• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.168-172
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• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.99-103
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• 2021

Warpage defect detecting of scaffold is very important in biosensor production. Because warpaged scaffold cause problem in cell culture. Currently, there is no detection equipment to warpaged scaffold. In this paper, we produced detection model for shape warpage detection using deep learning based CNN. We confirmed the shape of the scaffold that is widely used in cell culture. We produced scaffold specimens, which are widely used in biosensor fabrications. Then, the scaffold specimens were photographed to collect image data necessary for model manufacturing. We produced the detecting model of scaffold warpage defect using Densenet among CNN models. We evaluated the accuracy of the defect detection model with mAP, which evaluates the detection accuracy of deep learning. As a result of model evaluating, it was confirmed that the defect detection accuracy of the scaffold was more than 95%.

• Transactions of Materials Processing
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• v.10 no.6
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• pp.493-499
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• 2001

An optimal robust design methodology has been developed to minimize warpage in injection-molded pats. The response surface methodology was applied to obtain a functional relationship between design variables and warpage value, and the modified complex method was used as an optimization tool to search for an optimal design solution over prescribed design region. To attain robustness against process variations, Taguchi's SN ratio was introduced as the design metric. The proposed optimal design procedure was applied to an actual part, the Guide-ASF model of a fax machine, and the usefulness of the methodology was shown through the CAE simulation using a commercial injection molding software package.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.811-814
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• 2001

Warpage analysis of bobbin, molded by injection molding process was performed. Concerned with a mold design, cooling system was designed based on Taguchi method, the distance between cavity wall and cooling channel was most influent factor amongst four design variables like an inlet temperature of coolant, a coolant flow rate, a diameter of cooling channel, and the distance between cavity wall and cooling channel. Optimal packing processes to reduce the warpage of molded part was analyzed based on the response surface method by considering holding pressure. Their optimal processing conditions were 9.4 seconds, 5.3 seconds, 15.2 seconds, and 85MPa, respectively.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.136-142
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• 1999

The injection molded part shrinks in the process of solidification by the amount of the coefficient of linear thermal expansion multiplied by the temperature difference between the coefficient of linear thermal expansion multiplied by the temperature difference between the room temperature and the temperature at which the solid structure is formed in the mold And it is called warpage for this type of deformation that shrinkage are not uniform throughout the injection molded part. To predict warpage phenomena in the articles the results obtained theoretically from the change of mold temperature fiber content of composites have been compared with exsperimental results.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.1-8
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• 2017

Warpage is a major defect frequently found in the injection molding process, and the reduction of warpage is a very challenging problem because of the uncontrollable factors, such as variations in the process parameters. Without any countermeasure against these noises, attempts to reduce the defects often lead to failure. In this research, a new robust design methodology, based on the Mahalanobis Taguchi System (MTS) to reduce warpage, is presented. The MTS performs the orthogonal array experiments and uses the signal-to-noise (SN) ratio of the Mahalanobis distance as a performance metric. The validity of the proposed method is illustrated through an optimal design of the injection molding process of a CPU base plate.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.766-771
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• 2000

As using of insulating material of plastic to industrial electric field, thermoset has been gradually substituted for thermoplastic. But changing the material with crystalline has some problem, which is strength or warpage, Especially getting a strength to endure inner pressure is necessary when arc is occurred. So we use the material that is composed of glass fiber to compensate strength. By the way as the reinforced glass-fiber material is used in injection molding, unstableness of dimension is appeared frequently and it is difficult to know warpage pattern. So this paper will be contributed to know warpage pattern of mold product that is upper frame of magnetic contactor caused by glass-fiber orientation with fixed gate-system, when glass-fiber reinforced material with classification of poly-amide is used in injection molding.

• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.1-5
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• 2016

3D printer is the equipment of the system for sequentially layer laminated in the materials. Now 3D printer used in various fields such as, semiconductor, electricity automobile, medical and various types of output method and material. In this paper, we studied about the improvement on warpage due to shrinkage of product from 3D printer of FDM(Fused Deposition Modeling) type, we proposed measures systematically to solve warpage problem using of 6SC(6 Step Creativity) method of practical TRIZ. After experimented with product prototypes experiment, we verified effect about solution.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.6
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• pp.139-144
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• 2014

As a result of a mismatch of the residual stress between both sides of the silicon wafer, which warps and distorts during the patterning process. The accuracy of the warpage measurement is related to the calibration. A CCD camera was used for the calibration. Performing optimization of the error function constructed with phase values measured at each pixel on the CCD camera, the coordinates of each light source can be precisely determined. Measurement results after calibration was performed to determine the warpage of the silicon wafer demonstrate that the maximum discrepancy is $5.6{\mu}m$ with a standard deviation of $1.5{\mu}m$ in comparison with the test results obtained by using a Form TalySurf instrument.