 공정이 진행되는 과정에서 각종 오염물에 의해 표면이 오염된다. 태양전지의 효율 개선을 위한 표면 texturing 공정은 주로 wet etch을 주로 사용한다. Wet etch 공정 시 주로 사용되는 KOH 용액은 texturing 후 실리콘 웨이퍼 표면에 K+ 이온을 남기고 이는 태양전지 표면에서의 불순물로 작용하여 효율을 저하시키는 요인이 된다. 이를 제거하기 위해 불산 및 오존에 의한 세정 공정이 추가로 필요로 하게 된다. 이러한 공정을 최소화 하며 잔존하는 알칼리 금속도 제거하기 위해, etchant로 알카리 용액이 아닌 ethylenediamine을 사용하여 texturing 후 KOH 용액과 비교해 보았다.