• Journal of the Korean Electrochemical Society
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• v.11 no.2
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• pp.100-104
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• 2008

Titanium sheet metal substrates used in thin film batteries were wet etched and their surface area was increased in order to increase the discharge capacity and power density of the batteries. To obtain a homogeneous etching pattern, we used a conventional photolithographic process. Homogeneous hemisphere-shaped wells with a diameter of approximately $40\;{\mu}m$ were formed on the surface of the Ti substrate using a photo-etching process with a $20\;{\mu}m{\times}20\;{\mu}m$ square patterned photo mask. All-solid-state thin film cells composed of a Li/Lithium phosphorous oxynitride (Lipon)/$LiCoO_2$ system were fabricated onto the wet etched substrate using a physical vapor deposition method and their performances were compared with those of the cells on a bare substrate. It was found that the discharge capacity of the cells fabricated on wet etched Ti substrate increased by ca. 25% compared to that of the cell fabricated on bare one. High discharge rate was also able to be obtained through the reduction in the internal resistance. However, the cells fabricated on the wet etched substrate exhibited a higher degradation rate with charge-discharge cycling due to the nonuniform step coverage of the thin films, while the cells on the bare substrate demonstrated a good cycling performance.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.4
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• pp.5-12
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• 2015

In recent years, it had focused on the improvement of paper properties by addition of NFC (Nano-fibrillated Cellulose). Although the addition of NFC to wet-end of papermaking process could be suggested as a new solution to improve the strength properties of paper, it was not possible to avoid the bad drainage caused by the added NFC's chocking pores of wet web. Instead of the direct addition to wet-end, spraying of NFC to web in wire-section was tried in this study and evaluated by checking various paper properties including surface smoothness, tensile strength, folding endurance and stiffness. According to the increase of spraying amount of NFC, above mentioned paper properties were enhanced without excessive deterioration of drainage. Compared with direct introduction to wet-end, spraying could be regarded as a more proper method to enhance the surface smoothness and strength properties of paper.

• Journal of Powder Materials
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• v.16 no.2
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• pp.122-130
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• 2009

Austenitic oxide-dispersion-strengthened (ODS) stainless steel was fabricated using a wet mixing process without a mechanical milling in order to reduce contaminations of impurities during their fabrication process. Solution of yttrium nitrate was dried after a wet mixing with 316L stainless steel powder. Carbon and oxygen contents were effectively reduced by this wet processing. Microstructural analysis showed that coarse yttrium silicates of about 150 nm were formed in austenitic ODS steels with a silicon content of about 0.8 wt%. Wet-processed austenitic ODS steel without silicon showed higher yield strength by the presence of finer oxide of about 20 nm.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.57-62
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• 2015

The wet brakes used on a forklift often produce noise upon engagement. The elimination or reduction of this squeal noise is an important task for the improvement of the comfort of those operating these machines. In this paper, a test rig was developed for the testing of brake noise, and the squeal noise was measured with this apparatus. Automatic transmission fluid and grooves in the material of the friction-plate pad were found to be the main factors causing squeal noise. In order to identify the characteristics of this type of noise, signal analyses of the noise were conducted using different frequency spectra. The experimental results showed that the viscosity of the automatic transmission fluid and the groove pattern on the friction-plate pad largely affected the reduction of the wet brake squeal noise made by an industrial forklift.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.193-201
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• 2011

Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.

• Journal of the Semiconductor & Display Technology
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• v.4 no.3 s.12
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• pp.29-33
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• 2005

As the integrated devices become more and more sophistcated, the diameter of wafers increased up to 300 mm and strict level of cleaning is necessary to remove the particulates on the surface of wafer. Therefore we need a new type of wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is important to control the temperature and the concentration of chemical in the wet-station. In the conventional chemical supply system, it is difficult not only to fit the mixing rate of chemicals in cleaning process, but also to fit the quantity and temperature. Thus, we propose a new chemicals supply system, which overcomes above problems by the analysis of fluid and thermal transfer on chemical supply system.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.17-21
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• 2016

EUV (Extreme Ultraviolet) pellicle which protects a mask from contamination became a critical issue for the application of EUV lithography to high-volume manufacturing. However, researches of EUV pellicle are still delayed due to no typical manufacturing methods for large-scale EUV pellicle. In this study, EUV pellicle membrane manufacturing method using not only KOH (potassium hydroxide) wet etching process but also a water bath was suggested for uniform etchant temperature distribution. KOH wet etching rates according to KOH solution concentration and solution temperature were confirmed and proper etch condition was selected. After KOH wet etching condition was set, $5cm{\times}5cm$ SiNx (silicon nitride) pellicle membrane with 80% EUV transmittance was successfully manufactured. Transmittance results showed the feasibility of wet etching method with water bath as a large-scale EUV pellicle manufacturing method.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.91-96
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• 2017

In this computational study of optical fiber manufacturing, WOW (wet-on-wet) double coating process on freshly drawn glass fiber has been numerical modelled and simulated using a simplified geometry of typical optical fiber coating apparatus. The numerical domain includes primary and secondary coating dies along with secondary coating cup and the interface between primary and secondary coating liquids are investigated using level set method. Coating liquid viscosity is an important parameter and its dependence on temperature is also considered. Since there would be possibility for pressure and temperature of primary coating liquid to be increased substantially at high fiber drawing speed, the effects of increased pressure and temperature of primary coating liquid are examined on flow patterns of coating liquids in secondary coating cup. In case that both pressure and temperature of primary coating liquid are high enough, liquid interface becomes noticeably unstable and this flow instability could adversely affect the uniform coatings and final quality of produced optical fiber.

• Laser Solutions
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• v.12 no.4
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• pp.1-5
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• 2009

Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.

• Cement
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• s.58
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• pp.45-55
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• 1975